Two sets of the DC voltages are determined from among sets of DC voltages. At a first temperature, a first voltage of one of the two sets and a first voltage of the other one of the two sets surround a detection voltage that varies substantially proportionally to temperature. The detection voltage is compared with a second voltage of one of the two sets.

A semiconductor integrated circuit (IC) comprising: a first ring oscillator (ROSC) circuit and a second ROSC circuit at spaced apart locations in the IC, each ROSC circuit having a respective oscillation frequency in operation that varies with temperature; a semiconductor temperature sensor, located in the IC proximate to the first ROSC circuit and providing a sensor output signal indicative of temperature; and at least one processor, configured to indicate a temperature at the second ROSC circuit based at least on: the sensor output signal, the oscillation frequency of the second ROSC circuit, and the oscillation frequency of the first ROSC circuit.

A sensor failure detection device includes a storage, a predictor, a calculator and a detector. The storage stores temperature information of individual sensors. The temperature information includes measured values of temperatures. The measured values of temperatures are measured by a plurality of sensors. The predictor predicts a temperature distribution by performing a thermal fluid simulation, on the basis of the temperature information received from a remaining sensor. The remaining sensor is a sensor of the plurality of sensors other than the test target sensor. The calculator calculates a difference value between a temperature at a position of the test target sensor in the temperature distribution and a temperature measured by the test target sensor. The detector detects that the difference value is higher than a predetermined value.

A method including obtaining calibration data for at least one sub-component in a heat transfer assembly, wherein the calibration data comprises at least one indication of coolant flow rate through the sub-component for a given surface temperature delta of the sub-component and a given heat load into said sub-component, determining a measured heat load into the sub-component, determining a measured surface temperature delta of the sub-component, and determining a coolant flow distribution in a first flow path comprising the sub-component from the calibration data according to the measured heat load and the measured surface temperature delta of the sub-component.

A method including obtaining calibration data for at least one sub-component in a heat transfer assembly, wherein the calibration data comprises at least one indication of coolant flow rate through the sub-component for a given surface temperature delta of the sub-component and a given heat load into said sub-component, determining a measured heat load into the sub-component, determining a measured surface temperature delta of the sub-component, and determining a coolant flow distribution in a first flow path comprising the sub-component from the calibration data according to the measured heat load and the measured surface temperature delta of the sub-component.

A methodology includes circulating a temperature-controlled and flow-rate-controlled medium through a container at a controlled flow rate and submerging a thermistor with the medium. With the thermistor submerged, a power output of the thermistor is determined and compared to a power criterion, after which classification of the thermistor occurs based on a comparison of the power output to the power criterion. The methodology can include submerging a reference thermistor within the medium and determining a reference power output of the reference thermistor with the reference thermistor submerged within the medium, the power criterion determined based on the reference power output.

A methodology includes circulating a temperature-controlled and flow-rate-controlled medium through a container at a controlled flow rate and submerging a thermistor with the medium. With the thermistor submerged, a power output of the thermistor is determined and compared to a power criterion, after which classification of the thermistor occurs based on a comparison of the power output to the power criterion. The methodology can include submerging a reference thermistor within the medium and determining a reference power output of the reference thermistor with the reference thermistor submerged within the medium, the power criterion determined based on the reference power output.

A method of sensing superheat includes the steps of: (a) connecting a fluid inlet member of a superheat sensor to one of a plurality of fluid systems; (b) allowing fluid to flow from the fluid system to which the superheat sensor is connected to the superheat sensor; (c) sensing a temperature of the fluid in the fluid system with one of an internal temperature sensor mounted within a housing of the superheat sensor and an external temperature sensor mounted outside of the housing of the superheat sensor; and (d) calculating a superheat of the fluid in the fluid system.

Systems and methods for sensing temperature on a chip are described herein. In one embodiment, a temperature sensor comprises a first transistor having a gate, a second transistor having a gate coupled to the gate of the first transistor, and a bias circuit configured to bias the gates of the first and second transistors such that the first and second transistors operate in a sub-threshold region, and to generate a current proportional to a difference between a gate-to-source voltage of the first transistor and a gate-to-source voltage of the second transistor. The temperature sensor also comprises an analog-to-digital converter (ADC) configured to convert the current into a digital temperature reading.

There is provided a system and method for automatically calibrating a temperature sensor. More specifically, there is provided a system including a temperature sensor that includes a first resistance configured to indicate a temperature of the temperature sensor and a second resistance, in series with the first resistor, wherein the second resistance is adjustable to calibrate the first resistance, and a calibration circuit, coupled to the temperature sensor and configured to automatically calibrate the first resistance.