A vehicle is provided which includes an engine and a radiator. The radiator with circulating coolant fluid includes a plurality of embedded heat pipes each having (a) a body with first and second opposing ends, (b) a wicking material, and (c) a thermal transfer fluid, wherein said body of said heat pipe encloses an interior volume, and wherein said wicking material and said working fluid are disposed in said interior volume of said heat pipe. The first end of the heat pipe extracts heat from the engine, and the second end of the heat pipe transfers heat from the heat pipe to an atmosphere external to the engine. The heat transfer fluid transfers heat from the first end of said heat pipe to the second end of said heat pipe, and the wicking material transfers the heat transfer fluid from the second end of the heat pipe to the first end of the heat pipe.

A vehicle is provided which includes an engine and a radiator. The radiator with circulating coolant fluid includes a plurality of embedded heat pipes each having (a) a body with first and second opposing ends, (b) a wicking material, and (c) a thermal transfer fluid, wherein said body of said heat pipe encloses an interior volume, and wherein said wicking material and said working fluid are disposed in said interior volume of said heat pipe. The first end of the heat pipe extracts heat from the engine, and the second end of the heat pipe transfers heat from the heat pipe to an atmosphere external to the engine. The heat transfer fluid transfers heat from the first end of said heat pipe to the second end of said heat pipe, and the wicking material transfers the heat transfer fluid from the second end of the heat pipe to the first end of the heat pipe.

An electronics cooling system for an aircraft includes a heat exchanger comprising a coolant circuit, an air circuit, and a fuel circuit such that each of the circuits is in thermal communication with at least one of the other circuits. The coolant circuit is in thermal communication with one or more aircraft electronics. The air circuit is in fluid communication with at least one air source. The fuel circuit is in fluid communication with a fuel tank between the fuel tank and an engine of the aircraft.

An electronics cooling system for an aircraft includes a heat exchanger comprising a coolant circuit, an air circuit, and a fuel circuit such that each of the circuits is in thermal communication with at least one of the other circuits. The coolant circuit is in thermal communication with one or more aircraft electronics. The air circuit is in fluid communication with at least one air source. The fuel circuit is in fluid communication with a fuel tank between the fuel tank and an engine of the aircraft.

Implementations described herein generally relate to substrate processing equipment and more particularly to methods and compositions for temperature control of substrate processing equipment. In one implementation, a method of cooling a processing chamber component is provided. The method comprises introducing an inert purge gas into a supply reservoir containing a coolant and flowing the treated coolant to a processing chamber component to cool the processing chamber component. The coolant initially comprises deionized water and a water-soluble base.

Implementations described herein generally relate to substrate processing equipment and more particularly to methods and compositions for temperature control of substrate processing equipment. In one implementation, a method of cooling a processing chamber component is provided. The method comprises introducing an inert purge gas into a supply reservoir containing a coolant and flowing the treated coolant to a processing chamber component to cool the processing chamber component. The coolant initially comprises deionized water and a water-soluble base.

A data center cooling system includes a modular heat sink and a working fluid. The modular heat sink includes an evaporator configured to thermally contact a heat-generating electronic device to receive heat from the data center heat-generating electronic device; a condenser coupled to the evaporator and configured to transfer the heat from the heat-generating electronic device into a cooling fluid; and a plurality of transport tubes that fluidly couple the evaporator and the condenser, at least one of the plurality of transport tubes including an open end positioned in the evaporator and a closed end positioned in the condenser. The working fluid vaporizes in the evaporator based on receipt of the heat from the heat-generating electronic device, and circulates, in vapor phase, from the evaporator to the condenser in the transport member, and circulates, in liquid phase, from the condenser to the evaporator.

A data center cooling system includes a modular heat sink and a working fluid. The modular heat sink includes an evaporator configured to thermally contact a heat-generating electronic device to receive heat from the data center heat-generating electronic device; a condenser coupled to the evaporator and configured to transfer the heat from the heat-generating electronic device into a cooling fluid; and a plurality of transport tubes that fluidly couple the evaporator and the condenser, at least one of the plurality of transport tubes including an open end positioned in the evaporator and a closed end positioned in the condenser. The working fluid vaporizes in the evaporator based on receipt of the heat from the heat-generating electronic device, and circulates, in vapor phase, from the evaporator to the condenser in the transport member, and circulates, in liquid phase, from the condenser to the evaporator.

An apparatus having first, second, and third chambers and a plurality of receiving channels is disclosed. The first chamber includes a device surface to be cooled. The second chamber has a first surface positioned opposite to the device surface to be cooled, the first surface including a plurality of jet openings adapted to spray a coolant on the device surface when the second chamber is pressured with the coolant. The third chamber is adapted to receive coolant that left the first chamber. Each of the receiving channels has a first end in the first chamber and a second end in the third chamber. Each of the receiving channels is adjacent to a corresponding one of the jet openings and is positioned to remove coolant dispersed into the first chamber by that jet opening.

An electronic equipment includes a refrigerant tank that contains a refrigerant, an electronic component, a through card electrically coupled to the electronic component, and a pouch of which one end side is in a close contact with the through card so as to seal the electronic component, wherein the electronic component is immersed in the refrigerant of the refrigerant tank in a state of being sealed in the pouch.