A method and device for monitoring oil field operations with a fiber optic distributed acoustic sensor (DAS) that uses a continuous wave laser light source and modulates the continuous wave output of the laser light source with pseudo-random binary sequence codes.

A method and device for monitoring oil field operations with a fiber optic distributed acoustic sensor (DAS) that uses a continuous wave laser light source and modulates the continuous wave output of the laser light source with pseudo-random binary sequence codes.

This disclosure presents methods and systems to reduce measurement jitter of a resonating element. A time control is utilized to analyze the phase of a received frequency from the resonating element. Using that analysis, the time control can determine a next time point to direct the re-excitation of the resonating element. Through controlling when the resonating element is electrically excited, the measurement analyzer can determine a pressure or temperature at the location of the resonating element while accounting for remaining resonating energy from previous electrical excitations. The method and system can allow for measurements to be taken at a significantly faster rate while reducing uncertainty, e.g., jitter, in the collected measurements.

Embodiments of the Invention provide real-time portable, deployable data acquisition units and monitoring consoles that can be used in combination with radio communication technology to provide for monitoring of wildfires and local weather conditions to aid in fighting wildfires.

A high-frequency dynamic pressure transducer calibration system and method is provided. The method directs a source onto a diaphragm of a dynamic pressure transducer. An oscillating voltage at a target frequency (or range of frequencies) is generated. The oscillating voltage is coupled to an electrical connector of the dynamic pressure transducer. A deflection pattern of the diaphragm is recorded. The dynamic pressure transducer is calibrated by correlating magnitude of the deflection pattern with the oscillating voltage as a function of the target frequency (or range of frequencies).

At least one exemplary embodiment is directed to a communication device that includes a microphone configured to detect an acoustic signal from an acoustic environment, and a processor, configured to detect an acoustical dampening between the acoustic environment and the microphone, based on a change in a characteristic of the acoustic signal and, responsive to the acoustical dampening, apply a compensation filter to the acoustic signal to form a compensated acoustic signal that is reproduced. Other embodiments are disclosed.

At least one exemplary embodiment is directed to a communication device that includes a microphone configured to detect an acoustic signal from an acoustic environment, and a processor, configured to detect an acoustical dampening between the acoustic environment and the microphone, based on a change in a characteristic of the acoustic signal and, responsive to the acoustical dampening, apply a compensation filter to the acoustic signal to form a compensated acoustic signal that is reproduced. Other embodiments are disclosed.

A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.

A sensor package substrate disclosed in the present specification has a mounting area in which a sensor chip is mounted and a controller chip connected to the sensor chip. A through hole is formed in the sensor package substrate so as to overlap the mounting area in a plan view and to penetrate the substrate from one surface to the other surface thereof. The mounting area and the controller chip overlap each other in a plan view. According to the present invention, by reducing the thickness of an insulating layer, it is possible not only to reduce the distance of a wiring for the sensor chip and controller chip, but also to reduce the area of the substrate.

A micro-electro mechanical device includes a casing, a vibration sensor, a vibration membrane assembly, and a micro-electro mechanical microphone. The casing has a sound-receiving hole, and the vibration sensor is disposed in the casing. The vibration membrane assembly is disposed in the casing and corresponds to the vibration sensor. The micro-electro mechanical microphone is disposed in the casing and corresponds to the sound-receiving hole, and a back cavity of the micro-electro mechanical microphone is formed in the casing. The back cavity at least partially overlaps with areas corresponding to a vertical projection of the vibration membrane assembly.