Patent classifications
F28F2230/00
HEAT EXCHANGER
The present disclosure relates to a heat exchanger including a plurality of fluid guiding metal pipes (2) having pipe ends (3) arranged side by side at intervals, at least one pipe bottom (4) made of plastic and having receiving through-holes (5) in which the pipe ends (3) may be received, and a collection box (6) made of plastic and which may be connected to the pipe bottom (4) by a locking device formed between the pipe bottom and the collection box, wherein a seal (9) may be inserted between the pipe bottom (4) and the collection box (6), and the seal ensures press-fit of the pipe bottom (4) on the pipe ends (3) and seals the collection box (6) against the pipe bottom (4) and the pipe bottom (4) against the pipe ends (3).
SEALING A HEAT PIPE
Examples are disclosed that relate to sealing a heat pipe. One example provides a heat pipe including a heat pipe body having a sealed end at which opposing interior surfaces of the heat pipe body are joined, a sealant located in a least a portion of the sealed end of the heat pipe body between the opposing interior surface, the sealant having a higher oxygen transport rate than the heat pipe body, and a permanent seal forming an outer surface of the sealed end.
INTERNAL HEAT EXCHANGER
An internal heat exchanger for an air conditioning system of a vehicle comprising an intermediate portion and two end portions, each of the end portions comprises a first opening for the passage of a first conditioning fluid inside the internal heat exchanger and a second opening for the passage of a second conditioning fluid inside the heat exchanger. The intermediate portion being hollow and defining an inner volume, the intermediate portion further comprising a plurality of ducts housed inside the inner volume extending between the end portions, the first opening being fluidically connected via respective ducts to each of the ducts, the second opening being fluidically connected to the inner volume via an individual duct.
HEAT EXCHANGER
The present disclosure relates to a heat exchanger that is characterized by including at least one collector and at least one tube, in which case the tube is installed in the collector by at least one seal disposed between the collector and the tube in such a manner that fluid connection is possible between the collector and the tube, wherein the tube includes at least one reinforcing element. The present disclosure also relates to a method of installing a heat exchanger and a method of manufacturing a heat exchanger, in which case at least one tube is installed in at least one collector by at least one seal disposed between the collector and the tube in such a manner that fluid connection is possible between the collector and the tube, wherein at least one reinforcing element is provided in or to the at least one tube.
COOLING APPARATUS
The present invention is a cooling apparatus, and a cooling apparatus according to one embodiment of the present invention comprises: a cooling unit comprising a tube main body formed by extrusion such that a coolant channel through which a coolant flows is formed there-through, and headers which are connected to the respective ends of the tube main body and, when a plurality of the tube main bodies are stacked, a plurality of the headers can be assembled in the vertical direction so as to connect the coolant channels of each of the tube main bodies; double-sided chip modules which are disposed between cooling units such that both surfaces of the double-sided chip modules are able to contact the cooling units; and a heat-radiating adhesion unit which attaches the double-sided chip modules to the tube main bodies, wherein the headers are assembled so as to be in close contact, in the vertical direction, ensuring a set spacing between the tube main bodies and the double-sided chip modules, the set spacing being not greater than the thickness of the heat-radiating adhesion unit.
Gasket, apparatus incorporating same and method
This invention relates to gaskets, apparatus incorporating said gaskets and to methods of using them. In particular, there is provided a gasket comprising a closed loop of resilient material, the loop having an inner periphery and an outer periphery, the gasket having a first thickness at a first position which is between 0% and 30% of the gasket width away from the outer periphery, a second thickness at a second position measured at a point at least 50% of the gasket width from the first position, and a third thickness at a third position intermediate the first and second positions and at least 10% of the gasket width from each, the first thickness being greater than the third thickness which is greater than the second thickness, and wherein either a said gasket reduces in thickness from the first thickness to the third thickness and then to the second thickness via one or more tapered sections which taper linearly to a reduced thickness in the direction towards the inner periphery, or b said gasket reduces in thickness from the first thickness to the third thickness via one or more steps which step to a reduced thickness in the direction towards the inner periphery and then from the third thickness to the second thickness via one or more steps which step to a reduced thickness in the direction towards the inner periphery, or c said gasket reduces in thickness from the first thickness to the third thickness and then to the second thickness via a combination of one or more steps and one or more tapered sections as defined above.
Supercharged air cooling apparatus
The invention, which relates to a device for charge-air cooling, has as its objective to specify a device that can be produced simply and cost-effectively and that ensures reliable functionality. This task is resolved according to the invention thereby that the housing comprises a capping that closes off the housing in which is disposed an inflow and an outflow.
Heat exchanger for cooling multiple layers of electronic modules
A stacked-plate heat exchanger for cooling a plurality of heat-generating electronic components arranged in a plurality of layers comprises a stack of flat tubes defining a plurality of parallel fluid flow passages, the tubes being separated by spaces for receiving the electronic components. One or more flow-restricting ribs is arranged within at least some of the fluid flow passages to partially block fluid flow between at least one the manifolds and the heat transfer area by reducing the height of the fluid flow passage outside the heat transfer area, along at least a portion of the width of the fluid flow passage, in order to improve the flow distribution of a heat transfer fluid between and within the fluid flow passages of the heat exchanger, and to minimize bypass flow at the outer edges of the fluid flow passage.
Torsional heat pipe
Particular embodiments described herein provide for an electronic device that can be configured to include a torsional heat pipe. The torsional heat pipe can include a first housing static portion located in a first housing of an electronic device, where the first housing static portion is coupled to a heat source, a second housing static portion located in a second housing of the electronic device, where the second housing static portion is coupled to a heat spreader, and a torsion portion located in a hinge of the electronic device, where the hinge rotatably couples the first housing to the second housing and the torsion portion rotates as the second housing rotates relative to the first housing and the torsion portion couples the first housing static portion to the second housing static portion.
MANUFACTURING METHOD FOR VAPOR CHAMBER WITHOUT INJECTION TUBE AND APPARATUS THEREOF
A manufacturing method for a vapor chamber without an injection tube and an apparatus thereof, includes the steps of preparing two plates for covering onto each other to form a vapor chamber housing, injecting a working fluid between the two plates, and further preparing a sealed space having a refrigeration device installed therein, and then placing the two plates having the working fluid injected therein onto the refrigeration device, thereby maintaining a temperature of the working fluid below a boiling point under a vacuum state; next, performing evacuation on the sealing space, and then sealing perimeters of the two plates. Consequently, a vapor chamber without any injection tube can be obtained through such manufacturing method.