A portable information handling system has dynamic foot disposed at a bottom surface of a housing that extends and retracts to adjust cooling airflow impedance at vents disposed at the bottom surface. The dynamic foot includes an actuator in an internal cavity having opposing ramp structures interfaced by a nickel titanium wire that changes phase when heated to move the ramp structures. In the example embodiment, a push-push lock engages and disengages the ramp structures at each activation of the nickel titanium wire so that an embedded controller controls foot extension and retraction by applying current to the nickel titanium wire that heats the wire based upon detection of predetermined thermal conditions in the housing.

A measuring arrangement and method for a thermal analysis of a sample, having a crucible for storing a sample in the crucible, as well as a sensor for measuring a sample temperature of the sample when the crucible is arranged on the sensor. To provide for a high level of reproducibility of measurements in the case of such a measuring arrangement and a method for the thermal analysis performed with the measuring arrangement, the measuring arrangement has an anti-rotation protection for the crucible, in order to provide a predetermined rotational position of the crucible with respect to the sensor when the crucible is arranged on the sensor. The invention includes a method for the thermal analysis of a sample, which is performed using such a measuring arrangement.

A method is provided for measuring a temperature of a susceptor of an inductive heating arrangement configured to heat an aerosol-forming substrate, the inductive heating arrangement including: a cavity to receive the substrate, at least one inductor coil configured to generate a varying magnetic field when a varying electric current flows through the at least one inductor coil, at least one susceptor arranged relative to the at least one inductor coil such that the at least one susceptor is heatable by penetration of the varying magnetic field, the at least one susceptor being configured to heat the substrate, and at least one temperature sensor; and the method including: providing the at least one temperature sensor in thermal contact with the at least one susceptor, and measuring the temperature of the at least one susceptor when the varying electric current does not flow through the at least one inductor coil.

A method for increasing accuracy of measurement of body temperature includes a step of collecting an infrared signal to obtain an infrared signal value (step 1), a step of collecting a skin image to obtain a calibrating emissivity (step 2), a step of obtaining a calibrated infrared signal value according to the calibrating emissivity and the infrared signal value obtained in step 1 (step 3), and a step of making a conversion into an actual body temperature (step 4). Accordingly, an actual temperature value of the skin surface can be attained to increase the accuracy of measurement effectively, thereby allowing the measured result to be more close to the real body temperature of a tested target.

An industrial process vessel insulation monitoring system for monitoring an insulated section of a process vessel containing a process material includes one or more condition sensors and a controller. The condition sensors are configured to sense at least one environmental condition, such as temperature, humidity, moisture level, and/or chemical composition, and generate condition outputs that are indicative of the corresponding sensed condition. The controller is configured to detect at least one section condition relating to the insulated section based on the condition output, and generate condition information relating to the at least one detected section condition. Examples of the section conditions include a thermal resistance of an insulation of the insulated section, damage or degradation to an insulation of the insulated section, corrosion of the process vessel at the insulated section, conditions that promote corrosion of the process vessel, and moisture intrusion to the insulation.

A temperature sensor comprises a temperature sensing element, a protective housing, and a heat transfer element. The temperature sensing element transduces a sensed temperature into an electrical output signal. The protective housing at least partly encases the temperature sensing element. The heat transfer element has an outer surface in heat conductive contact with an inner wall of the protective housing and receives at least a part of the temperature sensing element. The heat transfer element is formed separately from the temperature sensing element.

A temperature sensor comprises a temperature sensing element, a protective housing, and a heat transfer element. The temperature sensing element transduces a sensed temperature into an electrical output signal. The protective housing at least partly encases the temperature sensing element. The heat transfer element has an outer surface in heat conductive contact with an inner wall of the protective housing and receives at least a part of the temperature sensing element. The heat transfer element is formed separately from the temperature sensing element.

Apparatus (100) for use in sensing temperature in a wellbore, comprising: tubing (110) comprising a plurality of temperature sensor modules (120, 320, 420, 520, 620, 720) provided at locations along the inside of the tubing, said temperature sensor modules comprising temperature sensors (321, 421) provided at least in part by at least one semiconductor element having electrical properties that vary with temperature; an electrical network (115) configured to electrically connect to the semiconductor elements to in use allow measuring of the respective electrical properties of the semiconductor elements to infer a thermal characteristic of the semiconductor element; and at least one control module (130, 330, 430) electrically connected to multiple temperature sensor modules, via the electrical network, and configured to receive and process an electrical signal associated with the temperature sensor modules to enable inference of the temperature of the semiconductor elements and the environment to which the tubing is exposed at the location of that semiconductor element.

The invention relates to a temperature measurement device comprising at least three probes, a computer, the computer being configured to estimate a temperature on the basis of voltage measurements at the output of the probes, characterised in that the probes are connected together in a plurality of meshes mounted in series, with at least one mesh comprising at least two probes mounted in parallel and at least one other mesh comprising a probe or a plurality of probes mounted in parallel.

The invention relates to a device for cooling workpieces. The device has at least one nozzle which is configured to blow a fluid onto a workpiece. At least one surface temperature sensor is able to be arranged on the workpiece. In order to cool the workpiece, it is blown with a fluid by means of the at least one nozzle, the temperature of said fluid being lower than the surface temperature of the workpiece. In the process, the surface temperature is monitored by means of the at least one surface temperature sensor.