Patent classifications
F28F27/00
PRESSURE RELIEF ARRANGEMENT IN REFRIGERANT CIRCUITS
A pressure relief arrangement in refrigerant circuits with one high-pressure side and one low-pressure side, which is characterized in that the high-pressure side is fluidically connected with the low-pressure side of the refrigerant circuit via an overpressure relief device, wherein the overpressure relief device causes pressure reduction of the overpressure in the case of overpressure on the high-pressure side and fluid flows from the high-pressure side to the low-pressure side of the refrigerant circuit.
RACK COOLING DISTRIBUTION SYSTEM WITH LEAK DETECTION
A liquid cooling distribution system can be installed to an information technology (IT) rack to deliver and distribute fluid to IT equipment. The liquid cooling system can include a fluid manifold and a container that is arranged to capture a fluid that leaks from the fluid manifold. A first fluid sensor can be arranged to detect the fluid at a first position in the container. A controller can be configured to reduce a flow of the fluid into the fluid manifold and pump out fluid from the fluid manifold, in response to the fluid in the container being detected at the first position. Further remedial measure can be taken based on various detected leak scenarios.
RACK COOLING DISTRIBUTION SYSTEM WITH LEAK DETECTION
A liquid cooling distribution system can be installed to an information technology (IT) rack to deliver and distribute fluid to IT equipment. The liquid cooling system can include a fluid manifold and a container that is arranged to capture a fluid that leaks from the fluid manifold. A first fluid sensor can be arranged to detect the fluid at a first position in the container. A controller can be configured to reduce a flow of the fluid into the fluid manifold and pump out fluid from the fluid manifold, in response to the fluid in the container being detected at the first position. Further remedial measure can be taken based on various detected leak scenarios.
DEGRADATION DETERMINATION METHOD AND DEVICE
Data including a power consumption amount and an ambient temperature of a heat exchanger that discharges heat to an outside of a cooling facility in an operation mode in which the facility is operated in an operation state that requires less power consumption than usual is extracted as degradation determination reference data before degradation determination, and data including the power consumption amount and the ambient temperature in the operation mode in which the cooling facility is operated in the operation state that requires less power consumption than usual is extracted as determination data, whereby the increase in the power consumption amount due to the influence of the disturbance that changes a temperature of an inside of a box-shaped housing can be excluded, and the degradation of the cooling facility can be correctly determined by grasping the increase in the power consumption amount due to aging degradation.
DEGRADATION DETERMINATION METHOD AND DEVICE
Data including a power consumption amount and an ambient temperature of a heat exchanger that discharges heat to an outside of a cooling facility in an operation mode in which the facility is operated in an operation state that requires less power consumption than usual is extracted as degradation determination reference data before degradation determination, and data including the power consumption amount and the ambient temperature in the operation mode in which the cooling facility is operated in the operation state that requires less power consumption than usual is extracted as determination data, whereby the increase in the power consumption amount due to the influence of the disturbance that changes a temperature of an inside of a box-shaped housing can be excluded, and the degradation of the cooling facility can be correctly determined by grasping the increase in the power consumption amount due to aging degradation.
AUTOMATIC CLEANING OF ADIABATIC CONDENSER COOLING PADS
An adiabatic cooling system includes a condenser coil and one or more adiabatic pads positioned such that intake air for the adiabatic cooling system passes through the pads prior to contacting the condenser coil. The adiabatic cooling system includes a vibration device attached to each adiabatic pad. A controller is communicatively coupled to the vibration device for each of the adiabatic pads. The controller determines that cleaning of the adiabatic pads is needed. In response to detecting cleaning is needed, the controller causes the vibration device attached to each adiabatic pad to vibrate, thereby causing debris in the one or more adiabatic pads to become loosened and/or removed from the adiabatic pads.
Steam injection heater with integrated cleaning mechanism
A direct contact steam injection heater that includes a stem plug that is rotatable over 360°. The stem plug is connected to an actuator that is operable to rotate the stem plug over 360° of rotation during both the heating function of the steam injection heater and during a clean-in-place process. The stem plug includes a regulating head having a pair of sealing inserts formed on each of a pair of sealing faces. The sealing inserts are biased outward into contact with an inner surface that includes the steam injection nozzles. As the regulating head rotates between a closed position and an open position, the nozzles are exposed to allow steam to flow into the product being heated. The regulating head further includes a pair of foils. During the clean-in-place operation, the foils create a turbulent flow of cleaning liquid within the steam chamber.
COOLING ARRANGEMENT COMPRISING A CLOSED LOOP, A SEMI-OPEN LOOP AND AT LEAST ONE FAN
Cooling arrangement and method for cooling of a heat source. The cooling arrangement comprises a closed loop, a semi-open loop and at least one fan. The closed loop comprises a primary side of a liquid-to-liquid heat exchanger receiving a first cooling fluid heated by the heat source, a first air-to-liquid heat exchanger downstream said primary side, and a first pump returning the first cooling fluid to the heat source. The semi-open loop comprises a tank storing a second cooling fluid, a second pump drawing the second cooling fluid from the tank, a secondary side of the liquid-to-liquid heat exchanger receiving the second cooling fluid from the second pump, an evaporating pad downstream said secondary side, and an inlet fluidly connected to a source of the second cooling fluid. The at least one fan causes an air flow through the evaporating pad and through the first air-to-liquid heat exchanger.
HEAT EXCHANGING ASSEMBLY
A heat exchanging assembly, comprising a heat exchanger core body. The heat exchanger core body comprises first-type plates and second-type plates; each first-type plate has a first orifice, a second orifice, and a third orifice; each second-type plate has a first orifice and a second orifice; along the length or width direction of the heat exchange core body, the third orifice is located between the first orifice and the second orifice; a first flow channel has a first partial fluid path, a second partial fluid path, a third partial fluid path, and an inter-plate path; the first partial fluid path is formed at the first orifice; the second partial fluid path is formed at the second orifice; and the inter-plate path is communicated with the first partial fluid path, the second partial fluid path, and the third partial fluid path.
HEAT EXCHANGING ASSEMBLY
A heat exchanging assembly, comprising a heat exchanger core body. The heat exchanger core body comprises first-type plates and second-type plates; each first-type plate has a first orifice, a second orifice, and a third orifice; each second-type plate has a first orifice and a second orifice; along the length or width direction of the heat exchange core body, the third orifice is located between the first orifice and the second orifice; a first flow channel has a first partial fluid path, a second partial fluid path, a third partial fluid path, and an inter-plate path; the first partial fluid path is formed at the first orifice; the second partial fluid path is formed at the second orifice; and the inter-plate path is communicated with the first partial fluid path, the second partial fluid path, and the third partial fluid path.