A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.

A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.

A heat exchanger includes a core having a plurality of first layers for receiving a first fluid and at least one header arranged in fluid communication with the plurality of first layers. The at least one header is integrally formed ith the core via an additive manufacturing process. The header has a first microstructure and the core has a second, different microstructure.

An active fluid cooled heatsink assembly for modular components is disclosed. The active fluid heatsink assembly includes a fluid cooled heatsink, the heatsink further comprising: an inlet, an outlet, and a surface, wherein fluid passing through the heatsink is received by the inlet at a first temperature and expelled from the outlet at a second temperature, wherein the second temperature is higher than the first temperature; and at least one resource adapter, each resource adapter further comprising a first surface having a shape which conforms to a corresponding electronic resource of at least one electronic resource and a second surface having a shape corresponding to at least a portion of the surface of the fluid cooled heatsink, wherein each resource adapter exchanges heat from the corresponding electronic resource to the fluid cooled heatsink, and wherein the at least one resource adapter is mounted on the surface of the fluid cooled heatsink.

One variation of a method for fabricating a dermal heatsink includes: fabricating a substrate defining an interior surface, an exterior surface opposite the interior surface, and an open network of pores extending between the interior surface and the exterior surface; activating surfaces of the substrate and walls of the open network of pores; applying a coating over the substrate to form a heatsink, the coating comprising a porous, hydrophilic material and defining a void network; removing an excess of the coating from the substrate to clear blockages within the open network of pores by the coating; hydrating the heatsink during a curing period; heating the heatsink during the curing period to increase porosity of the coating applied over surfaces of the substrate; and rinsing the heatsink with an acid to decarbonate the coating along walls of the open network of pores in the substrate.

An additively manufactured component includes a heat transfer augmentation feature with a surface finish between about 125-900 micro inches.

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages. The thermal module may also have a metal layer which may act as a shield for radiation or an antenna for radiation, or may add mechanical strength to the thermal module.

A condensation management apparatus comprises a first microstructured film arranged to condense water vapor on a substantially vertical surface of a component. The first film comprises channels disposed on first and second major surfaces of the first film and dimensioned to support capillary movement of condensate. The channels have a channel axis substantially parallel with a longitudinal axis of the first film. The longitudinal axis of the first film is tilted at a tilt angle of at least 4 degrees with respect to an axis normal to a direction of gravity. Openings in the channels are disposed at one or both end edges of the first film. The openings provide condensate release locations of the first film. A second film is disposed over a portion of the first film. The second film attaches the first film to the substantially vertical surface of the component.

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

Disclosed is a heat conductive sheet which comprises a flame retardant resin and a particulate carbon material, wherein the particulate carbon material has a particle size distribution in which a frequency of particles having a particle diameter of 30 m or more and 150 m or less is 20% or more, an amount of the particulate carbon material in the heat conductive sheet is 30% by mass or more, and a thickness of the heat conductive sheet is 50 m or more and 120 m or less. Preferably, the flame retardant resin is a combination of a flame retardant resin that is solid at ordinary temperature and ordinary pressure and a flame retardant resin that is liquid at ordinary temperature and ordinary pressure.