Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.

An exemplary cooling system includes a heat transfer device having a base and a plurality of curved fins defining a curved air flow channel. Air flow is provided through the air flow channel, and a plurality of openings through a fin communicate air flow from a first side to a second side of the curved fin.

The invention relates to heat exchanger tube having a longitudinal tube axis; axially parallel or helically circumferential continuous fins are formed from the tube wall on the outer tube face and/or inner tube face, and continuous primary grooves are formed between adjacent fins; the fins have at least one structured zone on the outer tube face and/or inner tube face, said structured zone being provided with a plurality of projections which project from the surface an have a height such that the projections are separated by notches. According to the invention, the projections are arranged in groups which are periodically repeated along the extension of the fin. Furthermore, at least two notches between the projections within the group have a varying notch depth in a fin.

Systems according to the present disclosure provide one or more surfaces that function as power radiating surfaces for which at least a portion of the radiating surface includes or is composed of “fractal cells” placed sufficiently closed close together to one another so that a surface wave causes near replication of current present in one fractal cell in an adjacent fractal cell. The fractal cells may lie on a flat or curved sheet or layer and be composed in layers for wide bandwidth or multibandwidth transmission. The area of a surface and its number of fractals determines the gain relative to a single fractal cell. The boundary edges of the surface may be terminated resistively so as to not degrade the cell performance at the edges. The fractal plasmonic surfaces can be utilized to facilitate electrical conduction with lower ohmic resistance than would otherwise be possible in the absence of the fractal plasmonic surface(s) at the same temperature.

Systems according to the present disclosure provide one or more surfaces that function as power radiating surfaces for which at least a portion of the radiating surface includes or is composed of “fractal cells” placed sufficiently closed close together to one another so that a surface wave causes near replication of current present in one fractal cell in an adjacent fractal cell. The fractal cells may lie on a flat or curved sheet or layer and be composed in layers for wide bandwidth or multibandwidth transmission. The area of a surface and its number of fractals determines the gain relative to a single fractal cell. The boundary edges of the surface may be terminated resistively so as to not degrade the cell performance at the edges. The fractal plasmonic surfaces can be utilized to facilitate electrical conduction with lower ohmic resistance than would otherwise be possible in the absence of the fractal plasmonic surface(s) at the same temperature.

A loop type heat pipe includes: an evaporator configured to vaporize a liquid working fluid; a condenser configured to condense the vaporized working fluid into the liquid working fluid; a vapor pipe provided between the evaporator and the condenser; and a liquid pipe provided between the evaporator and the condenser. Each of the vapor pipe and the liquid pipe includes: a lower-side metal layer; an intermediate metal layer that is disposed on the lower-side metal layer; an upper-side metal layer that is disposed on the intermediate metal layer; and a conduit that is formed by the lower-side metal layer, the intermediate metal layer, and the upper-side metal layer, and at least one of the upper-side metal layer and the lower-side metal layer warps outward in a first portion of the vapor pipe.

A method of installing an asymmetric heat pipe in a heat sink includes providing an asymmetric heat pipe with additional material on one side; forming a cavity in a base of the heat sink leaving additional base material on the component side of the heat sink; inserting the asymmetric heat pipe in the cavity; and removing the additional material on the asymmetric heat pipe and the additional base material on the heat sink to form a smooth and substantially uniform contact surface on the component side. An apparatus includes a component; a heat sink with a cavity; and a flattened heat pipe inserted into the cavity; wherein the heat sink and the heat pipe have a smooth and substantially uniform surface on the side proximal to the component and the heat pipe has a thickness which is substantially the same size on a component side and an opposite side.

A heat dissipating fin assembly includes a bottom, a plurality of first heat dissipating fins, a plurality of second heat dissipating fins, an inner cover and an outer cover. The first heat dissipating fins extend from an inner end toward an outer end. The second heat dissipating fins are arranged between two of the first heat dissipating fins in staggered. The inner cover is disposed near the inner end and connected to the first heat dissipating fins. The outer cover is disposed near the outer end and connected to the second heat dissipating fins. The inner cover and the outer cover are separated to form an opening, and the dusts entering the heat dissipating fin assembly through the inner end are ejected via the opening. The second heat dissipating fins extend from around the opening to the outer end.

Devices, methods, and systems for facilitating heat transfer and cooling electronic components are presented. A system for cooling an electronic component includes a cold core, a plurality of solid state cooling devices, and a plurality of heat sinks. The cold core may define one or more cavities for receiving electronic components. The system may include an air mover and a duct. In operation, the system may cool an electronic component to sub-ambient temperatures. In other embodiments, the system may include multiple cold cores connected by liquid conduits for facilitating a flow of a cooling fluid.

A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.