A method of managing transient thermal stresses in a wall of a fluid-carrying or fluid-containing structure, the structure having a temperature ramp rate limit associated with its structure walls. The structure is provided with flow passages in the structure walls, and the temperature of the structure walls is monitored. If a rate of change of temperature of the structure walls becomes too high, fluid is circulated through the flow passages to heat or cool the structure wall during hot or cold transient thermal events, respectively.

Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.

A tank for a radiator. The tank includes an inlet port through which coolant enters the tank. A wall at least partially defines a cavity in fluid communication with the inlet port. A curved surface of the wall is opposite to the inlet port and reduces volume of the cavity at the inlet port. The curved surface is configured to reduce turbulence of coolant flowing into the cavity from the inlet port. At least one turning vane extends along the wall into the cavity from the inlet port. The at least one turning vane is curved to reduce turbulence of coolant flowing through the inlet port and into the cavity.

A heat dissipation module with a shock resisting effect is provided. The heat dissipation module includes a heat absorbing unit, a heat dissipating unit and at least one flexible heat conducting bundle. The heat absorbing unit has a first installing surface. The heat dissipating unit is disposed corresponding to the heat absorbing unit and has a second installing surface facing the first installing surface. The flexible heat conducting bundle is connected between the first installing surface and the second installing surface, and used for transferring heat of the heat absorbing unit to the heat dissipating unit to dissipate the heat. Accordingly, the heat dissipation module is provided with a flexible stretching function and a shock resisting effect.

A water replenishment device includes a water generator and a container. The water generator includes a seat body, a heat exchanger, and a thermoelectric cooler. The seat body has a fluid channel and a catchment hole. The catchment hole is in fluid communication with the fluid channel, and the fluid channel is configured for an environment airflow to pass therethrough. The heat exchanger is partially located in the fluid channel. The thermoelectric cooler has a cold surface and a hot surface. The cold surface of the thermoelectric cooler is thermally coupled to the heat exchanger. The container has a storage space. The storage space is in fluid communication with the fluid channel via the catchment hole. The thermoelectric cooler is configured to condense the environment airflow to a liquid, and the liquid is configured to be stored in the storage space via the catchment hole.

A heat exchanger includes: a heat recovery member through which a first fluid can flow; an inner cylinder configured to house the heat recovery member; an outer cylinder having a feed port capable of feeding a second fluid and a discharge port capable of discharging the second fluid, the outer cylinder being disposed on a radially outer side of the inner cylinder with a distance such that a flow path for the second fluid is formed between the outer cylinder and the inner cylinder; a feed pipe connected to the feed port; and a discharge pipe connected to the discharge port.

A stacked heat exchanger has a high temperature layer with a number of channels into which a high temperature-side fluid is introduced; and a low temperature layer superposed on the high temperature layer having a number of channels into which a low temperature-side fluid is introduced at a temperature lower than the temperature of the high temperature-side fluid. Each channel of the low temperature layer has an upstream-side part in which at least some of the low temperature-side fluid evaporates by being heated by the high temperature-side fluid flowing within the high temperature layer; and a downstream-side part in which the low temperature-side fluid that has evaporated in the upstream-side part is heated by the high temperature-side fluid flowing within the high temperature layer. The upstream-side parts of the low temperature layer occupy a total area smaller than a total area of the downstream-side parts of the low temperature layer.

A cross-flow heat exchanger for gas turbine engines which may be utilized to transfer heat from one fluid flow 46 to a second independent fluid flow wherein one of the fluid flows has a high differential inlet pressure and temperature. The heat exchanger has robust construction to inhibit mixing of the fluid flows during a single burst duct event.

A pressure vessel includes a first wall defining a container and a second wall surrounding the container defining a cavity between the first wall and the second wall. The pressure vessel also includes a vent in the second wall providing fluid communication between the cavity and an outside of the second wall and matter positioned within the cavity configured to prevent flame from propagating through the cavity while providing thermal conductivity between the first wall and the second wall.

Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.