Patent classifications
F28F23/00
LOW VISCOSITY HEAT TRANSFER FLUIDS WITH INCREASING FLASH POINT AND THERMAL CONDUCTIVITY
This disclosure relates to a heat transfer fluid having at least one first ester that is partially esterified, and at least one second ester that is fully esterified. The heat transfer fluid has a flash point from about 125 C. to about 225 C. as determined by ASTM D-93, and a kinematic viscosity (KV.sub.100) from about 1 to about 5 at 100 C. as determined by ASTM D-445. The at least one first ester and the at least one second ester are present in an amount such that, as the flash point and thermal conductivity of the heat transfer fluid are increased, the kinematic viscosity (KV.sub.100) of the heat transfer fluid is decreased or essentially maintained. This disclosure also relates to a method for increasing flash point and thermal conductivity, while decreasing or essentially maintaining viscosity, of a heat transfer fluid by using the heat transfer fluid.
COMPOSITIONS CONTAINING NANO-BUBBLES IN A LIQUID CARRIER
An apparatus for producing a composition that includes nano-bubbles dispersed in a liquid carrier includes: (a) an elongate housing comprising a first end and a second end, the housing defining a liquid inlet, a liquid outlet, and an interior cavity adapted for receiving the liquid carrier from a liquid source; and (b) a gas-permeable member at least partially disposed within the interior cavity of the housing. The gas-permeable member includes an open end adapted for receiving a pressurized gas from a gas source, a closed end, and a porous sidewall extending between the open and closed ends having a mean pore size no greater than 1.0 m. The gas-permeable member defines an inner surface, an outer surface, and a lumen. The housing and gas-permeable member are configured to form a composition that includes the liquid carrier and the nano-bubbles dispersed therein.
COMPOSITIONS CONTAINING NANO-BUBBLES IN A LIQUID CARRIER
An apparatus for producing a composition that includes nano-bubbles dispersed in a liquid carrier includes: (a) an elongate housing comprising a first end and a second end, the housing defining a liquid inlet, a liquid outlet, and an interior cavity adapted for receiving the liquid carrier from a liquid source; and (b) a gas-permeable member at least partially disposed within the interior cavity of the housing. The gas-permeable member includes an open end adapted for receiving a pressurized gas from a gas source, a closed end, and a porous sidewall extending between the open and closed ends having a mean pore size no greater than 1.0 m. The gas-permeable member defines an inner surface, an outer surface, and a lumen. The housing and gas-permeable member are configured to form a composition that includes the liquid carrier and the nano-bubbles dispersed therein.
EVAPORATIVE COOLING SYSTEM AND DEVICE
An evaporative cooling system includes an indirect cooling coil containing a cooling fluid to be circulated and a blower assembly configured to generate an inlet air stream through the indirect cooling coil. The cooling fluid in the indirect cooling coil is a slurry of water and phase change material.
EVAPORATIVE COOLING SYSTEM AND DEVICE
An evaporative cooling system includes an indirect cooling coil containing a cooling fluid to be circulated and a blower assembly configured to generate an inlet air stream through the indirect cooling coil. The cooling fluid in the indirect cooling coil is a slurry of water and phase change material.
CURE-IN-PLACE LIGHTWEIGHT THERMALLY-CONDUCTIVE INTERFACE
A thermal interface member configured to be disposed between a heat sink and a heat-releasing device includes a thermal interface member. The thermal interface member has a thermally conductive, cure-in-place, polymer foam pad configured to maintain uniform contact with each of the heat sink and the heat-releasing device. The thermal interface member is additionally configured to absorb the thermal energy released by the heat-releasing device and direct the released thermal energy to the heat sink. The polymer foam pad has a matrix structure including at least one of anisotropic and isotropic thermally conductive anisotropic filler material, and is characterized by foam material density below 0.5 g/cm.sup.3.
CURE-IN-PLACE LIGHTWEIGHT THERMALLY-CONDUCTIVE INTERFACE
A thermal interface member configured to be disposed between a heat sink and a heat-releasing device includes a thermal interface member. The thermal interface member has a thermally conductive, cure-in-place, polymer foam pad configured to maintain uniform contact with each of the heat sink and the heat-releasing device. The thermal interface member is additionally configured to absorb the thermal energy released by the heat-releasing device and direct the released thermal energy to the heat sink. The polymer foam pad has a matrix structure including at least one of anisotropic and isotropic thermally conductive anisotropic filler material, and is characterized by foam material density below 0.5 g/cm.sup.3.
SYSTEM AND METHOD FOR COOLING ELECTRONIC DEVICES
A system and a method are provided for cooling heat-generating devices. A plurality of heat exchangers are in thermal communication with a plurality electronic devices. Each of the plurality of heat exchangers includes at least one channel configured to receive and circulate a working liquid. Each of the plurality of heat exchangers may be a cold plate, an air cooler, and a combination thereof. The plurality of heat exchangers include at least one cold plate in direct contact with at least one of the plurality of electronic device. At least one air cooler circulates air and convectively absorbs heat from the remaining electronic devices.
SYSTEM AND METHOD FOR RECOVERING AND UPGRADING WASTE HEAT WHILE COOLING DEVICES
A system and a method are provided for cooling devices and recovering waste heat. A plurality of heat absorption devices in direct or indirect thermal contact with a plurality electronic devices, and comprise channels to receive an evaporable working liquid, which becomes a first 2-phase mixture having a first liquid portion and a first vapor portion upon absorption of heat from the devices. At least one compressor compresses the first vapor portion to form a compressed vapor having elevated pressure and temperature. At least one heat exchanger condenses the compressed vapor to liquid so as to release the heat. An expansion device is used to expand the liquid to provide a second 2-phase mixture comprising a second liquid portion and a second vapor portion. In at least one vapor-liquid separator, the first liquid portion and the second liquid portion are fed back to the plurality of heat absorption devices. The second vapor portion is fed back to the at least one compressor.
Pallet cover comprising one or more temperature-control members and kit for use in making the pallet cover
A pallet cover suitable for use in covering at least a portion of a payload on a pallet and a kit for use in making the pallet cover. In one embodiment, the pallet cover includes a top wall, a front wall, a rear wall, a left side wall, and a right side wall, wherein the walls are detachably joined to one another. Each of the top wall, the front wall, the rear wall, the left side wall, and the right side wall includes a first fabric sheet and a second fabric sheet, the first and second fabric sheets being joined together to form a plurality of pockets. Each pocket may removably receive a temperature-control member containing a phase-change material. At least one of the top wall, the front wall, the rear wall, the left side wall and the right side wall includes a plurality of detachably joined portions.