Patent classifications
G01K15/00
ON-CHIP TEMPERATURE SENSOR CIRCUITS
A diode voltage from a diode circuit can be combined with a proportional to absolute temperature (PTAT) voltage generated by a PTAT circuit to determine a temperature sensor voltage. This temperature sensor voltage may correspond to a temperature of a circuit or a localized temperature. By determining the temperature sensor voltage using a combination of a PTAT voltage and diode voltage, it is possible to remove or a PTAT circuit used to generate a bandgap voltage, which may shrink the temperature sensor and increase the accuracy of the temperature sensor circuit.
Wireless temperature measurement system and signal processing method thereof
A signal processing method of a wireless temperature measurement system comprises: acquiring inherent background noise intensity of a receiver (11) of a reader (10) and maximum output signal intensity of the receiver (S101); acquiring current noise intensity on a receiving channel of the receiver (11) in real time when an antenna (14) is connected to the reader (10) and an excitation signal is not transmitted to a temperature sensor (20) (S102); and determining an intensity threshold value of a temperature signal currently measured by the temperature sensor (20) according to the background noise intensity, the maximum output signal intensity and the current noise intensity (S103).
Temperature estimation for sensor
A process for controlled heating of a sensor of an aftertreatment system comprising accessing several parameters, including an exhaust mass flow, an outlet temperature, an ambient air temperature, and an ambient air velocity, calculating a temperature of the sensor based on a thermal model and the accessed parameters, comparing the calculated temperature to a threshold temperature, and activating a controlled heating process for the sensor responsive to the calculated temperature being below the threshold temperature. The controlled heating process can include activating a heater to heat the sensor.
METHOD AND SYSTEM FOR DETECTING FAILURE IN AN ARRAY OF THERMOCOUPLES CONNECTED IN PARALLEL
There is described a method of detecting failure in an array of thermocouples connected in parallel. The method comprising: during an operation mode of the array of thermocouples, measuring a voltage V across the array of thermocouples, the voltage V associated with a temperature T; during a failure detection mode of the array of thermocouples, shunting the array of thermocouples, and measuring a shunt voltage Vs occurring across a resistive element connected in series with the array of thermocouples; comparing the shunt voltage Vs to an expected shunt voltage Vs_exp for the array of thermocouples at the temperature T; and generating a failure signal indicative of a detected failure in the array of thermocouples when the shunt voltage Vs deviates from the expected shunt voltage Vs_exp by more than a deviation threshold.
Microscale thermocouple probe for intracellular temperature measurements
A microscale thermocouple probe for intracellular temperature measurements comprises a cantilever structure including a suspended portion extending from a support, where the suspended portion includes first and second conductive lines on a surface thereof. The first and second conductive lines extend along the surface and meet at a tip of the suspended portion to define a thermocouple junction.
System and method for determining a temperature of an object
A system for determining a temperature of an object includes a three-dimensional (3D) printer configured to successively deposit a first layer of material, a second layer of material, and a third layer of material to form the object. The 3D printer is configured to form a recess in the second layer of material. The material is a metal. The system also includes a temperature sensor configured to be positioned at least partially with the recess and to have the third layer deposited thereon. The temperature sensor is configured to measure a temperature of the first layer of material, the second layer of material, the third layer of material, or a combination thereof.
Semiconductor device, temperature sensor and power supply voltage monitor
According to one embodiment, a semiconductor device 1 includes a temperature sensor module 10 that outputs a non-linear digital value with respect to temperature and a substantially linear sensor voltage value with respect to the temperature, a storage unit 30 that stores the temperature, the digital value, and the sensor voltage value, and a controller 40 that calculates a characteristic formula using the temperature, the digital value, and the sensor voltage value stored in the storage unit 30, in which the temperature, the digital value, and the sensor voltage value stored in the storage unit 30 include absolute temperature under measurement of absolute temperature, the digital value at the absolute temperature, and the sensor voltage value at the absolute temperature.
MAINTENANCE-FREE GAS DENSITY RELAY AND CROSS-CHECKING METHOD THEREFOR
Provided are a maintenance-free gas density relay and a mutual check method therefor. The maintenance-free gas density relay includes a gas density relay body and first gas density detection sensors which are in communication on gas paths, and an intelligent control unit connected to the gas density relay body and the first gas density detection sensors separately, where the intelligent control unit compares and checks a first pressure value and a second pressure value acquired at the same gas pressure, and/or compares and checks a first temperature value and a second temperature value acquired at the same gas temperature, or compares and checks a first density value and a second density value acquired at the same gas density, and can further upload received data to a background for data comparison by the background. The present disclosure further completes online self-check or mutual check of the gas density relay while being used for monitoring gas density of a gas-insulated or arc-control electrical apparatus, thereby improving efficiency, avoiding maintenance, reducing cost, and ensuring safe operation of a power grid.
MAINTENANCE-FREE GAS DENSITY RELAY AND CROSS-CHECKING METHOD THEREFOR
Provided are a maintenance-free gas density relay and a mutual check method therefor. The maintenance-free gas density relay includes a gas density relay body and first gas density detection sensors which are in communication on gas paths, and an intelligent control unit connected to the gas density relay body and the first gas density detection sensors separately, where the intelligent control unit compares and checks a first pressure value and a second pressure value acquired at the same gas pressure, and/or compares and checks a first temperature value and a second temperature value acquired at the same gas temperature, or compares and checks a first density value and a second density value acquired at the same gas density, and can further upload received data to a background for data comparison by the background. The present disclosure further completes online self-check or mutual check of the gas density relay while being used for monitoring gas density of a gas-insulated or arc-control electrical apparatus, thereby improving efficiency, avoiding maintenance, reducing cost, and ensuring safe operation of a power grid.
TEMPERATURE CONTROL DEVICE
A device for thermal treatment of samples includes: a base unit with a receiving region for a sample carrier; a temperature control block arranged in the receiving region; a lid; a temperature sensor for detecting a temperature of the temperature control block; a control unit for heating and cooling the temperature control block; and a reference element for in situ calibrating, validating and/or adjusting of the temperature sensor, which reference element is comprised of a material having at least one phase change at at least one predetermined phase change temperature in a temperature range suitable for calibrating the temperature sensor, during which phase change the material remains in the solid state.