Patent classifications
F28F2260/00
WEARABLE COOLING SYSTEM FOR BODY COOLING AND METHOD FOR FABRICATING THE WEARABLE COOLING SYSTEM
One variation of a system includes a garment insert: configured to be worn across a dermal surface; including a textile panel defining a grid receptacle; and including a grid structure arranged within the grid receptacle and defining an array of apertures. The system further includes a cooling unit including a heatsink structure: defining a base section defining an inner surface configured to contact the dermal surface; and defining a set of heatsink columns extending from the base section, opposite the inner surface, and configured to seat extending through the array of apertures. The cooling unit: is configured to wick moisture from the dermal surface toward surfaces of the set of heatsink columns; and includes a polymer frame, bonded to the heatsink structure about the base section, configured to abut surfaces of the base section to surfaces of the grid receptacle to flexibly retain the cooling unit within the grid receptacle.
Microstructure reactor for carrying out exothermic heterogenously-catalysed reactions with efficient evaporative cooling
The invention relates to a micro-reactor for carrying out at least one catalytic reaction between two or more reactants in each case, comprising a stacking sequence of reaction surfaces (1) for carrying out at least one exothermic reaction, and a cooling region (6) divided at least into individual fields (6) with feed and discharge devices for the coolant.
HEAT EXCHANGER
A method of manufacturing a component susceptible to multiple failure modes includes generating a stereolithography file including a geometry of the component. The geometry of the stereolithography file is divided into a plurality of layers. Each of the layers includes a first portion and a second portion of the component. Energy from an energy source is applied to a powdered material such that the powdered material fuses to form the first portion and the second portion of each of the plurality of layers. Applying energy from the energy source to form the first portion of the plurality of layers includes operating the energy source with a first set of parameters and applying energy from the energy source to form the second portion of the plurality of layers includes operating the energy source with a second set of parameters. The first set and second set of parameters are different.
Heat exchanger
A method of manufacturing a component susceptible to multiple failure modes includes generating a stereolithography file including a geometry of the component. The geometry of the stereolithography file is divided into a plurality of layers. Each of the layers includes a first portion and a second portion of the component. Energy from an energy source is applied to a powdered material such that the powdered material fuses to form the first portion and the second portion of each of the plurality of layers. Applying energy from the energy source to form the first portion of the plurality of layers includes operating the energy source with a first set of parameters and applying energy from the energy source to form the second portion of the plurality of layers includes operating the energy source with a second set of parameters. The first set and second set of parameters are different.
HEAT EXCHANGER
A method of manufacturing a component susceptible to multiple failure modes includes generating a stereolithography file including a geometry of the component. The geometry of the stereolithography file is divided into a plurality of layers. Each of the layers includes a first portion and a second portion of the component. Energy from an energy source is applied to a powdered material such that the powdered material fuses to form the first portion and the second portion of each of the plurality of layers. Applying energy from the energy source to form the first portion of the plurality of layers includes operating the energy source with a first set of parameters and applying energy from the energy source to form the second portion of the plurality of layers includes operating the energy source with a second set of parameters. The first set and second set of parameters are different.
Fractal heat transfer device
A heat sink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having a fractal variation therebetween, wherein the heat transfer fluid is induced to flow with respect to the plurality of fractally varying heat exchange elements such that flow-induced vortices are generated at non-corresponding locations of the plurality of fractally varying heat exchange elements, resulting in a reduced resonance as compared to a corresponding heat exchange device having a plurality of heat exchange elements that produce flow-induced vortices at corresponding locations on the plurality of heat exchange elements.
HEAT EXCHANGER COIL ARRAY AND METHOD FOR ASSEMBLING SAME
A heat exchanger coil array includes at least six heat exchanger coils of an HVAC&R system for regulating a temperature of a structure, each heat exchanger coil being a separate and independent unit, where each heat exchanger coil is less than 75 pounds and capable of being moved within a passageway of the structure, the passageway having a width along at least a portion of the passageway of about 44 inches, and where an assembled heat exchanger coil array is incapable of being moved within the passageway.
MICROSTRUCTURE REACTOR FOR CARRYING OUT EXOTHERMIC HETEROGENOUSLY- CATALYSED REACTIONS WITH EFFICIENT EVAPORATIVE COOLING
The invention relates to a micro-reactor for carrying out at least one catalytic reaction between two or more reactants in each case, comprising a stacking sequence of reaction surfaces (1) for carrying out at least one exothermic reaction, and a cooling region (6) divided at least into individual fields (6) with feed and discharge devices for the coolant.
VARIABLE PIN HEAT SINK
Aspects of the disclosure include a heat sink having variable pins. An exemplary heat sink can include a plurality of pins extending from a surface of the heat sink. The plurality of pins can include a first pin and a second pin. The first pin can include a first set of pin features and the second pin can include a second set of pin features. The first set of pin features and the second set of pin features differ in at least one pin feature. The heat sink can be configured to remove heat from a component of a vehicle. The component can include an electric motor, a battery pack, and an inverter electrically coupled to the electric motor.
Flow channel member, and heat exchanger and semiconductor module each using same
A flow channel member according to the present invention includes a ceramic substrate, a flow channel inside the ceramic substrate through which a fluid flows, and multiple protrusions on an outer surface of the substrate.