An evaporative cooling system includes an indirect cooling coil containing a cooling fluid to be circulated and a blower assembly configured to generate an inlet air stream through the indirect cooling coil. The cooling fluid in the indirect cooling coil is a slurry of water and phase change material.

An evaporative cooling system includes an indirect cooling coil containing a cooling fluid to be circulated and a blower assembly configured to generate an inlet air stream through the indirect cooling coil. The cooling fluid in the indirect cooling coil is a slurry of water and phase change material.

Methods and functional elements for enhanced thermal management of predominantly enclosed spaces to enable the construction of buildings with reduced power requirements for heating and/or air-conditioning systems. The methods may be in part based on dynamically changing functional elements with variable properties, or effective properties, in terms of their electromagnetic radiative behavior and/or their thermal energy storage properties, or the spatial distribution of the stored thermal energy, which permits the application of methods to control the overall thermal behavior of the entire structure in such a way that desired levels of inside temperature can be reached with reduced consumption of external energy (typically electricity, gas, oil, or coal). In some instances no conventional heating of cooling is required at all. In some instances the invention reduces the time to reach desired temperatures inside such buildings, habitats, or other predominantly enclosed spaces.

Methods and functional elements for enhanced thermal management of predominantly enclosed spaces to enable the construction of buildings with reduced power requirements for heating and/or air-conditioning systems. The methods may be in part based on dynamically changing functional elements with variable properties, or effective properties, in terms of their electromagnetic radiative behavior and/or their thermal energy storage properties, or the spatial distribution of the stored thermal energy, which permits the application of methods to control the overall thermal behavior of the entire structure in such a way that desired levels of inside temperature can be reached with reduced consumption of external energy (typically electricity, gas, oil, or coal). In some instances no conventional heating of cooling is required at all. In some instances the invention reduces the time to reach desired temperatures inside such buildings, habitats, or other predominantly enclosed spaces.

An air conditioner that includes a heat exchanger including: heat-transfer pipes extending in a horizontal direction and spaced apart at predetermined intervals in a vertical direction and configured to allow a thermal medium to flow therein. A part of the heat transfer pipes are used for at least one inflow path into which the thermal medium flows from the outside of the heat exchanger and the other part of the heat transfer pipes are used for at least one outflow path from which the thermal medium flows out to the outside. At least one connection pipe through which an outlet side of one of the at least one inflow path communicates with an inlet side of one of the at least one outflow path.

A cooling device includes a number of cooling tubes arranged in parallel such that a first cooling fluid and a second cooling fluid can flow in the cooling tubes. A tank communicates with the cooling tubes to allow the first cooling fluid or the second cooling fluid to flow through the cooling tubes. A diaphragm is located inside the tank to separate the tank into a first space allowing the first cooling fluid to flow therein and a second space allowing the second cooling fluid to flow therein. The diaphragm is coupled to the tank to be rectilinearly movable in a direction of an arrangement of the plurality of cooling tubes.

A variable conductance heat pipe (VCHP) is utilized as a “passive heat switch” to regulate a characteristic temperature of an integrated circuit component. The VCHP is located between an integrated circuit component and a cold plate and comprises a working fluid and a non-condensable gas in a chamber. When the component is not operational, the VCHP blocks the flow of heat from the component to the cold plate. As component power consumption increases, the working fluid pressure increases and compresses the non-condensable gas toward the cooler region of the cold plate to eventually create a low thermal resistance path between the component and the cold plate. By introducing negative feedback into the thermal management solution, the VCHP keeps the characteristic temperature within a narrow range. This can alleviate stress on package components (e.g., solder joints) due to excessive thermal cycling, which can extend the lifetime of the component.

Embodiments of the disclosure relate to an electronic assembly including a substrate having a first surface and a second surface opposite to the first surface and one or more electronic devices bonded to the first surface of the substrate. A first heat-storing region is embedded within the substrate and proximate to the second surface. The first heat-storing region comprises a phase change material encapsulated by an encapsulating layer. A melting temperature of the encapsulating layer is higher than a melting temperature of the phase change material and a maximum operating temperature of the one or more electronic devices. A heat transfer layer is embedded within the substrate and thermally connects the first heat-storing region to the one or more electronic devices.

Embodiments of the disclosure relate to an electronic assembly including a substrate having a first surface and a second surface opposite to the first surface and one or more electronic devices bonded to the first surface of the substrate. A first heat-storing region is embedded within the substrate and proximate to the second surface. The first heat-storing region comprises a phase change material encapsulated by an encapsulating layer. A melting temperature of the encapsulating layer is higher than a melting temperature of the phase change material and a maximum operating temperature of the one or more electronic devices. A heat transfer layer is embedded within the substrate and thermally connects the first heat-storing region to the one or more electronic devices.

A method and apparatus for separating a separation component from a gas stream. One exemplary method includes: flowing the gas stream across a process surface of a compliant composite heat transfer wall, wherein: the gas stream has an initial concentration of the separation component, and the gas stream has a gas temperature; flowing a cooling fluid across a cooling surface of the wall, wherein: the cooling fluid has a fluid temperature, and the fluid temperature is less than the gas temperature; and producing an output gas stream, wherein: the output gas stream has an output concentration of the separation component, and the output concentration is less than the initial concentration. Another exemplary method includes separating at least a portion of the separation component from the gas stream by: accumulating the portion proximate the process surface; and delaminating the portion from the process surface with a flow of the gas stream.