Patent classifications
F28F2200/00
Devices for modulation of temperature and light based on phase change materials
Devices that incorporate phase change materials in containment vessels promote conduction of thermal energy between the phase change materials within the containment vessels and the surrounding air. In some embodiments, the containment vessels are transparent to enable visual awareness of the operation and functionality of the PCMs. In some embodiments, the containment vessels are design to passively promote air flow across the surfaces of the containment vessels. In some embodiments, the containment vessels include embedded structures to promote the conduction of thermal energy to and from the interior of the containment vessel. In some of these embodiments, the intent is to target the location of crystal ‘seeds’ and control crystal growth, thus gaining greater control over thermal transfer.
Cooling water monitoring and control system
A method of controlling cooling water treatment may involve measuring operating data of one or more downstream heat exchangers that receive cooling water from the cooling tower. For example, the inlet and outlet temperatures of both the hot and cold streams of a downstream heat exchanger may be measured. Data from the streams passing through the heat exchanger may be used to determine a heat transfer efficiency for the heat exchanger. The heat transfer efficiency can be trended over a period of time and changes in the trend detected to identify cooling waterfouling issues. Multiple potential causes of the perceived fouling issues can be evaluated to determine a predicted cause. A chemical additive selected to reduce, eliminate, or otherwise control the cooling water fouling can be controlled based on the predicted cause of the fouling.
METHOD AND SYSTEM FOR THERMOGRAPHIC ANALYSIS
A method for thermographic analysis of a heat exchanger having at least a primary and a secondary fluid path and a system to perform the analysis. The method includes: heating and cooling of the heat exchanger in a heat exchanger cycle by passing fluid through the heat exchanger fluid paths; capturing a thermographic image of at least a portion of the heat exchanger; analysing the thermographic image; and determining a status of the heat exchanger based on the analysis of the image.
Heat exchanger testing device
An apparatus and a process for testing fluid from a heat exchanger. A first fluid from a heat exchanger to be tested is passed through a test heat exchanger. A second fluid is circulated through the test heat exchanger with a pump. The second fluid is heated with a heater so that a temperature in the test heat exchanger can be controlled, for example, to so that conditions in the heat exchanger are close to the conditions in the heat exchanger. After a period of time, the test heat exchanger can be removed and inspected, tested, or both. Also, multiple test heat exchangers may be used to test various process conditions. Additionally, the test heat exchangers may include different materials to test various materials.
Tube Transition
A tube transition fitting includes a body having a scalloped end having a raised portion and a depressed portion connected by a continuously sloping transition portion. The fitting is formed having a first wall thickness and a second wall thickness. A tube seat is formed on a surface connected to the body, the surface being adjacent a transition from the first wall thickness to the second wall thickness. A tube transition assembly includes a header portion, the tube transition fitting, and a heat exchange tube, each being connected using one or more simplified and/or heat-optimized connections.
AIRFLOW SENSOR FOR A HEAT SINK
An airflow sensor for a heat sink has a first portion having a first electrical point of contact, a second portion have a second electrical point of contact, and a deformable portion made of an electroactive material electrically coupled to the first and second portions. The deformable portion has first electrical properties measured between the first and second electrical points of contact when there is no airflow and the deformable portion is in a first position, and has second electrical properties different than the first electrical properties when a source of airflow blows air against the deformable portion, thereby causing the deformable portion to extend to a second position farther away from the source of airflow than the first position. The airflow sensor can be incorporated into a heat sink for an electronic component.
LEAK TESTING METHOD AND APPARATUS FOR USE WITH HEAT EXCHANGERS
The apparatus is used for testing heat exchangers having mutually separate first and second flow paths. The apparatus provides a high pressure fluid source (10) to connect with a first pressure-sealed flow path of the heat exchanger under test. A volumetric sensor (VS) is connected to a selected pressure-sealed flow path, having a sensing chamber arranged to receive fluid from the selected flow path. The sensing chamber is connected to a further fluid source such as a compressed air reservoir (16) which provides a high pressure gas supply. Movement of a magnetic float within the sensing chamber is detected by an array of Hall effect sensors, enabling a CPU to calculate the rate of leakage between the two flow paths which may be signaled to a local display and/or alarm or remotely via an internet connection.
Temperature Forcing System and Method with Conductive Thermal Probes
A temperature-controlled fluid forcing system includes a temperature control system generating a stream of flowing temperature-controlled fluid. A heat exchanger includes a thermally conductive housing within which a plurality of walls define a shaped flow space. The stream of temperature-controlled fluid flows through the shaped flow space and is in thermal communication with the housing. A thermally conductive probe is in thermal communication with the exterior of the housing of the heat exchanger, the thermally conductive probe comprising a thermally conductive protrusion in thermal communication with the exterior of the housing of the heat exchanger, such that, when the thermally conductive probe makes contact with a device under test (DUT), heat is conducted to or from DUT.
HEATER ELEMENT HAVING TARGETED DECREASING TEMPERATURE RESISTANCE CHARACTERISTICS
A heater is provided that includes at least one resistive heating element having a material with a non-monotonic resistivity vs. temperature profile and exhibiting a negative dR/dT characteristic over a predetermined operating temperature range along the profile. The heater can include a plurality of circuits disposed in a fluid path to heat fluid flow.
EVAPORATOR ASSEMBLIES AND HEAT PUMP SYSTEMS INCLUDING THE SAME
Disclosed herein are evaporator assemblies for heat pump systems. The evaporator units can comprise a housing defining an interior chamber, an air inlet and an air outlet. The air inlet and the air outlet can form an air flow path through the interior chamber, and an evaporator unit can be positioned within the interior chamber such that the air flow path contacts the evaporator unit. The air inlet having a semi-circular cross section through which air flows into the interior chamber, the semi-circular cross section having a straight edge and a curved edge. A velocity magnitude of the air flowing from the air inlet into contact with the evaporator unit can deviate less than 0.1 m/s from the average air velocity across the surface area of the evaporator.