An electronic equipment includes a refrigerant tank that contains a refrigerant, an electronic component, a through card electrically coupled to the electronic component, and a pouch of which one end side is in a close contact with the through card so as to seal the electronic component, wherein the electronic component is immersed in the refrigerant of the refrigerant tank in a state of being sealed in the pouch.

An apparatus for producing a composition that includes nano-bubbles dispersed in a liquid carrier includes: (a) an elongate housing comprising a first end and a second end, the housing defining a liquid inlet, a liquid outlet, and an interior cavity adapted for receiving the liquid carrier from a liquid source; and (b) a gas-permeable member at least partially disposed within the interior cavity of the housing. The gas-permeable member includes an open end adapted for receiving a pressurized gas from a gas source, a closed end, and a porous sidewall extending between the open and closed ends having a mean pore size no greater than 1.0 μm. The gas-permeable member defines an inner surface, an outer surface, and a lumen. The housing and gas-permeable member are configured to form a composition that includes the liquid carrier and the nano-bubbles dispersed therein.

An apparatus for producing a composition that includes nano-bubbles dispersed in a liquid carrier includes: (a) an elongate housing comprising a first end and a second end, the housing defining a liquid inlet, a liquid outlet, and an interior cavity adapted for receiving the liquid carrier from a liquid source; and (b) a gas-permeable member at least partially disposed within the interior cavity of the housing. The gas-permeable member includes an open end adapted for receiving a pressurized gas from a gas source, a closed end, and a porous sidewall extending between the open and closed ends having a mean pore size no greater than 1.0 μm. The gas-permeable member defines an inner surface, an outer surface, and a lumen. The housing and gas-permeable member are configured to form a composition that includes the liquid carrier and the nano-bubbles dispersed therein.

A thermal interface member configured to be disposed between a heat sink and a heat-releasing device includes a thermal interface member. The thermal interface member has a thermally conductive, cure-in-place, polymer foam pad configured to maintain uniform contact with each of the heat sink and the heat-releasing device. The thermal interface member is additionally configured to absorb the thermal energy released by the heat-releasing device and direct the released thermal energy to the heat sink. The polymer foam pad has a matrix structure including at least one of anisotropic and isotropic thermally conductive anisotropic filler material, and is characterized by foam material density below 0.5 g/cm.sup.3.

A thermal interface member configured to be disposed between a heat sink and a heat-releasing device includes a thermal interface member. The thermal interface member has a thermally conductive, cure-in-place, polymer foam pad configured to maintain uniform contact with each of the heat sink and the heat-releasing device. The thermal interface member is additionally configured to absorb the thermal energy released by the heat-releasing device and direct the released thermal energy to the heat sink. The polymer foam pad has a matrix structure including at least one of anisotropic and isotropic thermally conductive anisotropic filler material, and is characterized by foam material density below 0.5 g/cm.sup.3.

The present disclosure provides a heat transferring device and a heat transferring component thereof. The heat transferring device includes a heat transferring component, a lower plate and a positioning component. The heat transferring component is in a shape of pouch and includes at least one input end and at least one output end to allow a fluid to be inputted and outputted. The lower plate includes at least one first perforation. The positioning component is disposed on an exterior of the heat transferring component. An end of the positioning component is connected to the lower plate.

The present disclosure provides a heat transferring device and a heat transferring component thereof. The heat transferring device includes a heat transferring component, a lower plate and a positioning component. The heat transferring component is in a shape of pouch and includes at least one input end and at least one output end to allow a fluid to be inputted and outputted. The lower plate includes at least one first perforation. The positioning component is disposed on an exterior of the heat transferring component. An end of the positioning component is connected to the lower plate.

A method for transferring heat from a lower temperature heat source to a higher temperature heat sink using only the energy in the heat source and heat sink. The method uses a converting material which is adapted to receive external radiation from the lower temperature heat source, absorb the external radiation exciting an element of the converting material, non-radiatively transfer heat within the converting material by relaxing an element of the converting material, and conductively transferring heat from the converting material to the exterior of the converting material, where the heat can be used for an external process or application.

A method for transferring heat from a lower temperature heat source to a higher temperature heat sink using only the energy in the heat source and heat sink. The method uses a converting material which is adapted to receive external radiation from the lower temperature heat source, absorb the external radiation exciting an element of the converting material, non-radiatively transfer heat within the converting material by relaxing an element of the converting material, and conductively transferring heat from the converting material to the exterior of the converting material, where the heat can be used for an external process or application.

The invention provides in one embodiment a heat exchanger module (1) comprising a) a flexible support (100); b) at least one tubular member (200) having its main axis substantially parallel with the plane of the flexible support (100); c) a conductive flexible matrix (300) embedding the at least one tubular member (200); and d) a flexible case (400) enwrapping the flexible support (100), the at least one tubular member (200) and the conductive flexible matrix (300). A coating for a built environment comprising a plurality of heat exchanger modules (1) can be implemented, as well as a system further including pumping means (600). The invention also foresees a method for providing heat exchange processes between the heat exchanger module (1), the coating or the system of the invention and a built environment.