Patent classifications
F28F13/00
Efficient self cooling heat exchanger
An inexpensive heat exchanger is disclosed, wherein the heat exchanger is made up of a plurality of plates and each plate has at least one channel defined in the plate. The plates are stacked and bonded together to form a block having conduits for carrying at least one fluid and where the exchanger includes an expansion device enclosed within the unit. The plates include construction to thermally insulate the sections of the heat exchanger to control the heat flow within the heat exchanger.
Efficient self cooling heat exchanger
An inexpensive heat exchanger is disclosed, wherein the heat exchanger is made up of a plurality of plates and each plate has at least one channel defined in the plate. The plates are stacked and bonded together to form a block having conduits for carrying at least one fluid and where the exchanger includes an expansion device enclosed within the unit. The plates include construction to thermally insulate the sections of the heat exchanger to control the heat flow within the heat exchanger.
Self-assembled or reconfigurable structures for heat flow control devices
Devices configured to direct heat flow are disclosed, as well as methods of forming thereof. A device may include a self-assembling heat flow object. The self-assembling heat flow object may include a material having one or more self-assembling properties that cause the material to react to an environmental stimulus and one or more thermal pathways. An application of the environmental stimulus causes the self-assembling heat flow object to deploy and arrange the one or more thermal pathways for directing thermal energy to one or more locations.
Self-assembled or reconfigurable structures for heat flow control devices
Devices configured to direct heat flow are disclosed, as well as methods of forming thereof. A device may include a self-assembling heat flow object. The self-assembling heat flow object may include a material having one or more self-assembling properties that cause the material to react to an environmental stimulus and one or more thermal pathways. An application of the environmental stimulus causes the self-assembling heat flow object to deploy and arrange the one or more thermal pathways for directing thermal energy to one or more locations.
HEAT EXCHANGER AND TURBINE ENGINE COMPRISING SUCH AN EXCHANGER
The invention relates to a heat exchanger (10) for heat-exchange between a first fluid and a second fluid, comprising a membrane separating the two fluids and a heat-conductive element (17) in thermal contact with the membrane and with the first fluid, characterised in that said heat-conductive element (17) moves between an active position and an inactive position, such that the capacity of heat exchange with the first fluid is weaker in the inactive position than in the active position. The exchanger is applied, in particular, for the cooling of fluid in the secondary stream of a turbofan.
HEAT EXCHANGER AND TURBINE ENGINE COMPRISING SUCH AN EXCHANGER
The invention relates to a heat exchanger (10) for heat-exchange between a first fluid and a second fluid, comprising a membrane separating the two fluids and a heat-conductive element (17) in thermal contact with the membrane and with the first fluid, characterised in that said heat-conductive element (17) moves between an active position and an inactive position, such that the capacity of heat exchange with the first fluid is weaker in the inactive position than in the active position. The exchanger is applied, in particular, for the cooling of fluid in the secondary stream of a turbofan.
Heat sink with slotted pin fins
The heat sink with slotted pin fins includes a thermally conductive base and a plurality of pin fins, which may be substantially cylindrical. Each pin fin has axially opposed upper and lower ends, the lower ends being attached to the base. Each of the pin fins is formed of a thermally conductive material and extends from the base. Each of the pin fins has a slot formed therein extending both diametrically and axially through the pin fin, such that a surrounding fluid medium can flow through the slot formed through pin fin, thus reducing the drag force on the surrounding fluid medium as it impinges upon and flows through the pin fins, increasing the rate of thermal transfer.
Heat sink with slotted pin fins
The heat sink with slotted pin fins includes a thermally conductive base and a plurality of pin fins, which may be substantially cylindrical. Each pin fin has axially opposed upper and lower ends, the lower ends being attached to the base. Each of the pin fins is formed of a thermally conductive material and extends from the base. Each of the pin fins has a slot formed therein extending both diametrically and axially through the pin fin, such that a surrounding fluid medium can flow through the slot formed through pin fin, thus reducing the drag force on the surrounding fluid medium as it impinges upon and flows through the pin fins, increasing the rate of thermal transfer.
HEAT DISSIPATION DEVICE HAVING ANISOTROPIC THERMALLY CONDUCTIVE SECTIONS AND ISOTROPIC THERMALLY CONDUCTIVE SECTIONS
A heat dissipation device may be formed having at least one isotropic thermally conductive section (uniformly high thermal conductivity in all directions) and at least one anisotropic thermally conductive section (high thermal conductivity in at least one direction and low thermal conductivity in at least one other direction). The heat dissipation device may be thermally coupled to a plurality of integrated circuit devices such that at least a portion of the isotropic thermally conductive section(s) and/or the anisotropic thermally conductive section(s) is positioned over at least one integrated circuit device. The isotropic thermally conductive section(s) allows heat spreading/removal from hotspots or areas with high-power density and the anisotropic thermally conductive section(s) transfers heat away from the at least one integrated circuit device predominately in a single direction with minimum conduction resistance in areas with uniform power density distribution, while reducing heat transfer in the other directions, thereby reducing thermal cross-talk.
PORTABLE ROTISSERIE SPIT
A portable rotisserie spit includes a main body including an outer tube and an inner tube; a first fluid passage hole provided on one end of the main body and connected to the outer tube; a second fluid passage hole provided on one end of the main body and connected to the inner tube; a cooling chamber, which is connected to the first fluid passage hole and second fluid passage hole, and includes a first part and a second part; a compressor, which is connected to the first fluid passage hole and the cooling chamber, and which is provided for delivering the coolant in the cooling chamber to the main body in a pressurized manner; a motor, a motor lower connection and a motor shaft provided for rotation of the rotisserie spit and for connection thereof to the machine.