A retaining structure-based heat transfer and dissipation system and a wind generator set are provided. The heat transfer and dissipation system includes a envelop enclosure and power transmission cables that are laid along the vertical direction of the inner wall of the envelop enclosure. The power transmission cables are laid in a shady surface region of the envelop enclosure. The system effectively lowers the surface temperature of the power transmission cables in the envelop enclosure, prolongs the service life of the power transmission cables, and ensures the operation safety of power transmission. The over-temperature problem of the power transmission cables in a tower drum of the wind generator set in a high-temperature natural geographical environment is resolved in a green and zero-energy consumption manner, and the system safety of power transmission is improved.

Oleophobic and/or philic surface(s) are utilized for oil separation, direction, and/or collection in a refrigeration system. Surfaces of component(s) of a refrigeration system (compressor, oil separator, evaporator, etc.) are produced to be oleophobic or philic. The oleophobic and/or philic surfaces are utilized to direct a flow path of oil within the refrigeration system or to prevent oil connection in an area. Refrigerant phobic and/or lubricant phobic material(s) also may be utilized to help promote separation of refrigerant vapor from refrigerant liquid and/or from oil in refrigeration systems.

A heat exchanger having a polyamine on at least part of a surface of the heat exchanger. The existence of polyamine on the surface of the heat exchanger allows the odor components to be temporality held by virtue of the action of polyamine, and the odor components are not released into an interior room or the like at once in conjunction with the evaporation of free water (such as condensed water). Thus, the release of odor components is made moderate, and changes in the concentration of odor components in the interior room are reduced, so that strong odors sensed by people are suppressed. A typical example of the polyamine is PEI, and a typical example of the heat exchanger is an evaporator used in a car air-conditioner.

Electronic devices are disclosed including hydrophobic or oleophobic coatings that control coolant flow therein or thereon. In at least one embodiment, a power inverter cold plate is provided including coolant inlet, a coolant outlet, a coolant flow spreading region, a coolant flow collection region, and a coolant heat-transfer region disposed therebetween; and one or more layers of a hydrophobic or oleophobic coating configured to control a flow of coolant in the cold plate. A method may include applying one or more layers of a hydrophobic or oleophobic coating to a power inverter cold plate to control a flow of coolant in the cold plate, the one or more layers being applied to one or more of a coolant flow spreading region, a coolant flow collection region, or a coolant heat-transfer region disposed therebetween. The layers may define coolant flow paths, eliminate recirculation zones, and/or prevent coolant leak paths.

A semiconductor microcooler is fabricated by forming fins in a semiconductor substrate and forming a metal layer upon the fins. A stacked microcooler may be formed by stacking a plurality of semiconductor microcoolers. The microcoolers may be positioned such that the fins of each microcooler are aligned. One or more microcoolers may be thermally connected to a surface of a coolant conduit that is thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the conduit and heat from the one or more microcoolers may transfer to the liquid coolant.

A semiconductor microcooler is fabricated by forming fins in a semiconductor substrate and forming a metal layer upon the fins. A stacked microcooler may be formed by stacking a plurality of semiconductor microcoolers. The microcoolers may be positioned such that the fins of each microcooler are aligned. One or more microcoolers may be thermally connected to a surface of a coolant conduit that is thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the conduit and heat from the one or more microcoolers may transfer to the liquid coolant.

A unit for exchanging heat between a working fluid and a heat transfer fluid by means of adsorption. The heat exchange unit comprises a tube hosting the heat transfer fluid and being surrounded by mass channel coils comprising a metallic spacer strip in physical contact with the tube for permitting heat conduction and a metal foil strip supported by the spacer strip, a width of the foil strip exceeding a width of the spacer strip in an axial direction of the tube. Additionally, a heat exchange system comprising a plurality of the heat exchange units is provided, and a method for manufacturing a heat exchange unit is provided.

A method for manufacturing a heat exchange unit for exchanging heat between a working fluid and a heat transfer fluid by means of adsorption. The heat exchange unit comprises a tube hosting the heat transfer fluid and being surrounded by mass channel coils comprising a metallic spacer strip in physical contact with the tube for permitting heat conduction and a metal foil strip supported by the spacer strip, a width of the foil strip exceeding a width of the spacer strip in an axial direction of the tube. Additionally, a heat exchange system comprising a plurality of the heat exchange units is provided.

A syngas loop boiler includes a casing that surrounds a tube bundle, wherein the tube bundle includes a plurality of tubes. One end of each of the tubes is joined to a tube-sheet provided with corresponding tube-sheet inlet holes for inletting the syngas in the boiler, wherein each tube-sheet inlet hole is internally provided with at least a protective sleeve welded at both ends to corresponding surfaces of the tube-sheet inlet hole. Each tube-sheet inlet hole is provided with a first respective weld overlay placed at the inlet mouth of the tube-sheet inlet hole, so that a first end of each protective sleeve is welded to the first weld overlay. Each tube-sheet inlet hole is internally provided with at least a bore groove that contains a respective in-bore second weld overlay, so that the second end of the protective sleeve is welded to the in-bore second weld overlay. Each protective sleeve is thus welded at both ends to respective weld overlays, with the possibility of removal and re-installation without performing any post weld heat treatment.

A heat exchanger includes a bag-like outer packaging material. A heat medium flows into an inside of the outer packaging material. An inner core material is arranged in the inside of the outer packaging material. The outer packaging material has an outer packaging laminate material including a metal heat transfer layer and a resin thermal fusion layer on a surface side of the heat transfer layer. The outer packaging laminate materials form a bag shape by integrally joining the thermal fusion layers along the peripheral edge portions. The inner core material includes the inner core laminate material with a metal heat transfer layer and resin thermal fusion layers on surface sides of the heat transfer layer. The thermal fusion layers of a concave portion bottom and a convex portion top of the inner core material and the thermal fusion layers of the outer packaging laminate material are integrally joined.