An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

A system is disclosed, including an interface to a DUT and a testing apparatus. The DUT includes a first plurality of temperature sensing circuits. The testing apparatus may store a plurality of control values. Each control value may depend on at least two calibration values of corresponding temperature sensing circuits of a second plurality of temperature sensing circuits. The testing apparatus may generate a plurality of calibration values for the DUT. Each calibration value corresponds to one of the first plurality of temperature sensing circuits. The testing apparatus may determine a plurality of test values for the DUT. The testing apparatus may calculate a probability value, and repeat generation of the plurality of calibration values upon determining that the probability value is less than a predetermined threshold value. The probability value corresponds to a likelihood that the plurality of calibration values is accurate.

An apparatus for processing substrates includes a continuum radiation source, a source manifold optically coupled to the continuum radiation source and comprising: a plurality of beam guides, each having a first end that optically couples the beam guide to the continuum radiation source; and a second end. The apparatus also includes a detector manifold to detect radiation originating from the source manifold and transmitted through a processing area, and one or more transmission pyrometers configured to analyze the source radiation and the transmitted radiation to determine an inferred temperature proximate the processing area.

A method for calibrating an elongated metallurgical tool based on a laser distance sensor (6). A temperature measurement/sampling tool (3) is driven by an industrial robot (1) so that a standard temperature measurement/sampling gun (4) enters a calibration area, the standard temperature measurement/sampling gun (4) reciprocates at the vicinity of a laser distance sensor (6), the standard axis is obtained by using a vector on a generatrix of the standard temperature measurement/sampling gun (4) based on the laser distance sensor (6), the position and orientation of the temperature measurement/sampling tool (3) is adjusted so that the axis of the standard temperature measurement/sampling gun (4) is parallel to the set standard axis, and moreover, positioning and identification is performed on an end TCP point of the temperature measurement/sampling tool (3) to obtain a tool coordinate system corresponding to the temperature measurement/sampling tool (3), and deformation of the standard temperature measurement/sampling gun (4) can be detected in the calibration process, to ensure the accuracy and stability of system operation of the industrial robot (1). In addition, also provided is a device for calibrating an elongated metallurgical tool based on a laser distance sensor (6).

A method for calibrating an elongated metallurgical tool based on a laser distance sensor (6). A temperature measurement/sampling tool (3) is driven by an industrial robot (1) so that a standard temperature measurement/sampling gun (4) enters a calibration area, the standard temperature measurement/sampling gun (4) reciprocates at the vicinity of a laser distance sensor (6), the standard axis is obtained by using a vector on a generatrix of the standard temperature measurement/sampling gun (4) based on the laser distance sensor (6), the position and orientation of the temperature measurement/sampling tool (3) is adjusted so that the axis of the standard temperature measurement/sampling gun (4) is parallel to the set standard axis, and moreover, positioning and identification is performed on an end TCP point of the temperature measurement/sampling tool (3) to obtain a tool coordinate system corresponding to the temperature measurement/sampling tool (3), and deformation of the standard temperature measurement/sampling gun (4) can be detected in the calibration process, to ensure the accuracy and stability of system operation of the industrial robot (1). In addition, also provided is a device for calibrating an elongated metallurgical tool based on a laser distance sensor (6).

The present disclosure provides a temperature sensing device and a calibration method thereof. The temperature sensing device includes a current generation circuit, an analog-to-digital conversion (ADC) circuit and a processing circuit. The calibration method includes: by the current generation circuit, generating a temperature dependent current according to a temperature of a tested object, wherein the temperature dependent current is dependent on a reference current passing through an adjustable resistor of the current generation circuit; by the ADC circuit, performing an analog-to-digital conversion according to the temperature dependent current to generate a sensing value; by the processing circuit, comparing the sensing value with an ideal value; and by the processing circuit, adjusting a resistance value of the adjustable resistor according to a comparison result of the sensing value and the ideal value, so that the sensing value equals the ideal value.

Temperature measurements of photonic circuit components may be performed optically, exploiting a temperature-dependent spectral property of the photonic device to be monitored itself, or of a separate optical temperature sensor placed in its vicinity. By facilitating measurements of the temperature of the individual photonic devices rather than merely the photonic circuit at large, such optical temperature measurements can provide more accurate temperature information and help improve thermal design.

Methods, apparatus, systems and articles of manufacture to trim temperature sensors are disclosed. An example method includes: sampling a first value indicative of a temperature of a first die of a multi-chip module (MCM) with a first temperature sensor, the first die including a first transistor having a channel including a first material; and calibrating a second temperature sensor configured to sample a second value indicative of a temperature of a second die including a second transistor have a second channel including a second material, the calibrating based on the first value.

The inventive concepts provide a temperature controller for performing a comparative measurement process and a sensing calibration process without separating a temperature sensor and an input channel, if a comparative measurement process and a sensing calibration process of a temperature sensor for controlling a temperature of a semiconductor manufacturing facility are performed.

The invention relates to a vertical light-emitting diode chip structure capable of measuring temperature and a temperature measurement calibration method thereof. A semiconductor epitaxial structure and a metal film resistance temperature measurement structure are separately arranged on the upper plane of a transverse high thermal conductivity extension structure. Through the high thermal conductivity characteristic of the transverse high thermal conductivity extension structure, the temperature of an active layer of the semiconductor epitaxial structure can be quickly transferred to the metal film resistance temperature measurement structure. The temperature measurement calibration method comprises: placing a plurality of connected and uncut package support plates into a constant temperature device at the same time to obtain a temperature calibration relation for different package support plates at the same time to reduce the temperature calibration cost in a batch mass production mode.