A thin sensor film that is capable of indicating temperature and an associated sensor readout kit that illuminates the sensor film and detects the return fluorescence for analysis to determine temperature. The sensor film may be detached and reattached in order to be reused. The initial design achieves high sensitivity and accuracy in the range of interest to biologistics and can potentially address temperatures ranging from −200 to 300° C. A variation allows for the use of optical fibers for measurements of surfaces inside enclosures.

A temperature sensor, a temperature measuring device comprising the temperature sensor, and a temperature measuring method using the temperature sensor are disclosed. The temperature sensor is disposed at a measurement target having an extremely low temperature and transmits temperature measurement data to a temperature measurement output unit through a lead wire. The temperature sensor includes a housing, an electric resistor disposed in the housing, and a thermal anchor portion disposed inside or outside the housing and connected to the lead wire. Further, the lead wire extending from the thermal anchor portion is connected to the temperature measurement output unit.

A cooking control system having a temperature probe and a cooking appliance is described for permitting temperature target cooking of foods. The probe includes a metallic insertable portion with a sheathed tip and a temperature sensor positioned therein, a flexible heat-resistant wire coupled to the temperature sensor, and a jack coupled to the flexible, heat-resistant wire opposite the metallic insertable portion. The cooking appliance includes a heating unit, an housing, a temperature reader, and an alpha-numerical display. In use, the temperature sensor produces a signal in response to a temperature sensed at the sheathed tip and the heat-resistant wire and jack transmit the signal produced by the temperature sensor to the port of the cooking appliance. The temperature reader within the housing is coupled to the port and configured to accept and accurately convert the signal produced by the temperature sensor to a number representing the temperature sensed by the sensor and display the number for the user.

A temperature shock monitor includes a solvent material and a diffusion material. An energy barrier between the solvent material and the diffusion material is selected to be lower than is would conventionally be used in semiconductor devices such that the diffusion material diffuses into the solvent material when exposed to a temperature above a designated temperature threshold. At a later time, electrical parameters of the temperature shock monitor that change based on the amount of diffusion of the diffusion material into the solvent material allows one to determine whether the temperature shock monitor was exposed to a temperature above the temperature threshold.

The present disclosure discloses an infrared thermometer for a magnetic induction identification probe cap, including the body of the infrared thermometer, at an upper end of which is a temperature probe designed with a cap, of which an inner side wall is beset with a magnet block; in the infrared thermometer body ata lower end of the temperature probe is a magnetic induction element connected with a main control unit of the body of the infrared thermometer; when the cap covers the temperature probe or is removed there-from, the magnetic induction between the magnet block and the magnetic induction element enables magnetic induction output control signals. For the infrared thermometer applicable for both forehead temperature measurement and ear canal temperature measurement, the magnetic induction identification probe cap switches between a forehead temperature measurement mode and an ear canal temperature measurement mode.

The invention relates to detecting a composition of a sample or contamination in liquids by detecting corresponding changes in their thermal properties. In a disclosed arrangement, an apparatus is provided comprising a first probe element configured to provide a first surface in direct contact with the sample and a second surface that is not in direct contact with the sample. A measurement system measures a rate of heat transfer through the first surface. A processing unit analyses the measured rate of heat transfer in order to detect a heat transfer characteristic of the sample that is indicative of a composition of the sample.

A visually sensible indicator of temperature including electronic temperature sensing circuitry sensing at least when a temperature exceeds at least one predetermined temperature threshold and providing at least one corresponding threshold exceedance output which is sensible as heat and a heat-responsive visually sensible display which is responsive to the at least one threshold exceedance output for providing at least one visually sensible indication indicating that the temperature has exceeded the predetermined temperature threshold.

A thermocouple capable of preventing a decrease in strength of a temperature measuring junction portion while maintaining temperature responsiveness and productivity in comparison with a conventional thermocouple. A thermocouple including two wires and a clamping member, the clamping member clamping the two wires while distal end portions of the wires being in contact with each other in parallel to provide a temperature measuring junction portion, in which when it is assumed that diameters of the two wires are d1 and d2 (where d1≥d2) respectively; a length of the temperature measuring junction portion in a longitudinal direction of the two wires is L; a maximum width of the temperature measuring junction portion in a parallel direction of the two wires is D; and a maximum width in a direction orthogonal to the parallel direction in a cross section of the temperature measuring junction portion is E, the following equations are satisfied:
0.5×(d1+d2)≤L≤5×(d1+d2)  Equation (1)
1×(d1+d2)<D≤5×(d1+d2)  Equation (2)
1.4×d1<E≤8×d1.  Equation (3)

According to one embodiment, a semiconductor device 1 includes a temperature sensor module 10 that outputs a non-linear digital value with respect temperature and a substantial linear sensor voltage value with respect to the temperature, a storage unit 30 that stores the temperature, the digital value, and the sensor voltage value, and a controller 40 that calculates a characteristic formula using the temperature, the digital value, and the sensor voltage value stored in the storage 30, in which the temperature, the digital value, and the sensor voltage value stored in the storage unit 30 include absolute temperature under measurement of absolute temperature, the digital value at the absolute temperature, and the sensor voltage value at the absolute temperature.

Examples of temperature measurement calibration in an additive manufacturing system are described. In one case, a method of calibrating a non-contact temperature measurement device involves applying energy from a radiation source of the additive manufacturing system to heat a reference element. The reference element is thermally coupled to a temperature sensor. A temperature reading from the temperature sensor is compared with data from the non-contact temperature measurement device to calibrate the device.