A building management system including building equipment operable to affect a variable state or condition of a building. The building management system includes a controller including a processing circuit. The processing circuit is configured to obtain a vibration data set related to vibrations of the building equipment. The processing circuit is configured to analyze the vibration data set by one or more machine learning models to generate a set of probabilities. The set of probabilities is related to a probability that the vibration data set is abnormal. The processing circuit is configured to identify the vibration data set as normal or abnormal based on the set of probabilities. The processing circuit is configured to initiate a corrective action responsive to identifying the vibration data set as abnormal.

A building management system including building equipment operable to affect a variable state or condition of a building. The building management system includes a controller including a processing circuit. The processing circuit is configured to obtain a vibration data set related to vibrations of the building equipment. The processing circuit is configured to analyze the vibration data set by one or more machine learning models to generate a set of probabilities. The set of probabilities is related to a probability that the vibration data set is abnormal. The processing circuit is configured to identify the vibration data set as normal or abnormal based on the set of probabilities. The processing circuit is configured to initiate a corrective action responsive to identifying the vibration data set as abnormal.

An acoustic sensor assembly includes a non-directional acoustic sensor having a first directional pattern, a plurality of directional acoustic sensors surrounding the non-directional acoustic sensor and including a plurality of resonators having different resonance frequencies from each other, each of the plurality of directional acoustic sensors having a second directional pattern, and a processor configured to obtain output signals from the non-directional acoustic sensor and the plurality of directional acoustic sensors. The processor is further configured to calculate an acoustic signal having directivity by selecting any one or any combination of the obtained output signals or selectively combining the obtained output signals, and obtain sound around the acoustic sensor assembly, using the calculated acoustic signal.

An acoustic sensor assembly includes a non-directional acoustic sensor having a first directional pattern, a plurality of directional acoustic sensors surrounding the non-directional acoustic sensor and including a plurality of resonators having different resonance frequencies from each other, each of the plurality of directional acoustic sensors having a second directional pattern, and a processor configured to obtain output signals from the non-directional acoustic sensor and the plurality of directional acoustic sensors. The processor is further configured to calculate an acoustic signal having directivity by selecting any one or any combination of the obtained output signals or selectively combining the obtained output signals, and obtain sound around the acoustic sensor assembly, using the calculated acoustic signal.

A device is provided for capturing vibrations produced by an object such as a musical instrument such as a cymbal of a drum kit. The device comprises a detectable element, such as a ferromagnetic element, such as a metal shim and a sensor spaced apart from and located relative to the musical instrument. The detectable element is located between the sensor and the musical instrument. When the musical instrument vibrates, the sensor remains stationary and the detectable element is vibrated relative to the sensor by the musical instrument.

A device is provided for capturing vibrations produced by an object such as a musical instrument such as a cymbal of a drum kit. The device comprises a detectable element, such as a ferromagnetic element, such as a metal shim and a sensor spaced apart from and located relative to the musical instrument. The detectable element is located between the sensor and the musical instrument. When the musical instrument vibrates, the sensor remains stationary and the detectable element is vibrated relative to the sensor by the musical instrument.

A semiconductor structure includes a substrate, a sensing device disposed over the substrate and including a plurality of protruding members protruded from the sensing device; a sensing structure disposed adjacent to the sensing device and including a plurality of sensing electrodes protruded from the sensing structure towards the sensing device; and an actuating structure disposed adjacent to the sensing device and configured to provide an electrostatic force on the sensing device based on a feedback from the sensing structure. Further, a method of manufacturing the semiconductor structure is also disclosed.

An infrasound detector comprises an infrasound transducer, signal feedback path, and feedback force transducer. The infrasound transducer is configured to transduce an infrasound signal to an electrical signal. The signal feedback path is arranged to feed a feedback signal from the infrasound transducer to a feedback force transducer. The feedback force transducer is configured to transduce a feedback electrical signal to a feedback force signal and arranged to provide the feedback force signal as input to the infrasound transducer.

An infrasound detector comprises an infrasound transducer, signal feedback path, and feedback force transducer. The infrasound transducer is configured to transduce an infrasound signal to an electrical signal. The signal feedback path is arranged to feed a feedback signal from the infrasound transducer to a feedback force transducer. The feedback force transducer is configured to transduce a feedback electrical signal to a feedback force signal and arranged to provide the feedback force signal as input to the infrasound transducer.

An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.