F28F23/00

Heat transfer fluids and methods of use

This disclosure relates to heat transfer fluids for use in heat transfer systems. The heat transfer fluids comprise at least one non-aqueous dielectric heat transfer fluid. The non-aqueous dielectric heat transfer fluid has density (ρ), specific heat (c.sub.p), and dynamic viscosity (μ) properties. The heat transfer fluids have a normalized effectiveness factor (NEF.sub.fluid) as determined by the following equation: N E F fluid = D E F fluid D E F reference ;
wherein DEF.sub.fluid is a dimensional effectiveness factor for the heat transfer fluid that is determined based on an equation designated in Table 1 below for a selected pump and a selected heat transfer circuit dominant flow regime; wherein DEF.sub.reference is a dimensional effectiveness factor for a reference fluid that is determined using the same equation designated in Table 1 for DEF.sub.fluid above for the same selected pump and the same selected heat transfer circuit dominant flow regime; and TABLE-US-00001 TABLE 1 (Heat Transfer Fluid and Reference Fluid) Selected Heat Transfer Circuit Flow Regime Selected Pump Laminar Transition (Blasius) Positive Displacement Pump ρ.sup.1 c.sub.p.sup.1 μ.sup.−1 ρ.sup.0.25 c.sub.p.sup.1 μ.sup.−0.25 Centrifugal Pump ρ.sup.0.19 c.sub.p.sup.1 μ.sup.−0.19 ρ.sup.0.04 c.sub.p.sup.1 μ.sup.−0.04
wherein the heat transfer fluid has a NEF.sub.fluid value equal to or greater than 1.0. This disclosure also provides a method for improving performance of a heat transfer system, a method for improving performance of an apparatus, and a method for selecting a heat transfer fluid for use in a heat transfer system. The heat transfer fluids and methods of this disclosure are applicable in situations where the heat transfer system is dominated by heat conveyance.

Heat transfer fluids and methods of use

This disclosure relates to heat transfer fluids for use in heat transfer systems. The heat transfer fluids comprise at least one non-aqueous dielectric heat transfer fluid. The non-aqueous dielectric heat transfer fluid has density (ρ), specific heat (c.sub.p), and dynamic viscosity (μ) properties. The heat transfer fluids have a normalized effectiveness factor (NEF.sub.fluid) as determined by the following equation: N E F fluid = D E F fluid D E F reference ;
wherein DEF.sub.fluid is a dimensional effectiveness factor for the heat transfer fluid that is determined based on an equation designated in Table 1 below for a selected pump and a selected heat transfer circuit dominant flow regime; wherein DEF.sub.reference is a dimensional effectiveness factor for a reference fluid that is determined using the same equation designated in Table 1 for DEF.sub.fluid above for the same selected pump and the same selected heat transfer circuit dominant flow regime; and TABLE-US-00001 TABLE 1 (Heat Transfer Fluid and Reference Fluid) Selected Heat Transfer Circuit Flow Regime Selected Pump Laminar Transition (Blasius) Positive Displacement Pump ρ.sup.1 c.sub.p.sup.1 μ.sup.−1 ρ.sup.0.25 c.sub.p.sup.1 μ.sup.−0.25 Centrifugal Pump ρ.sup.0.19 c.sub.p.sup.1 μ.sup.−0.19 ρ.sup.0.04 c.sub.p.sup.1 μ.sup.−0.04
wherein the heat transfer fluid has a NEF.sub.fluid value equal to or greater than 1.0. This disclosure also provides a method for improving performance of a heat transfer system, a method for improving performance of an apparatus, and a method for selecting a heat transfer fluid for use in a heat transfer system. The heat transfer fluids and methods of this disclosure are applicable in situations where the heat transfer system is dominated by heat conveyance.

ELECTROCHEMICAL HEAT TRANSFER SYSTEM
20210199396 · 2021-07-01 ·

A heat transfer system is disclosed including heat transfer fluid flow paths (20,22,24,28) through a heat exchanger evaporator (12) and a heat exchanger condenser (16). The system includes an electrochemical cell (32) that transforms an electrochemically reactive agent in the heat transfer fluid between first and second compounds having different boiling points. In some embodiments, the electrochemically active agent can include a fluorinated organic compound including an electrochemically active substituent group that reversibly transforms between the first and second compounds. In some embodiments, the heat transfer fluid can include the electrochemically active agent and an electrochemically non-active refrigerant in a mixture.

Thermal management system

A gas turbine engine includes a turbomachine and a thermal management system. The thermal management system includes a heat source heat exchanger configured to collect heat from the turbomachine during operation; a heat sink heat exchanger; and a thermal transport bus having a heat exchange fluid configured to flow therethrough at a pressure within an operational pressure range. The thermal management system defines an operational temperature range for the heat exchange fluid, the operational temperature range having a lower temperature limit less than about zero degrees Fahrenheit at a pressure within the operational pressure range and an upper temperature limit of at least about 1000 degrees Fahrenheit at a pressure within the operational pressure range.

Thermal management system

A gas turbine engine includes a turbomachine and a thermal management system. The thermal management system includes a heat source heat exchanger configured to collect heat from the turbomachine during operation; a heat sink heat exchanger; and a thermal transport bus having a heat exchange fluid configured to flow therethrough at a pressure within an operational pressure range. The thermal management system defines an operational temperature range for the heat exchange fluid, the operational temperature range having a lower temperature limit less than about zero degrees Fahrenheit at a pressure within the operational pressure range and an upper temperature limit of at least about 1000 degrees Fahrenheit at a pressure within the operational pressure range.

DISSIPATING DEVICE
20210289663 · 2021-09-16 ·

A dissipating device configured to dissipate the heat energy generated by the heat sources in the electronic devices. When the dissipating device contacts the heat sources, the heat energy can be absorbed by the dissipating device. The working fluid is stored within the dissipating device such that the working fluid can undergo a phase transition after the dissipating device absorbs heat energy. Then the working fluid can circulate inside the dissipating device. Accordingly, the heat-dissipation mechanism, which is applied to the dissipating device contacting the electronic devices, can be effectively sped up. The dissipating device is formed into a thin structure to achieve an excellent heat-dissipation effect with a limited heat-dissipation area.

THERMAL MANAGEMENT USING ENDOTHERMIC HEAT SINK

A thermal management system includes a slurry generator, an injector pump coupled to the slurry generator, a heat exchanger reactor coupled to the injector pump, wherein the heat exchanger reactor is adapted to subject a thermally expendable heat absorption material to a temperature above 60° C. and a pressure below 3 kPa, and wherein the expendable heat absorption material endothermically decomposes into a gaseous by-product. A vapor cycle system is coupled to the heat exchanger reactor and is operatively connected to a thermal load. A thermal energy storage system may be coupled to the vapor cycle system and the thermal load. The thermal energy storage system may isolate the heat exchanger reactor from thermal load transients of the thermal load.

MULTI MODE HEAT TRANSFER SYSTEMS

Embodiments described herein generally relate to a multi-mode heat transfer system. The heat transfer system includes an emitter device. The emitter device includes an inner core surrounded by an outer core having a thickness and an outer surface. A composite material pattern extends through at least a portion of the outer surface and at least a portion of the thickness of the outer core and is thermally coupled to the inner core. The composite material pattern in combination with an optimized emissivity surface coating/paint profile directs a heat from the inner core to an object other than the emitter device.

MULTI MODE HEAT TRANSFER SYSTEMS

Embodiments described herein generally relate to a multi-mode heat transfer system. The heat transfer system includes an emitter device. The emitter device includes an inner core surrounded by an outer core having a thickness and an outer surface. A composite material pattern extends through at least a portion of the outer surface and at least a portion of the thickness of the outer core and is thermally coupled to the inner core. The composite material pattern in combination with an optimized emissivity surface coating/paint profile directs a heat from the inner core to an object other than the emitter device.

Pet cooling Pad
20210195865 · 2021-07-01 ·

Present invention teaches construction of a pet cooling pad by mixing four substances into a gel layer. A soft fabric layer then wraps the gel layer together with a light sponge layer into an integrated pad. An anti-slip layer can be added to the bottom to provide more stable grip to the surface the pad is place upon, especially when the pad is used in a moving vehicle to transport pets. Optionally, the soft fabric layer can be made to be waterproof, easy for a pet owner to take care of and/or clean the pad products.