A lubricant pan for a vehicle includes a receiving region in which a lubricant is at least temporarily receivable, a first wall element, and a second wall element. A temperature-control channel is disposed between the first wall element and the second wall element and a temperature-control medium is flowable through the temperature-control channel. A core that is porous and permeable to the temperature-control medium is disposed in the temperature-control channel between the first wall element and the second wall element. The temperature-control medium is introducible into the temperature-control channel via a first connector and the temperature-control medium is dischargable from the temperature-control channel via a second connector.

A lubricant pan for a vehicle includes a receiving region in which a lubricant is at least temporarily receivable, a first wall element, and a second wall element. A temperature-control channel is disposed between the first wall element and the second wall element and a temperature-control medium is flowable through the temperature-control channel. A core that is porous and permeable to the temperature-control medium is disposed in the temperature-control channel between the first wall element and the second wall element. The temperature-control medium is introducible into the temperature-control channel via a first connector and the temperature-control medium is dischargable from the temperature-control channel via a second connector.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

Self-regulating thermal insulation includes one or more thermal actuators that expand and contract in response to changes in temperature adjacent the thermal insulation, thereby automatically changing the thermal resistance of the thermal insulation. In this manner, a self-regulating thermal insulation may be configured to locally adjust in response to local changes in temperature of a part being insulated, for example, during curing or some other manufacturing process. Such self-regulating thermal insulation may be configured to respond to temperature changes without feedback control systems, power, or human intervention. Methods of making self-regulating thermal insulation include coupling a first plate with respect to a second plate using a support structure, thereby defining an insulation thickness therebetween, positioning an internal partition positioned between the first plate and the second plate, and positioning at least one thermal actuator positioned between the second plate and the internal partition.

Self-regulating thermal insulation includes one or more thermal actuators that expand and contract in response to changes in temperature adjacent the thermal insulation, thereby automatically changing the thermal resistance of the thermal insulation. In this manner, a self-regulating thermal insulation may be configured to locally adjust in response to local changes in temperature of a part being insulated, for example, during curing or some other manufacturing process. Such self-regulating thermal insulation may be configured to respond to temperature changes without feedback control systems, power, or human intervention. Methods of making self-regulating thermal insulation include coupling a first plate with respect to a second plate using a support structure, thereby defining an insulation thickness therebetween, positioning an internal partition positioned between the first plate and the second plate, and positioning at least one thermal actuator positioned between the second plate and the internal partition.

A heat-exchange pipe that is excellent in heat-exchange property in which a metal porous body is not easily dropped off form a metal pipe; which is provided with the metal pipe and the metal porous body made by joining a plurality of metal fibers bonded to an inner-wall surface of the metal pipe; at least some of the metal fibers in the metal porous body are partially bonded to the inner-wall surface of the metal pipe along a length direction, bended on the inner-wall surface of the metal pipe, and extend to leave from the inner-wall surface.

A dehumidification system includes a compressor, a primary evaporator, a primary condenser, a secondary evaporator, and a secondary condenser. The secondary evaporator receives an inlet airflow and outputs a first airflow to the primary evaporator. The primary evaporator receives the first airflow and outputs a second airflow to the secondary condenser. The secondary condenser receives the second airflow and outputs a third airflow to the primary condenser. The primary condenser receives the third airflow and outputs a dehumidified airflow. The compressor receives a flow of refrigerant from the primary evaporator and provides the flow of refrigerant to the primary condenser.

A dehumidification system includes a compressor, a primary evaporator, a primary condenser, a secondary evaporator, and a secondary condenser. The secondary evaporator receives an inlet airflow and outputs a first airflow to the primary evaporator. The primary evaporator receives the first airflow and outputs a second airflow to the secondary condenser. The secondary condenser receives the second airflow and outputs a third airflow to the primary condenser. The primary condenser receives the third airflow and outputs a dehumidified airflow. The compressor receives a flow of refrigerant from the primary evaporator and provides the flow of refrigerant to the primary condenser.

An immersion-type porous heat dissipation substrate structure is provided. The immersion-type porous heat dissipation substrate structure includes a porous heat dissipation base formed by sintering of metal powder. The porous heat dissipation base is immersed in a two-phase coolant for increasing an amount of bubbles that is generated, and has a porosity that is controlled to be between 5% and 50%. Or, the porous heat dissipation base has more than one porosity.