A method that determines a correct or an incorrect position of a temperature sensor in an emission control system, the method including: determining a first reference temperature within a first temperature interval; measuring a first temperature with the temperature sensor corresponding to the first temperature interval; determining a second reference temperature within a second temperature interval; measuring a second temperature with the temperature sensor corresponding to the second temperature interval; determining a value for a characteristic parameter based on the first reference temperature, the first measured temperature, the second reference temperature and the second measured temperature; comparing the determined value for the characteristic parameter with a predetermined characteristic parameter threshold value that is based upon the determined operation parameter results for different positions of the temperature sensor for predetermined engine operation characteristics; and based upon the comparison, determining a correct or an incorrect position of the temperature sensor.

An apparatus for determining temperature comprising: a PTAT circuit configured to provide a PTAT voltage proportional to absolute temperature; a bandgap voltage reference circuit configured to generate a voltage across a sense-resistor wherein a reference voltage is provided between a first terminal and a second terminal which couple to the sense-resistor; a calibration circuit, comprising: a memory to store a predetermined calibration value; a trim circuit to receive a trim value based on the predetermined calibration value to control where one or both of the first and second terminals couple to the sense-resistor for provision of the reference voltage; a dynamic calibration module configured to, based on a change in the PTAT voltage, generate the trim value by adding or subtracting a predetermined number of bits from the predetermined calibration value; wherein the apparatus provides a signal indicative of temperature based on the PTAT voltage and the reference voltage.

Methods, systems and devices of the present disclosure involve techniques for cancelling base resistance error otherwise present in remote temperature sensors such as remote diode temperature sensors. In one or more embodiments, measurement logic configured to determine a temperature of or near a remote temperature sensor may be configured to determine an error cancelling coefficient and to calculate a temperature value, at least in part, responsive to the error cancelling coefficient. In some cases, error cancelling coefficients may be determined using one or more calibration techniques.

According to an aspect, a temperature sensor in a chip for determining a chip temperature comprises a first temperature sensor with a first characteristic, a second temperature sensor with a second characteristic, first characteristic being different from the second characteristic, a processor operative to determine the chip temperature is configured to determine a first parameter and a second parameter in the calibration mode and determining the chip temperature using the first parameter and the second parameter in a real time operating mode, wherein, the first parameter is derived from a first relation between the first characteristic and the second characteristic and the second parameter is at least based on first parameter.

A sensor placement optimization device is provided, which may include a preprocessing circuit and an operational circuit. The preprocessing circuit may perform a pre-process for the sensing signals of a plurality of temperature sensors, installed on a machine tool, to generate a pre-processed data. The operational circuit may execute a normalization for the pre-processed data to generate a normalized data, perform a principal component analysis for the normalized data to generate a dimensionality-reduced data and implement a principal component regression for the dimensionality-reduced data to obtain the contributions of the temperature sensors. Then, the operational circuit may rank the temperature sensors according to the contributions thereof to generate a ranking result and execute a screening process according to the ranking result to select at least one redundant sensor from the temperature sensors; afterward, the operational circuit may remove the redundant sensor from the temperature sensors.

The invention relates to an apparatus for determining and/or monitoring temperature of a medium, comprising at least one temperature sensor having at least one sensor element, an electronics unit, an input unit, and a display unit. The electronics unit is embodied to determine and/or to monitor at least the temperature of the medium and to detect whether the temperature sensor is immersed at least partially in at least one comparison medium with known comparison temperature. When the temperature sensor is immersed in a comparison medium the electronics unit performs a comparison measurement for calibrating and/or validating the sensor element. The temperature of the comparison medium is determined in the form of a comparison temperature measured value.

A temperature detection device includes: first and second temperature sensors that output temperature signals that are signals corresponding to measured temperatures; a signal conversion circuit that respectively converts the temperature signals, which are output from the first and second temperature sensors, into pulse signals having duty ratios or frequencies corresponding thereto; a multiplexer that selectively outputs one of a plurality of the pulse signals converted by the signal conversion circuit; and an offset unit that offsets the temperature signal, which is output from the first temperature sensor of the first and second temperature sensors, to the signal conversion circuit.

A temperature sensing system includes a plurality of resistive segments connected in electrical series. Each resistive segment defines a material different from a material of an adjacent resistive segment, and the plurality of resistive segments are joined at sensing junctions to define a plurality of sensing junctions along a length of the resistive segments. A temperature deviation is calculated from the plurality of sensing junctions based on electric potential at each of the sensing junctions.

A calibration arrangement has a sealable and thermally-isolated chamber comprising a socket mount having a number of reference samples in thermal contact with the socket mount and a number of sample sockets for devices-under test, DUTs, with each sample socket being arranged in proximity to and associated to at least one of the reference samples. The arrangement further comprises a thermal chuck and a circuit board, which is configured to provide electrical connection to the reference samples in the socket mount and DUTs in the sample sockets. The thermal chuck is configured to thermalize the socket mount and the circuit board to a temperature set point.

A calibration arrangement has a sealable and thermally-isolated chamber comprising a socket mount having a number of reference samples in thermal contact with the socket mount and a number of sample sockets for devices-under test, DUTs, with each sample socket being arranged in proximity to and associated to at least one of the reference samples. The arrangement further comprises a thermal chuck and a circuit board, which is configured to provide electrical connection to the reference samples in the socket mount and DUTs in the sample sockets. The thermal chuck is configured to thermalize the socket mount and the circuit board to a temperature set point.