G01H11/00

SYSTEMS AND METHODS FOR CAPTURING AND INTERPRETING AUDIO
20180068646 · 2018-03-08 ·

A device is provided as part of a system, the device being for capturing vibrations produced by an object such as a musical instrument. Via a fixation element, the device is fixed to a drum. The device has a sensor spaced apart from a surface of the drum, located relative to the drum, and a magnet adjacent the sensor. The fixation element transmits vibrations from its fixation point on the drum to the magnet. Vibrations from the surface of the drum and from the magnet are transmitted to the sensor. A method may further be provided for interpreting an audio input, such as the output of the sensors within the system, the method comprising identifying an audio event or grouping of audio events within audio data, generating a model of the audio event that includes a representation of a timbre characteristic, and comparing that representation to expected representations.

Infrasound detector with force transducer for negative feedback or calibration
12196602 · 2025-01-14 · ·

An infrasound detector for determining illicit nuclear explosions, comprising an infrasound transducer, signal feedback path, and feedback force transducer. The infrasound transducer is configured to transduce an infrasound signal to an electrical signal. The signal feedback path is arranged to feed a feedback signal from the infrasound transducer to a feedback force transducer. The feedback force transducer is configured to transduce a feedback electrical signal to a feedback force signal and arranged to provide the feedback force signal as input to the infrasound transducer, allowing seismic noise and/or environmental noise to be removed. The infrasound detector also allows for in-situ calibrations.

Infrasound detector with force transducer for negative feedback or calibration
12196602 · 2025-01-14 · ·

An infrasound detector for determining illicit nuclear explosions, comprising an infrasound transducer, signal feedback path, and feedback force transducer. The infrasound transducer is configured to transduce an infrasound signal to an electrical signal. The signal feedback path is arranged to feed a feedback signal from the infrasound transducer to a feedback force transducer. The feedback force transducer is configured to transduce a feedback electrical signal to a feedback force signal and arranged to provide the feedback force signal as input to the infrasound transducer, allowing seismic noise and/or environmental noise to be removed. The infrasound detector also allows for in-situ calibrations.

Systems and methods for capturing and interpreting audio

A device is provided as part of a system, the device being for capturing vibrations produced by an object such as a musical instrument. Via a fixation element, the device is fixed to a drum. The device has a sensor spaced apart from a surface of the drum, located relative to the drum, and a magnet adjacent the sensor. The fixation element transmits vibrations from its fixation point on the drum to the magnet. Vibrations from the surface of the drum and from the magnet are transmitted to the sensor. A method may further be provided for interpreting an audio input, such as the output of the sensors within the system, the method comprising identifying an audio event or grouping of audio events within audio data, generating a model of the audio event that includes a representation of a timbre characteristic, and comparing that representation to expected representations.

Ear model, artificial head, and measurement device using same, and measurement method
09800974 · 2017-10-24 · ·

Provided is a measurement device that evaluates an acoustic device 100 including a vibrating element and configured to allow sound to be heard by vibration transmission. The measurement device includes: an ear model unit 50 including an ear model 51 that is molded after a human ear and an artificial cartilage unit 54 that is joined to the ear model 51; and a vibration detector 56 disposed in the ear model unit 50.

Method and circuit for determining resonant frequencies of a resonant device

A method determines a resonance frequency of a resonant device. The method includes stimulating the resonant device with a periodic input signal having a frequency in a frequency interval; determining a frequency value for said periodic input signal in said frequency interval for which a phase-difference between said periodic input signal and a corresponding periodic output signal of the resonant device is minimum; generating a flag indicating that a resonance frequency has been determined; and generating signals representing said resonance frequency as a value of the frequency of said periodic input signal.

Method and circuit for determining resonant frequencies of a resonant device

A method determines a resonance frequency of a resonant device. The method includes stimulating the resonant device with a periodic input signal having a frequency in a frequency interval; determining a frequency value for said periodic input signal in said frequency interval for which a phase-difference between said periodic input signal and a corresponding periodic output signal of the resonant device is minimum; generating a flag indicating that a resonance frequency has been determined; and generating signals representing said resonance frequency as a value of the frequency of said periodic input signal.

Methods, algorithms and signal processing means utilizing the harbinger wave to forecast and signal an imminent shock wave and determination of its velocities, pressures, density and epicenter
09704741 · 2017-07-11 ·

Methods, algorithm and signal processing means utilizing an explosively formed Harbinger (H) wave to forecast an imminent shock wave and in conjunction with the this trailing Main (M) shock wave determination of H wave velocity and M shock wave velocities, overpressure, dynamic pressure, and density and further the M shock wave epicenter location co-ordinates. These parameter determinations are based on the discovery of a Harbinger wave launched upon formation of the M shock wave which annunciates the incoming M shock wave before its arrival. These variables are further used to devise methods and systems to simultaneously detonate an array of munitions, deploy just in time personnel and/or equipment protection, determine the wave epicenter for identifying enemy combatants and terrorist positions, alert response teams to a deleterious event and its magnitude, signal the location of these deleterious events and determine if a munition has functioned.

Methods, algorithms and signal processing means utilizing the harbinger wave to forecast and signal an imminent shock wave and determination of its velocities, pressures, density and epicenter
09704741 · 2017-07-11 ·

Methods, algorithm and signal processing means utilizing an explosively formed Harbinger (H) wave to forecast an imminent shock wave and in conjunction with the this trailing Main (M) shock wave determination of H wave velocity and M shock wave velocities, overpressure, dynamic pressure, and density and further the M shock wave epicenter location co-ordinates. These parameter determinations are based on the discovery of a Harbinger wave launched upon formation of the M shock wave which annunciates the incoming M shock wave before its arrival. These variables are further used to devise methods and systems to simultaneously detonate an array of munitions, deploy just in time personnel and/or equipment protection, determine the wave epicenter for identifying enemy combatants and terrorist positions, alert response teams to a deleterious event and its magnitude, signal the location of these deleterious events and determine if a munition has functioned.

Interconnect structures incorporating air-gap spacers

A dual damascene article of manufacture comprises a trench containing a conductive metal column where the trench and the conductive metal column extend down into and are contiguous with a via. The trench and the conductive metal column and the via have a common axis. These articles comprise interconnect structures incorporating air-gap spacers containing metal/insulator structures for Very Large Scale Integrated (VLSI) and Ultra Large Scale Integrated (ULSI) devices and packaging. The trench in this regard comprises a sidewall air-gap immediately adjacent the side walls of the trench and the conductive metal column, the sidewall air-gap extending down to the via to a depth below a line fixed by the bottom of the trench, and continues downward in the via for a distance of from about 1 Angstrom below the line to the full depth of the via. In another aspect, the article of manufacture comprises a capped dual damascene structure.