An alignment mechanism is disclosed which includes a mount, a beam having a first end affixed to the mount and a second end. The beam is an order of magnitude more rigid along its longitudinal axis than along an axis orthogonal to its longitudinal axis. The second end of the beam is affixed to a first device having a surface configured to contact a second device. The beam applies a normal force component to the second device through the first device and allows movement at the second end in directions orthogonal to the normal force component.

A heat dissipation system includes an accommodation device, a collection device, and a control device. The accommodation device stores a first liquid. The first liquid converts to a first gas when satisfying a first temperature condition. An electronic apparatus is arranged in the first liquid, the first liquid doe not affect an operation of the electronic apparatus and converts to the first gas through heat generated by the electronic apparatus. The first temperature condition changes as an air pressure in the accommodation device changes. The collection device is configured to collect a parameter that indicates the air pressure in the accommodation device. The control device is configured to determine and execute a control instruction according to the parameter. The control instruction includes an instruction used to adjust the air pressure in the accommodation device.

A liquid cooling heat exchange apparatus for memory modules comprising a thermal conduction assembly, fastening assembly, and first and second working fluid splitters is provided. The thermal conduction assembly, mounted on the memory nodules via the fastening assembly, comprises a pair of flat flexible conduits, each having at least one fluid passageway communicating with the first and second working fluid splitters, and a pair of cooling spreaders. The pair of flat flexible conduits is in thermal contact with heat producing chips of the memory modules, thermally coupling the first and second working fluid splitters together for transferring heat from the heat producing chips. The pair of cooling spreaders is in thermal contact with the pair of flat flexible conduits for transferring heat from the heat producing chips to the thermal conduction assembly. Each of the at least one fluid passageway is expandable.

The present invention relates to a heat exchanger for cooling an electrical device, and more specifically, to a heat exchanger for cooling an electrical device, in which the tube-type cooling path parts may be coupled in multi-stages, the assembling of the electrical device and the cooling path part during the multi-stage coupling is easy, and cooling of both surfaces of the electrical device is possible through tight coupling between the electrical device and the cooling path part.

Heatsink has a plurality of cross-connected pathways that create areas of turbulent airflow which is useful for quickly dissipating heat in the heatsink. The cross-connected pathways can include vertically extending pathways that extend from the baseplate to the top surface of the single piece of material with an increasing volume away from the baseplate toward the top surface of the single piece of material and horizontally extending pathways are oriented in a plurality of rows where a diameter of the horizontally extending pathways increases in each row of the plurality of rows from the baseplate.

The invention relates to a cooling system for a computer system, said computer system comprising at least one unit such as a central processing unit (CPU) generating thermal energy and said cooling system intended for cooling the at least one processing unit and comprising a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing unit to the cooling liquid. The cooling system has a heat exchanging interface for providing thermal contact between the processing unit and the cooling liquid for dissipating heat from the processing unit to the cooling liquid. Different embodiments of the heat exchanging system as well as means for establishing and controlling a flow of cooling liquid and a cooling strategy constitutes the invention of the cooling system.

Multilayered or multitiered structures formed by stacking of vertically aligned carbon nanotube (CNT) arrays and methods of making and using thereof are described herein. Such multilayered or multitiered structures can be used as thermal interface materials (TIMs).

A heat exchange device includes a heat exchanger and two pumps. The heat exchanger defines a heat exchange pathway, an inflow pathway communicated with the heat exchange pathway for guiding a cooling liquid to flow into the heat exchange pathway, and an outflow pathway opposite to the inflow pathway for guiding the cooling liquid to flow out from the heat exchange pathway. Each of the pumps includes a case body defining a flow-guiding chamber communicated with and disposed between the heat exchange pathway and the outflow pathway, a rotor mounted in the flow-guiding chamber, and a stator mounted to the case body for driving rotation of the rotor, facilitating flowing movement of the cooling liquid toward the outflow pathway.

A heat sink includes a bottom plate, a liquid barrier structure and a microstructure used for heat dissipation. The liquid barrier wall is arranged on the bottom plate. The liquid barrier wall is closed on the bottom plate to form a container. The microstructure for heat dissipation is arranged in the container and includes porous materials or 3D-structures with small sizes.

Systems and techniques are described that provide for enhanced gain and radiation characteristics of antennas. The systems and techniques employ layers or cards of fractal plasmonic surfaces to provide gain to the antennas. The fractal plasmonic surfaces each include a close-packed arrangements of resonators having self-similar or fractal shapes, which may be referred to as “fractal cells.” The cards can be held by a frame adapted to fit an antenna. The FPS cards can provide benefits for gain, field emission, directivity, increased bandwidth, power delivery, and/or heat management. One or more dielectric layers or cards may be used to enhance gain and/or directivity characteristics.