The present invention includes an apparatus for determining and/or monitoring a process variable, especially the temperature, or the flow, of a medium in a containment, including a temperature sensor for registering temperature and a flexible, a heat insulating support element, which is arrangeable on an outer surface of a wall of the containment, wherein the temperature sensor is secured to the support element.

A biological data measurement device includes a substrate disposed at a position spaced a predetermined distance from a body surface of a living organism as a measuring object via a support member so that an air layer is formed between the substrate and the body surface. The substrate is provided with a temperature measurement device including an infrared thermometer for measuring a body surface temperature Tsk of the body surface and a substrate thermometer for measuring a substrate temperature Tsub of the substrate. The temperature measurement device measures the body surface temperature Tsk and the substrate temperature Tsub in the same place at least twice of a first timing A and a second timing B.

A temperature detection system includes a housing, a thermal imaging system at least partially disposed within the housing, and a data correction system communicatively coupled with the thermal imaging system. The thermal imaging system is configured to capture at least one thermal image of a subject. The data correction system is configured to correct at least one error associated with the at least one thermal image of the subject.

A calibration setup for calibrating a temperature sensor includes a temperature calibrator, a temperature measuring unit connected to the temperature sensor, a camera unit configured to detect a measured temperature value and to transmit the measured temperature value to a storage medium in the temperature calibrator. A method of calibrating a temperature sensor using the calibration setup includes heating the temperature sensor to a first calibration temperature; detecting a first temperature value by the camera unit; transmitting the first temperature value from the camera unit to a storage medium in the temperature calibrator; heating the temperature sensor to at least a second calibration temperature; detecting a second temperature value by the camera unit; transmitting the second temperature value from the camera unit to the storage medium; and displaying the detected and stored temperature values on a calibrator indicator display in a respective association with the calibration temperatures.

A system includes a conditioning circuit, resistors connected to pins of the conditioning circuit, and measurement sensors connected to pins of the conditioning circuit. The conditioning circuit is configured to determine resistance values of the resistors and to determine a set of addresses for the measurement sensors based upon a combination of the resistance values of the resistors.

According to examples, an optical fiber-based sensing membrane may include at least one optical fiber, and a substrate. The at least one optical fiber may be integrated in the substrate. The optical fiber-based sensing membrane may include, based on a specified geometric pattern of the at least one optical fiber, an optical fiber-based sensing membrane layout. The substrate may include a thickness and a material property that are specified to ascertain, via the at least one optical fiber and based on the optical fiber-based sensing membrane layout, a thermal and/or a mechanical property associated with a device, or a radiation level associated with a device environment.

The present disclosure includes an HVAC system that includes a plurality of dampers each corresponding to one building zone of a plurality of building zones, a plurality of sensors each corresponding to the one of the plurality of building zones, and a control board communicatively coupled with the plurality of dampers and sensors. The control board includes a plurality of status light sources, each corresponding to one damper the plurality of dampers, a plurality of communication light sources each corresponding to one sensor of the plurality of sensors, and a microcontroller programmed to control operation of equipment in the HVAC system. The microcontroller is configured to perform “a hardware test mode” to facilitate diagnosis of the plurality of dampers by causing the plurality of status light sources to sequentially execute a first light scheme or a second light scheme in response to instructions to the plurality of dampers.

There is provided a mounting table on which a substrate to be inspected is mounted. The mounting table comprises: a plurality of temperature sensors, each configured to measure a temperature of a corresponding one of a plurality of spots on the mounting table; and electrode pads, each connected to a corresponding one of the temperature sensors and installed on a mounting surface.

A low power temperature detection method, system, and apparatus sense when a temperature threshold is reached by connecting a current conveyor (111) with a startup bias circuit (112) having a first FET (P1) (connected to level shift a reference voltage to provide an input voltage V.sub.S1), a first diode-connected BJT (Q0) (connected to generate a base-emitter voltage based on the junction temperature), and a second FET (P2) (connected to level shift the base-emitter voltage), where the startup bias circuit (112) selectively connects the current conveyor (111) to ground to form a closed loop that is activated only when an emitter current at the first diode-connected BJT (Q0) enters a self-turned-on operation region, thereby activating the current conveyor to detect a temperature threshold being reached by the device junction temperature.

The present application provides a temperature calibration method for a semiconductor machine, including following steps: providing at least one temperature calibration sheet, the temperature calibration sheet comprising a transistor having a voltage-temperature characteristic curve corresponding to a set current; placing the temperature calibration sheet in a measurement region of the semiconductor machine; energizing the temperature calibration sheet at an energizing current being the same as the set current, and measuring a voltage of the transistor; and, obtaining a temperature of the transistor according to the voltage-temperature characteristic curve of the transistor by using the voltage as a known parameter, the temperature being a temperature of the measurement region of the semiconductor machine. The accuracy of temperature calibration is greatly improved, the performance of the semiconductor machine and the yield of the semiconductor manufacturing process are also improved.