Various embodiments of an apparatus for measuring binding kinetics of an interaction of an analyte material present in a fluid sample are disclosed. The apparatus includes a sensing resonator having at least one binding site for the analyte material; actuation circuitry adapted to drive the sensing resonator into an oscillating motion; measurement circuitry coupled to the sensing resonator and adapted to measure an output signal of the sensing resonator representing resonance characteristics of the oscillating motion of the sensing resonator; and a controller coupled to the actuation and measurement circuitry, wherein the controller is adapted to detect an individual binding event between the at least one binding site and a molecule of the analyte material.

A measurement device for a chip removing machine, and methods of obtaining frequency response functions, obtaining stability charts and selecting operational parameters of a chip removing machining tool are disclosed. The device includes an engagement portion at the rear end for engagement with the machine and a measurement portion at the front end. The measurement portion is without a tool tip and includes a planar front end surface perpendicular to the centre axis. The front end surface has a coupling point aligned with the centre axis for receiving mechanical excitation. The front end surface further includes a plurality of seats for receiving one accelerometer each for measuring a response of the received mechanical excitation. When an accelerometer is received in one of the seats, and abutts against three contact surfaces thereof, it is positioned and oriented three dimensionally and around three axes of rotation in relation to the coupling point.

A measurement device for a chip removing machine, and methods of obtaining frequency response functions, obtaining stability charts and selecting operational parameters of a chip removing machining tool are disclosed. The device includes an engagement portion at the rear end for engagement with the machine and a measurement portion at the front end. The measurement portion is without a tool tip and includes a planar front end surface perpendicular to the centre axis. The front end surface has a coupling point aligned with the centre axis for receiving mechanical excitation. The front end surface further includes a plurality of seats for receiving one accelerometer each for measuring a response of the received mechanical excitation. When an accelerometer is received in one of the seats, and abutts against three contact surfaces thereof, it is positioned and oriented three dimensionally and around three axes of rotation in relation to the coupling point.

Provided is a directional acoustic sensor. The acoustic sensor includes a support a plurality of resonators provided on the support, and extending in a length direction. Each resonator of the plurality of resonators may include a base; and a frame provided on the base and extending continuously along a length of the base in the length direction. The base may have a thickness less than that of the frame.

Provided is a directional acoustic sensor. The acoustic sensor includes a support a plurality of resonators provided on the support, and extending in a length direction. Each resonator of the plurality of resonators may include a base; and a frame provided on the base and extending continuously along a length of the base in the length direction. The base may have a thickness less than that of the frame.

This disclosure is related to devices, systems, and techniques for determining an acceleration. For example, an accelerometer system includes a resonator and a light-emitting device configured to generate, based on an error signal, an optical signal. Additionally, the accelerometer includes a modulator configured to receive the optical signal, generate a modulated optical signal responsive to receiving the optical signal, and output the modulated optical signal to the resonator. A photoreceiver receives a passed optical signal from the resonator, where the passed optical signal indicates a resonance frequency of the resonator. Additionally, the photoreceiver receives a reflected optical signal from the resonator. The photoreceiver generates one or more electrical signals based on the passed optical signal and the reflected optical signal. Processing circuitry generates the error signal and determines the acceleration based on the one or more electrical signals.

Certain implementations of the disclosed technology may include systems and methods for extending a frequency response of a transducer. A method is provided that can include receiving a measurement signal from a transducer, wherein the measurement signal includes distortion due to a resonant frequency of the transducer. The method includes applying a complementary filter to the measurement signal to produce a compensated signal, wherein applying the complementary filter reduces the distortion to less than about +/−1 dB for frequencies ranging from about zero to about 60% or greater of the resonant frequency. The method further includes outputting the compensated signal.

Certain implementations of the disclosed technology may include systems and methods for extending a frequency response of a transducer. A method is provided that can include receiving a measurement signal from a transducer, wherein the measurement signal includes distortion due to a resonant frequency of the transducer. The method includes applying a complementary filter to the measurement signal to produce a compensated signal, wherein applying the complementary filter reduces the distortion to less than about +/−1 dB for frequencies ranging from about zero to about 60% or greater of the resonant frequency. The method further includes outputting the compensated signal.

Embodiments include a real time etch rate sensor and methods of for using a real time etch rate sensor. In an embodiment, the real time etch rate sensor includes a resonant system and a conductive housing. The resonant system may include a resonating body, a first electrode formed over a first surface of the resonating body, a second electrode formed over a second surface of the resonating body, and a sacrificial layer formed over the first electrode. In an embodiment, at least a portion of the first electrode is not covered by the sacrificial layer. In an embodiment, the conductive housing may secure the resonant system. Additionally, the conductive housing contacts the first electrode, and at least a portion of an interior edge of the conductive housing may be spaced away from the sacrificial layer.

Embodiments include a real time etch rate sensor and methods of for using a real time etch rate sensor. In an embodiment, the real time etch rate sensor includes a resonant system and a conductive housing. The resonant system may include a resonating body, a first electrode formed over a first surface of the resonating body, a second electrode formed over a second surface of the resonating body, and a sacrificial layer formed over the first electrode. In an embodiment, at least a portion of the first electrode is not covered by the sacrificial layer. In an embodiment, the conductive housing may secure the resonant system. Additionally, the conductive housing contacts the first electrode, and at least a portion of an interior edge of the conductive housing may be spaced away from the sacrificial layer.