Patent classifications
F28F21/00
Dispersion, method for coating objects with this dispersion, and use of the dispersion
The invention relates to a dispersion and also to a method for coating objects, in particular heat exchanger structures, in which this dispersion is applied on a carrier structure and is crosslinked and/or made into a film with formation of a layer. Likewise, the invention relates to heat exchanger structures coated in this way. The dispersions according to the invention can likewise be used for coatings in the construction of chemical plants and also in medical technology.
HONEYCOMB STRUCTURE
A honeycomb structure includes a tubular circumferential wall and partition walls forming a honeycomb-shaped cross-section and defining a plurality of cells extending inside the circumferential wall in an axial direction of the circumferential wall. The partition walls are constructed by a frame portion, formed by a plurality of ceramic particles arranged in a shape corresponding to the partition walls, and a filling portion, formed by metal silicon filling a gap between ceramic particles in the frame portion. The frame portion is maintained in a shape corresponding to the partition walls by the filling portion.
HONEYCOMB STRUCTURE
A honeycomb structure includes a tubular circumferential wall and partition walls forming a honeycomb-shaped cross-section and defining a plurality of cells extending inside the circumferential wall in an axial direction of the circumferential wall. The partition walls are constructed by a frame portion, formed by a plurality of ceramic particles arranged in a shape corresponding to the partition walls, and a filling portion, formed by metal silicon filling a gap between ceramic particles in the frame portion. The frame portion is maintained in a shape corresponding to the partition walls by the filling portion.
Method of manufacturing a fin structure for heat exchanger
The present disclosure discloses a method of manufacturing a structure with a wall, comprising manufacturing a structure with a wall by using additive manufacturing technology, and dissolving a surface of the wall for reducing thickness of the wall.
Method of manufacturing a fin structure for heat exchanger
The present disclosure discloses a method of manufacturing a structure with a wall, comprising manufacturing a structure with a wall by using additive manufacturing technology, and dissolving a surface of the wall for reducing thickness of the wall.
Heat exchanger with integrated support structure
A heat exchanger having an integrated support structure particularly suited for thermal management of heat generating components such as battery thermal management applications or thermal management of other electronic components is disclosed. The heat exchanger includes a top plate and a base tray defining a plurality of fluid channels that extend between an inlet manifold area and an outlet manifold area. The top plate has a first side defining a primary heat transfer area and a second side for effecting a sealing relationship between the top plate and the base tray. In some instances, the top plate includes a thermally conductive material while the base tray includes a non-thermally conductive material. In some instances the base tray cooperates with a cover portion to define an enclosure for housing the heat generating components.
Heat exchanger with integrated support structure
A heat exchanger having an integrated support structure particularly suited for thermal management of heat generating components such as battery thermal management applications or thermal management of other electronic components is disclosed. The heat exchanger includes a top plate and a base tray defining a plurality of fluid channels that extend between an inlet manifold area and an outlet manifold area. The top plate has a first side defining a primary heat transfer area and a second side for effecting a sealing relationship between the top plate and the base tray. In some instances, the top plate includes a thermally conductive material while the base tray includes a non-thermally conductive material. In some instances the base tray cooperates with a cover portion to define an enclosure for housing the heat generating components.
USE OF SiO2 COATINGS IN WATER-CARRYING COOLING SYSTEMS
The invention relates to the use of coatings of nanoscale SiO.sub.2 particles in water-carrying cooling systems to prevent abrasive corrosion and depositions as well as to a method for the production of such a coating.
Heat transfer device having channels
The invention relates to a heat transfer device with channels for heat-absorbing media and channels for heat-emitting media, at least one of the channels having a textile structure with compressed and non-compressed regions. Whilst the compressed regions are disposed in the transition regions between the channels in order to improve the heat transfer to or across the channel wall, the non-compressed regions are disposed in the flow regions of the channels. This construction enables a large heat transfer to the heat transfer surface with simultaneously good heat conduction from the heat transfer surface to the separating surface. The invention likewise relates to heat exchangers with heat transfer devices of this type.
Heat transfer device having channels
The invention relates to a heat transfer device with channels for heat-absorbing media and channels for heat-emitting media, at least one of the channels having a textile structure with compressed and non-compressed regions. Whilst the compressed regions are disposed in the transition regions between the channels in order to improve the heat transfer to or across the channel wall, the non-compressed regions are disposed in the flow regions of the channels. This construction enables a large heat transfer to the heat transfer surface with simultaneously good heat conduction from the heat transfer surface to the separating surface. The invention likewise relates to heat exchangers with heat transfer devices of this type.