A heat exchanger assembly including an elongated tubular heat exchanger enclosure defining an interior chamber. A tube sheet is positioned within the interior chamber of the heat exchanger enclosure separating the interior chamber into a shell side and a channel side. The interior portion is configured to removably receive a tube bundle positioned within the shell side of the interior chamber. An annular sleeve member is positioned within the channel side of the interior chamber of the heat exchanger enclosure. An annular elastic torsion member is positioned within the channel side of the interior chamber of the heat exchanger such that the sleeve member is positioned between the tube sheet and the elastic torsion member. The elastic torsion member has an inner circumference deflectable relative to its outer circumference for torsioning the elastic torsion member.

A heat exchanger assembly including an elongated tubular heat exchanger enclosure defining an interior chamber. A tube sheet is positioned within the interior chamber of the heat exchanger enclosure separating the interior chamber into a shell side and a channel side. The interior portion is configured to removably receive a tube bundle positioned within the shell side of the interior chamber. An annular sleeve member is positioned within the channel side of the interior chamber of the heat exchanger enclosure. An annular elastic torsion member is positioned within the channel side of the interior chamber of the heat exchanger such that the sleeve member is positioned between the tube sheet and the elastic torsion member. The elastic torsion member has an inner circumference deflectable relative to its outer circumference for torsioning the elastic torsion member.

A technique to additively print onto a dissimilar material, especially ceramics and glasses (e.g., semiconductors, graphite, diamond, other metals) is disclosed herein. The technique enables manufacture of heat removal devices and other deposited structures, especially on heat sensitive substrates. It also enables novel composites through additive manufacturing. The process enables rapid bonding, orders-of-magnitude faster than conventional techniques.

An heat exchanger and method for forming the heat exchanger, the heat exchanger including a cooling architecture comprising at least one unit cell having a set of walls with a thickness, the set of walls defining fluidly separate conduits having multiple openings, each of the multiple openings having a hydraulic diameter, wherein an average fluid temperature (T.sub.f) to material temperature limit (T.sub.m) ratio (T.sub.f/T.sub.m) is greater than 0 and less than or equal to 1.25 (0<T.sub.f/T.sub.m≤1.25), and wherein the thickness (t) and the hydraulic diameter (D.sub.H) relate to each other by an equation:

[00001]$\frac{T_f}{T_m}.Math.\frac{D_H^{2/3}\left(D_H+t\right)}{{\left(D_H+2t\right)}^{8/3}}$

to define a unit cell performance factor (UCPF).

Materials systems resistant to penetration of molten salts and may be present within a molten-salt-facing wall of a device for containing a molten salt bath at an elevated temperature, and molten-salt-facing walls and devices formed by such materials systems. A first layer of such a system defines an outer surface for direct contact with the molten salt bath, and resists erosion and corrosion and is penetrable by the molten salt at the elevated temperature. A second layer is located adjacent to the first layer and exhibits little or no wetting by the molten salt so that at least a portion of a thickness of the second layer is not penetrable by the molten salt. A third layer is located adjacent to the second layer and is porous and exhibits a low thermal conductivity at the elevated temperature.

Implementations for heat structure for thermal mitigation are described. The described heat structures, for instance, provide a multi-layered structure that optimizes heat spreading and dissipation, as well as wireless performance of wireless devices. A heat structure, for instance, is installed internally in a wireless device adjacent various internal components to absorb heat generated by the components, and to dissipate the heat. According to various implementations, a heat structure is implemented as a thermally conductive layer surrounded by layers of electrically conductive material. Electrically conductive vias can be formed that traverse the thermally conductive layer and form an electrical connection between different electrically conductive layers to mitigate current flow in the thermally conductive layer.

Implementations for heat structure for thermal mitigation are described. The described heat structures, for instance, provide a multi-layered structure that optimizes heat spreading and dissipation, as well as wireless performance of wireless devices. A heat structure, for instance, is installed internally in a wireless device adjacent various internal components to absorb heat generated by the components, and to dissipate the heat. According to various implementations, a heat structure is implemented as a thermally conductive layer surrounded by layers of electrically conductive material. Electrically conductive vias can be formed that traverse the thermally conductive layer and form an electrical connection between different electrically conductive layers to mitigate current flow in the thermally conductive layer.

A composite heat dissipation device includes an electromagnetic radiation dissipation pile including a polar dielectric material assembly including a plurality of polar dielectric material units. The polar dielectric material assembly is configured to interact with solar radiation. Surfaces of the polar dielectric material units each are configured to interact with the solar radiation to generate scattering of light. The polar dielectric material units each include an optical phonon configured to interact with thermal radiation to increase strength of the thermal radiation.

A composite heat dissipation device includes an electromagnetic radiation dissipation pile including a polar dielectric material assembly including a plurality of polar dielectric material units. The polar dielectric material assembly is configured to interact with solar radiation. Surfaces of the polar dielectric material units each are configured to interact with the solar radiation to generate scattering of light. The polar dielectric material units each include an optical phonon configured to interact with thermal radiation to increase strength of the thermal radiation.

A diffuser plate for a thermal transfer device can include a body having a number of first apertures and a second aperture that traverse therethrough, where the first apertures are asymmetrically arranged with respect to the second aperture. The first apertures can have a first shape and a first size, and where the first apertures are configured to receive a plurality of tubes. The second aperture has a second size, where the second size is larger than the first size.