A shell heat dissipating structure of a small form-factor transceiver includes a hollow shell and a heat dissipating structure. The hollow shell has a setting surface disposed on the outside; the setting surface is formed along an extending direction of the hollow shell. The heat dissipating structure has plural fins formed along the extending direction of the hollow shell and spaced on the setting surface; a plurality of channels is formed among the fins. Each of the fins is formed by plural projecting portions and recess portions disposed along the extending direction and alternated continuously such that the channels among the fins communicate with each other through the recess portions.

The present disclosure is to provide a heatsink that can improve heat radiation performance of a heat radiating fin while preventing dry-out of a heat receiving portion and that can equalize a heat input in the heat receiving portion in an environment in which an installation space of the heatsink is limited even when a forbidden region exists in the installation space. A heatsink including: a heat transport member having a heat receiving portion thermally connected to a heating element; and a heat radiating fin group which is connected to a heat radiating portion of the heat transport member and in which a plurality of heat radiating fins is arranged, wherein the heat transport member has an integral internal space that communicates from the heat receiving portion to the heat radiating portion and that is filled with a working fluid, a wick structure extended from the heat receiving portion to the heat radiating portion is housed in the internal space of the heat transport member, and the heat transport member has a heat radiating-side step portion, in which a step is provided in a direction that is not a direction parallel to a heat transport direction of the heat transport member, between a heat insulating portion placed between the heat receiving portion and the heat radiating portion and the heat radiating portion, the heat radiating portion being placed on a side of an installation surface of the heatsink compared to the heat insulating portion.

An aluminum alloy heat exchanger includes a core material formed of an aluminum alloy comprising Mn of 0.60 to 2.00 mass % and Cu of 1.00 mass % or less, with the balance being Al and inevitable impurities, and a sacrificial anode material formed of an aluminum alloy comprising Zn of 2.50 to 10.00 mass %, with the balance being Al and inevitable impurities. Pitting potential of a sacrificial anode material surface of a tube of the aluminum alloy heat exchanger in a 5% NaCl solution is −800 (mV vs Ag/AgCl) or less, and pitting potential of an aluminum fin of the aluminum alloy heat exchanger in a 5% NaCl solution is less than the pitting potential of the sacrificial anode material surface of the tube of the aluminum alloy heat exchanger in a 5% NaCl solution.

A method includes forming an electronics housing defining a first flow path spaced apart from the second flow path for heat exchange through the housing between the first and second flow paths. The electronics housing is of a first material. The method includes depositing a heat exchange fin on the electronics housing. The heat exchange fin is of a second material different from the first material, wherein the heat exchange fin is grown into the second flow path to facilitate heat exchange between the first flow path and the second flow path.

A heat exchanger has flow channels for coolants, which flow channels include turbulence elements having a different flow resistance depending on a direction of a flow, wherein the flow can be passed through the heat exchanger in different directions. As part of a method of operating the heat exchanger, the heat exchanger is flowed through in different directions using a pump that can be operated in different directions.

Methods and systems are provided for heat transfer from a process fluid, such as humid air, to liquid droplets that are generated by contact of a heat transfer surface with the process fluid. The heat transfer surface rapidly ejects liquid droplets, which may then be coalesced and removed, thereby cooling the process fluid. Enhanced methods of condensate collection are described.

The present disclosure relates to a fin heat exchanger, including a header, a set of tubes fluidly coupled to the header, and a mount configured to engage with and disengage from the set of tubes. The mount includes a fin section configured to extend between adjacent tubes of the set of tubes in an engaged mount configuration, and configured to be separated from the set of tubes in an unengaged mount configuration.

A cooling apparatus for an electrical component housing includes a fin configured to attach to the electrical component housing so as to conduct heat and cool the electrical component housing. The fin includes a first longitudinal portion and a second longitudinal portion, a first end, and a second end portion connecting the first and second longitudinal portions at a second end, the first longitudinal portion and the second longitudinal portion being disposed at a predetermined siatnce from each other at the first end, and the second end portion having a width that is greater than the predetermined distance.

A thermal component has a shield portion and a heat exchanger portion. The shield portion includes a plurality of cells adapted to inhibit radio radiation (RF) having a frequency within a target frequency range, while the heat exchanger portion includes a plurality of elongated channels, each one of the elongated channels being physically connected to and in fluid communication with at least one corresponding cell of the plurality of cells.

The present disclosure provides a heatsink that can increase a fin area of a heat radiating fin while securing sufficient volumes of a heat receiving portion, heat insulating portion, and heat radiating portion even in an environment in which an installation space for the heatsink, more specifically, an installation space in a height direction of the heatsink is limited. A heatsink including: a heat transport member having a heat receiving portion thermally connected to a heating element; a pipe body connected to a heat radiating portion of the heat transport member; and a heat radiating fin group which is thermally connected to the pipe body and in which a plurality of heat radiating fins is arranged, wherein the heat transport member has an integral internal space that communicates from the heat receiving portion to a connection portion with the pipe body and that is filled with a working fluid, the internal space of the heat transport member communicating with an internal space of the pipe body, and a cross-sectional area of an internal space in a direction orthogonal to a heat transport direction of the heat transport member in the heat radiating portion is smaller than the cross-sectional area in a heat insulating portion between the heat receiving portion and the heat radiating portion.