Patent classifications
F28F27/00
RADIATOR VALVE
There is provided a radiator valve including a pipe, a valve member mounted inside of the pipe for controlling fluid flow through the pipe, a control element exposed on a side of the pipe for controlling the valve member, and a nut with female threads. The pipe includes first and second opposing ends, the first end being a male connector that includes male threads for screwing into a radiator, and the second end retaining the nut with the female threads. There is further provided a radiator including two of the radiator valves, and methods of removing and replacing a radiator core of a radiator.
TOOL KIT FOR DETECTING LEAKAGES IN TUBES
A tool kit for testing and detecting a leakage in a tube having a cylindrical body is disclosed herein. The tool kit of the present invention comprises an inlet member and an outlet member which are going to attached with the extreme ends of the tube through a threaded mechanism. The one end of both inlet member and outlet member has a tapered structure that allows the easy insertion of both members in the openings of the tube. The tool kit further includes a fluid pump that pumps the fluid in the tube, wherein the fluid is inserted through the inlet member of the tool kit. A pressure monitoring unit is also provided with the fluid pump that measures the pressure inside the tube in real time. Furthermore, the outlet member includes a handle whose function is to control the pressure inside the tube during the testing process.
Heat dissipation assembly and electronic device
A heat dissipation assembly can be applied to the electronic device. By providing a heat dissipation fan and a temperature sensor for the heat dissipation assembly, and arranging the heat dissipation assembly in an accommodation space defined by a processor cover plate and a control mainboard, the heat dissipation fan can improve a heat dissipation effect on the processor by utilizing air flow generated by the heat dissipation fan in the accommodation space in cooperation with heat dissipation openings in the processor cover plate.
Heat dissipation assembly and electronic device
A heat dissipation assembly can be applied to the electronic device. By providing a heat dissipation fan and a temperature sensor for the heat dissipation assembly, and arranging the heat dissipation assembly in an accommodation space defined by a processor cover plate and a control mainboard, the heat dissipation fan can improve a heat dissipation effect on the processor by utilizing air flow generated by the heat dissipation fan in the accommodation space in cooperation with heat dissipation openings in the processor cover plate.
THERMAL CONTROL APPARATUS FOR LASER SYSTEM
A thermal control apparatus including a body defining a centerline axis extended along a height and a circumferential direction extended relative to the centerline axis. The body forms a flow circuit therethrough, an inlet opening, and an outlet opening each in fluid communication with the flow circuit. The flow circuit is extended in parallel flow arrangement along the circumferential direction from the inlet opening to the outlet opening. A cavity is extended at least partially through the body along the centerline axis. A thermal control system includes the thermal control apparatus, a fluid flow device configured to provide a flow of heat transfer fluid to the apparatus through the inlet opening and to receive the flow of heat transfer fluid from the outlet opening of the apparatus, and a flow conduit providing fluid communication of the flow of heat transfer fluid between the fluid flow device and the apparatus.
EXHAUST HEAT RECOVERY FROM A MOBILE POWER GENERATION SYSTEM
A system and a method for heating source fluid, comprising: a turbine-electric generator transport comprising: an inlet plenum and an exhaust collector; a turbine connected to the inlet plenum and the exhaust collector; and an electric-generator coupled to the turbine; an exhaust heat recovery transport comprising: a combustion air connection coupled to the inlet plenum; an exhaust air connection coupled to the exhaust collector; a heat transfer assembly coupled to the exhaust air connection; and a fluid system coupled to the heat transfer assembly; an inlet and exhaust transport comprising: an air inlet filter housing coupled to the combustion air connection; and an exhaust stack coupled to the exhaust air connection.
EXHAUST HEAT RECOVERY FROM A MOBILE POWER GENERATION SYSTEM
A system and a method for heating source fluid, comprising: a turbine-electric generator transport comprising: an inlet plenum and an exhaust collector; a turbine connected to the inlet plenum and the exhaust collector; and an electric-generator coupled to the turbine; an exhaust heat recovery transport comprising: a combustion air connection coupled to the inlet plenum; an exhaust air connection coupled to the exhaust collector; a heat transfer assembly coupled to the exhaust air connection; and a fluid system coupled to the heat transfer assembly; an inlet and exhaust transport comprising: an air inlet filter housing coupled to the combustion air connection; and an exhaust stack coupled to the exhaust air connection.
PARABOLICALLY DEFORMING SECTOR PLATE
A method for producing a sector plate for a rotary heat exchanger is disclosed. The method includes defining overall dimensions of a sector plate. A number of a plurality of tapered ribs to be included on the top surface is determined based on a surface area of the sector plate and/or a sealing to be provided by the sector plate. Additionally, a root height of the plurality of tapered ribs is determined based on at least a plate thickness of the sector plate and the number of the plurality of tapered ribs. With the root height, the plurality of tapered ribs cause the sector plate to deform parabolically in response to an actuation. The plurality of tapered ribs also return the sector plate to a rest position and the sector plate supports its weight in a cantilevered fashion when in the actuated position and the rest position.
Substrate processing apparatus, and temperature control method
A substrate processing apparatus includes a stage on which a substrate is placed, wherein the stage includes a first plate, a first temperature adjustment mechanism configured to control a temperature of the first plate, a second plate provided below the first plate, a second temperature adjustment mechanism configured to control a temperature of the second plate, and a fastening member configured to fasten the first plate and the second plate.
Substrate processing apparatus, and temperature control method
A substrate processing apparatus includes a stage on which a substrate is placed, wherein the stage includes a first plate, a first temperature adjustment mechanism configured to control a temperature of the first plate, a second plate provided below the first plate, a second temperature adjustment mechanism configured to control a temperature of the second plate, and a fastening member configured to fasten the first plate and the second plate.