A combined heat sink has multiple dissipation fins serially mounted together. Each one of the dissipation fins has a body and two flanges. The body has at least one through hole formed through the body. The two flanges are respectively formed on one of two surfaces of the body, and have at least one connecting arm. Multiple protrusions protrude on the at least one connecting arm, and a width of the at least one through hole is smaller than a total width of the at least one connecting arm and the multiple protrusions. When the multiple dissipation fins are mounted together, the protrusions of the at least one connecting arm of each dissipation fin pass through the at least one through hole of an adjacent one of the dissipation fins, and abut an area near the at least one through hole to avoid separations of the dissipation fins.

Embodiments provide a helical layer structure including: a helical core member which is formed of a flexible, lengthy, flat plate-like core member and which is formed of a steel plate made of a metal material, such as iron; and a polymeric coating layer which is formed of a polymeric material such as a thermosetting elastic material or a thermoplastic elastic material, and which coats the helical core member. The manufacturing method of the helical layer structure includes: a feeding step of feeding a core member having flexibility; a supply step of supplying the polymeric material having fluidity; a coating step of coating the core member with the polymeric material; a cooling step of cooling a coated intermediate which is coated with the polymeric material; and a helix formation step of helically twisting the coated intermediate to form the helical layer structure.

A cryocooler includes an expansion chamber, a cooling stage thermally coupled to the expansion chamber, the cooling stage including a first heat transfer block provided with a surface exposed to the expansion chamber and a first heat exchange surface disposed outside the expansion chamber and a second heat transfer block provided with a second heat exchange surface facing the first heat exchange surface, a refrigerant supply port installed in the cooling stage outside the expansion chamber, a refrigerant discharge port installed in the cooling stage outside the expansion chamber, and a refrigerant path fluidically separated from the expansion chamber, the refrigerant path being formed between the first heat transfer block and the second heat transfer block such that a refrigerant flows from the refrigerant supply port to the refrigerant discharge port along the first heat exchange surface and the second heat exchange surface.

An aluminum alloy fin material and a heat exchanger having excellent moldability, strength, resistance to brazing erosion and durability are provided. The aluminum alloy fin material has a composition comprising Mn: 1.8 to 2.5%, Si: 0.7 to 1.3%, Fe: 0.05 to 0.3%, Cu: 0.14 to 0.30%, Zn: 1.3 to 3.0%, with the balance being Al and inevitable impurities, wherein a ratio Mn/Si in terms of content is in a range of 1.5 to 2.9, and the aluminum alloy fin material has a solidus temperature of 610 C. or more, a tensile strength before brazing of 220 to 270 MPa, has a crystal grain structure before brazing of a non-recrystallized grain structure, and has a tensile strength after brazing of 160 MPa or more, an electrical conductivity after brazing of 40% IACS or more and an average crystal grain size in a rolled surface after brazing of 300 m to 2,000 m.

A heat exchanger module including: a hollow chamber having an inner volume configured through which flows a first fluid in fluidic communication with a source of the first fluid, and a fluid outlet; a hollow enclosure extending outwardly from a surface of the hollow chamber wherein the hollow enclosure includes an inner volume through which flows a second fluid that undergoes a phase change in an operative mode of the heat exchanger module, wherein the hollow enclosure is in fluidic communication with a source of the second fluid, and an enclosure root of the hollow enclosure is inserted in the hollow chamber extending into the inner volume such that in an operative mode a second fluid flowing through the hollow chamber from the inlet to the outlet bathes the outer surface of said enclosure root.

A radiating fin and a connection structure composed of multiple radiating fins. Each radiating fin has a main body formed with a first plane face. A first bending edge and a second bending edge extend from two sides of the first plane face. The first plane face is formed with a first perforation and a second perforation and a third perforation and a fourth perforation. A first extension section and a second extension section respectively from the first and second bending edges. Two front ends of the first extension section are bent and formed with a first latch plate and a second latch plate. Two front ends of the second extension section are bent and formed with a third latch plate and a fourth latch plate. The latch plates of a forward radiating fin are correspondingly passed through and latched in the perforations of an adjacent rearward radiating fin.

A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member that includes a first number of inlet ports and a second number of outlet ports that are in fluid communication with a cooling liquid flow path defined through the heat transfer member, the first number of inlet ports being different that the second number of outlet ports.

According to various embodiments, there is provided a heat sink including: a heat conducting surface; a plurality of nozzle arrays arranged such that output ends of nozzles of the plurality of nozzle arrays face the heat conducting surface; and a plurality of fins configured to at least partially surround a respective portion of the heat conducting surface facing a respective nozzle array of the plurality of nozzle arrays.

An assemblable cooling fin assembly includes a plurality of cooling fins. Each of the cooling fins includes a base plate, a first side plate, a second side plate and a first engaging protrusion. The base plate has a first engaging slot. The first side plate and the second side plate are respectively connected to two opposite sides of the base plate. The first engaging protrusion has a connecting end and a deformable end opposite to each other. The connecting end is connected to the first side plate. In addition, the first engaging protrusion of one of the plurality of cooling fins is disposed through the first engaging slot of another one of the plurality of cooling fins, and the deformable end of the first engaging protrusion is deformed so as to become wider than the first engaging slot.

The disclosure relates to plate-fin and manifold assemblies for heat exchangers. In some examples, an assembly includes a first plate and a second plate. The assembly also includes a plurality of fins disposed between the first plate and the second plate. In addition, the plurality of fins are spaced apart by a width large enough adapted for counter-flow of a plurality of fluids between adjacent fins of the plurality of fins. Further, the plurality of fins are configured to direct fluid flow across a length of the first plate and the second plate.