A multi-fluid heat exchanger includes at least three fluid inlets and at least three fluid channels. Each of the at least three fluid channels have a minimum dimension of no greater than 30 mm.

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

A cooling component and method for producing a cooling component, having an elongated cooling body made of metal or metal alloy, with which an object may be cooled, wherein the cooling body has one or more medium channels for the throughflow of cooling medium, and having a connection part, which is connected to the cooling body in a fluid-tight manner and via which the cooling medium can be supplied to the cooling body and/or via which the cooling medium can be discharged from the cooling body. The connection part is made from plastic to connect the connection part to the cooling body, a first, which has a plurality of cooling faces, each with three-dimensional nanostructures and/or microstructures incorporated by physical and/or chemical nanostructuring or microstructuring methods, is incorporated in the receiving space of a receptacle of the connection part and is connected to the receptacle there in a fluid-tight manner.

A heat sink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having a fractal variation therebetween, wherein the heat transfer fluid is induced to flow with respect to the plurality of fractally varying heat exchange elements such that flow-induced vortices are generated at non-corresponding locations of the plurality of fractally varying heat exchange elements, resulting in a reduced resonance as compared to a corresponding heat exchange device having a plurality of heat exchange elements that produce flow-induced vortices at corresponding locations on the plurality of heat exchange elements.

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages. The thermal module may also have a metal layer which may act as a shield for radiation or an antenna for radiation, or may add mechanical strength to the thermal module.

For dissipating heat a cladding includes a dissipation tape and a particle coating. The dissipation tape includes dissipation ridges that dissipate infrared radiation at a dissipation angle. The particle coating is deposited on the dissipation tape.

One variation of a method for fabricating a dermal heatsink includes: fabricating a substrate defining an interior surface, an exterior surface opposite the interior surface, and an open network of pores extending between the interior surface and the exterior surface; activating surfaces of the substrate and walls of the open network of pores; applying a coating over the substrate to form a heatsink, the coating comprising a porous, hydrophilic material and defining a void network; removing an excess of the coating from the substrate to clear blockages within the open network of pores by the coating; hydrating the heatsink during a curing period; heating the heatsink during the curing period to increase porosity of the coating applied over surfaces of the substrate; and rinsing the heatsink with an acid to decarbonate the coating along walls of the open network of pores in the substrate.

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages. The thermal module may also have a metal layer which may act as a shield for radiation or an antenna for radiation, or may add mechanical strength to the thermal module.

A microchannel heat exchanger (MCHX) includes an air-passage layer including a plurality of air-passage microchannels, a working fluid layer including a plurality of working fluid microchannels, and a sealing layer coupled to the working fluid layer to provide a working/sealing layer set. The working/sealing layer set includes an arrangement of raised pedestals. The raised pedestals may extend from the working fluid layer to the sealing layer and contact the sealing layer.

A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having a fractal variation therebetween, wherein the heat transfer fluid is induced to flow with respect to the plurality of fractally varying heat exchange elements such that flow-induced vortices are generated at non-corresponding locations of the plurality of fractally varying heat exchange elements, resulting in a reduced resonance as compared to a corresponding heat exchange device having a plurality of heat exchange elements that produce flow-induced vortices at corresponding locations on the plurality of heat exchange elements.