There is provided a fiber optic temperature probe having a base, a first tube connected to the base, a second tube provided coaxially within the first tube, a probe tip extending through an opening in a distal end of the first tube; and an optical fiber extending from within the base through an opening in the proximal end of the first tube and being substantially coaxial with respect to the first tube. There is also provided a fiber optic temperature probe having a base, a first tube connected to the base, a probe tip extending through an opening in a distal end of the first tube, an optical fiber extending from within the base through an opening in the proximal end of the first tube and being substantially coaxial with respect to the first tube, and a first lens positioned between the probe tip and the optical fiber.

An electronic device for enhancing accuracy upon contactless body temperature measurement is provided. The electronic device includes an image sensor for obtaining an image of an object, a temperature sensor disposed at a position adjacent to the image sensor for measuring a temperature of the obtained object, and a controller for performing control to determine the temperature of the object using a focal length of a camera module including the image sensor corresponding to a time of obtaining the image of the object and a temperature output from the temperature sensor corresponding to the time of obtaining the image of the object.

An infrared-detecting device, includes an infrared detector configured to emit a signal representative of the thermal radiation of a hotspot, and a light source configured to emit an incident beam, preferably in a window of UV or visible wavelength. The infrared-detecting device furthermore comprises a synchronizing device connected to the light source and to the infrared detector or to the processing module, and configured to emit a synchronization signal, the infrared detector being configured to be activated in a preset time window depending on said synchronization signal.

Systems and methods for measuring temperature in an environment by creating a first beam having an energy of about 50 mJ/pulse, and a pulse duration of about 100 ps. A second beam is also created, having an energy of about 2.3 mJ/pulse, and a pulse duration of about 58 ps. The first beam and the second beam are directed into a probe region, thereby expressing an optical output. Properties of the optical output are measured at a sampling rate of at least about 100 kHz, and temperature measurements are derived from the measured properties of the optical output. Such systems and methods can be used to measure temperature in environments exhibiting highly turbulent and transient flow dynamics.

A system for monitoring a switchgear includes multiple infrared cameras with fields of view; a processing unit; and an output unit. The cameras acquire multiple image data of a plurality of phases of the switchgear, and the processing unit determines whether there is a phase imbalance in a specific phase comprising a determination from a plurality of image data that temperature information for a plurality of component parts and/or a plurality of connections for that specific phase has an overall enhanced temperature compared to the temperature information for the same plurality of component parts and/or the same plurality of connections for one or more other phases of the plurality of phases. The output unit is configured to output information that a fault or load imbalance has occurred in a phase.

A low cost, low power, passive optical methane monitoring system for fixed-position installation at oil and gas production well pads and gathering centers is disclosed. The optical methane monitoring system disclosed can be a scannable field of view Near Infrared (NIR) filter photometer to detect and quantify methane concentration in a two dimensional or a three dimensional grid above and around a facility. A randomized fiber optic bundle is disclosed that can be used to direct the total optical power from a collection lens to two or more isolated optical channels. Band pass filters isolate a desired wavelength range for transmission measurements for the two or more channels. Also disclosed is an absorption algorithm which accounts for variable background spectral intensity as well as correcting for water vapor and overall scattering effects to measure methane concentration for a given field of view.

A hood apparatus for a cooking device includes at least one temperature sensor arranged in a direction of a cooking device including a plurality of burners, a communication interface to perform communication with the cooking device, a driving device configured to adjust a sensing direction of the at least one temperature sensor, and a processor configured to identify at least one burner being driven from among the plurality of burners, control the driving device to adjust the sensing direction of the at least one temperature sensor so that the at least one temperature sensor faces a position of the identified at least one burner, and control the communication interface to transmit a sensing result of the at least one temperature sensor to the cooking device.

An automated computer-vision system is used for timing the sand drainage in a sand management arrangement that handles flowback of sand and other solid materials in a slurry of flow from well(s) at wellsite(s). The automated system uses infrared imaging of flowback equipment to determine a level of solids (sand) in the equipment. Image processing of the temperature differences of the content in the equipment gives a demarcation of the sand and liquid separation in the equipment, which is used to determine how much sand is present. If the equipment is found to be full or above a predefined benchmark, the automated system operates a discharge skid to discharge the contents to a waste tank.

The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.

The instant disclosure provides an optical component packaging structure which includes a far-infrared sensor chip, a first metal layer, a packaging housing and a covering member. The far-infrared sensor chip includes a semiconductor substrate and a semiconductor stack structure. The semiconductor substrate has a first surface, a second surface which is opposite to the first surface, and a cavity. The semiconductor stack structure is disposed on the first surface of the semiconductor substrate, and a part of the semiconductor stack structure is located above the cavity. The first metal layer is disposed on the second surface of the semiconductor substrate, the packaging housing is used to encapsulate the far-infrared sensor chip and expose at least a part of the far-infrared sensor chip, and the covering member is disposed above the semiconductor stack structure.