Electrically controlled solid-state thermal switches and methods of controlling heat flow. An electrostrictive material is electromagnetically coupled to first and second electrodes that provide an electric field to the electrostrictive material. Different portions of the electrostrictive material are thermally coupled to each of a heat sink and a thermal load so that heat flowing from one into the other passes through the electrostrictive material. A control voltage is applied to the electrodes to selectively generate the electric field, thereby selectively altering the thermal conductivity of the electrostrictive material. The heat sink and thermal load are thereby selectively thermally coupled to each other in dependance on the control voltage.

A heat exchange assembly includes an upper cover panel, a lower cover panel, a plurality of stacked plate assemblies, and a plurality of fins interposed between the plurality of plate assemblies. Each of the plurality of plate assemblies forms a flow passage for receiving a coolant. A continuous flow path extends through the heat exchange assembly. The flow path is in fluid communication with the flow passage of each of the plates and configured to convey air from each of the flow passages to an environment separate from the heat exchanger.

A heat exchange assembly includes an upper cover panel, a lower cover panel, a plurality of stacked plate assemblies, and a plurality of fins interposed between the plurality of plate assemblies. Each of the plurality of plate assemblies forms a flow passage for receiving a coolant. A continuous flow path extends through the heat exchange assembly. The flow path is in fluid communication with the flow passage of each of the plates and configured to convey air from each of the flow passages to an environment separate from the heat exchanger.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.

A constant density heat exchanger is provided. The constant density heat exchanger includes a housing extending between a first end and a second end and defining a chamber having an inlet and an outlet. A first flow control device is positioned at the inlet of the chamber and movable between an open position in which a working fluid is permitted into the chamber and a closed position in which the working fluid is prevented from entering the chamber. A second flow control device is positioned at the outlet of the chamber and movable between an open position in which the working fluid is permitted to exit the chamber and a closed position in which the working fluid is prevented from exiting the chamber. A heat exchange fluid imparts thermal energy to the volume of working fluid held at constant density within the chamber by the first and second control devices.

The present invention is directed to a manifold for directing cooling fluid and/or gas to a heat exchanger in a flow configuration designed to optimize heat transfer from the heat exchanger. The manifold can take many different forms such as a layered construction with distributed inlet paths, local outlet paths, a central collection changer and a path for fluid removal. The manifold can be formed from a metal, plastic, rubber, ceramic, or other heat resistant material known to or conceivable by one of skill in the art. The manifold can also be combined with any type of heat exchanger known to or conceivable by one of skill in the art to form a thermal management unit. To optimize overall properties such as low pressure drop, high heat transfer, and excellent temperature uniformity of the thermal management unit, the manifold can be graded, expanded and scaled as needed.

The present invention is directed to a manifold for directing cooling fluid and/or gas to a heat exchanger in a flow configuration designed to optimize heat transfer from the heat exchanger. The manifold can take many different forms such as a layered construction with distributed inlet paths, local outlet paths, a central collection changer and a path for fluid removal. The manifold can be formed from a metal, plastic, rubber, ceramic, or other heat resistant material known to or conceivable by one of skill in the art. The manifold can also be combined with any type of heat exchanger known to or conceivable by one of skill in the art to form a thermal management unit. To optimize overall properties such as low pressure drop, high heat transfer, and excellent temperature uniformity of the thermal management unit, the manifold can be graded, expanded and scaled as needed.

A heat exchanger includes a metal fiber structure (20) formed from metal fibers, and a housing body (for example, a pipe (10)) in which the metal fiber structure (20) is housed, and a gap is formed at least partially between the metal fiber structure (20) housed in the housing body and an inner surface of the housing body.

An apparatus includes multiple thermal actuator switches configured to control a transfer of thermal energy. The thermal actuator switches are arranged in a stacked configuration. Each switch includes first and second plates and a piston movable between the plates. Each switch also includes a phase change material configured to (i) expand to move a surface of the piston into a first position and (ii) contract to allow the surface of the piston to move into a second position. The surface of the piston thermally contacts the first plate and increases thermal energy transfer between the plates when in one of the first and second positions. The surface of the piston is spaced apart from the first plate and decreases thermal energy transfer between the plates when in another of the first and second positions. Different ones of the switches include different phase change materials that expand or contract at different temperatures.