Patent classifications
G01K17/00
Hand-held test meter with integrated thermal channel
A hand-held test meter includes an electrically and thermally insulating case (“ETIC”) with an outwardly facing surface, a test meter electrical component (“TMEC”) with a thermal contact portion disposed within the electrically-insulating case, and at least one thermal channel. The thermal channel includes a proximal contact portion with a proximal contact surface, a distal contact portion with a distal surface, and a channel portion connecting the proximal contact portion and the distal contact portion. The thermal channel is integrated with the ETIC such that the thermal channel extends through the ETIC from the outwardly facing surface and to the thermal contact portion of the TMEC. The extension is such that the proximal contact surface of the thermal channel is outside of the ETIC and the distal surface of the thermal channel is in contact with the thermal contact portion of the TMEC. The thermal channel is thermally conductive and electrically-insulating.
Controller for thermal analysis apparatus, and thermal analysis apparatus
Provided are a controller for a thermal analysis apparatus, with which thermal characteristics of a measurement target can be grasped, and a thermal analysis apparatus. A controller (51) for a thermal analysis apparatus, which is configured to measure thermal behavior accompanying a temperature change caused by one of heating and cooling of a measurement target (X, Y), is configured to: acquire an intensity of a response signal of the measurement target to an electromagnetic wave with which the measurement target is irradiated with respect to a variable of one of a time and a temperature; differentiate the intensity with respect to the variable; and output a derivative value obtained as a result of the differentiation with respect to one of the temperature and the time, or display the derivative value with respect to one of the temperature and the time on a predetermined display (53).
Controller for thermal analysis apparatus, and thermal analysis apparatus
Provided are a controller for a thermal analysis apparatus, with which thermal characteristics of a measurement target can be grasped, and a thermal analysis apparatus. A controller (51) for a thermal analysis apparatus, which is configured to measure thermal behavior accompanying a temperature change caused by one of heating and cooling of a measurement target (X, Y), is configured to: acquire an intensity of a response signal of the measurement target to an electromagnetic wave with which the measurement target is irradiated with respect to a variable of one of a time and a temperature; differentiate the intensity with respect to the variable; and output a derivative value obtained as a result of the differentiation with respect to one of the temperature and the time, or display the derivative value with respect to one of the temperature and the time on a predetermined display (53).
Self-calibrated flow meter
The present invention relates to a method for estimating the thermophysical properties of a material (Ω) that incorporates at least one temperature sensor (1, 2, 3) and one point heat source (4), the distance between the at least one temperature sensor (1, 2, 3) and the point heat source (4) being known. The method includes the steps of: expression of the theoretical temperature as a function of time at the at least one temperature sensor (1, 2, 3) when the point heat source (4) is activated, said expression depending on the thermophysical parameters of the material (Ω); acquisition of a plurality of temperature measurements by the at least one temperature sensor (1, 2, 3) over a time period during which the point heat source (4) is activated; and determining of the values of the thermophysical parameters of the material (Ω), such that the difference between the theoretical temperatures obtained via said expression and the temperatures that are actually measured is minimal. The present invention also relates to a method for measuring a heat flow (φ(t)) across a surface (Γ) of a material (Ω) and a flow meter (10) designed for this purpose.
Self-calibrated flow meter
The present invention relates to a method for estimating the thermophysical properties of a material (Ω) that incorporates at least one temperature sensor (1, 2, 3) and one point heat source (4), the distance between the at least one temperature sensor (1, 2, 3) and the point heat source (4) being known. The method includes the steps of: expression of the theoretical temperature as a function of time at the at least one temperature sensor (1, 2, 3) when the point heat source (4) is activated, said expression depending on the thermophysical parameters of the material (Ω); acquisition of a plurality of temperature measurements by the at least one temperature sensor (1, 2, 3) over a time period during which the point heat source (4) is activated; and determining of the values of the thermophysical parameters of the material (Ω), such that the difference between the theoretical temperatures obtained via said expression and the temperatures that are actually measured is minimal. The present invention also relates to a method for measuring a heat flow (φ(t)) across a surface (Γ) of a material (Ω) and a flow meter (10) designed for this purpose.
ELECTRONIC DEVICE INCLUDING A PLURALITY OF TEMPERATURE SENSORS
According to various embodiments, a wearable electronic device may include: a housing comprising a first plate including a first surface facing in a first direction, and a second plate including a second surface facing a second direction opposite to the first direction; a substrate disposed in a space between the first plate and the second plate of the housing; a processor; and at least two temperature sensors, wherein the at least two temperature sensors comprise a contact-type temperature sensor and a non-contact-type temperature sensor arranged at positions different from each other in the housing, and the processor is configured to: determine a body temperature using the temperatures measured by the contact-type temperature sensor and the non-contact-type temperature sensor.
TEMPERATURE DIFFERENCE MEASURING APPARATUS
A temperature difference measuring apparatus includes: a bottomed tubular package in which a top face side is opened; a MEMS device disposed on an inner bottom face of the package, the MEMS device comprising at least one thermopile that measures a temperature difference, which is generated in the MEMS device by inflow heat through a bottom of the package; and a heat quantity increasing unit configured to increase a heat quantity flowing out from the MEMS device onto the top face side of the bottomed tubular package.
TEMPERATURE DIFFERENCE MEASURING APPARATUS
A temperature difference measuring apparatus includes: a bottomed tubular package in which a top face side is opened; a MEMS device disposed on an inner bottom face of the package, the MEMS device comprising at least one thermopile that measures a temperature difference, which is generated in the MEMS device by inflow heat through a bottom of the package; and a heat quantity increasing unit configured to increase a heat quantity flowing out from the MEMS device onto the top face side of the bottomed tubular package.
MICRO-HOTPLATE DEVICES WITH RING STRUCTURES
We disclose a micro-hotplate comprising a substrate comprising an etched portion and a substrate portion and a dielectric region over the substrate. The dielectric region comprises first and second portions. The first portion is adjacent to the etched portion of the substrate and the second portion is adjacent to the substrate portion of the substrate. The micro-hotplate further comprises a heater formed in the dielectric region, and a ring structure formed within and/or over the dielectric region such that the ring structure is coupled with the first and second portions of the dielectric region.
MICRO-HOTPLATE DEVICES WITH RING STRUCTURES
We disclose a micro-hotplate comprising a substrate comprising an etched portion and a substrate portion and a dielectric region over the substrate. The dielectric region comprises first and second portions. The first portion is adjacent to the etched portion of the substrate and the second portion is adjacent to the substrate portion of the substrate. The micro-hotplate further comprises a heater formed in the dielectric region, and a ring structure formed within and/or over the dielectric region such that the ring structure is coupled with the first and second portions of the dielectric region.