A device for measuring a thermal conductivity of high-temperature and high-pressure liquid is provided and includes a probe and a liquid flow channel, the probe radially penetrates through the liquid flow channel, both ends of the probe extend out of the liquid flow channel and are connected to a control system via wires; the control system includes a power supply, a voltmeter, an ammeter, a thermocouple and a flowmeter, which are used for energizing the probe, measuring voltage at both ends of the probe, measuring current flowing through the probe, measuring temperature of and a flow velocity of the liquid, respectively. A measuring method is further provided. The device and the method for measuring the thermal conductivity of high-temperature and high-pressure liquid utilize a principle of heat balance and characteristics of liquid sweeping across a circular tube for measurement when the liquid enters a fully developed section.

A device for measuring a thermal conductivity of high-temperature and high-pressure liquid is provided and includes a probe and a liquid flow channel, the probe radially penetrates through the liquid flow channel, both ends of the probe extend out of the liquid flow channel and are connected to a control system via wires; the control system includes a power supply, a voltmeter, an ammeter, a thermocouple and a flowmeter, which are used for energizing the probe, measuring voltage at both ends of the probe, measuring current flowing through the probe, measuring temperature of and a flow velocity of the liquid, respectively. A measuring method is further provided. The device and the method for measuring the thermal conductivity of high-temperature and high-pressure liquid utilize a principle of heat balance and characteristics of liquid sweeping across a circular tube for measurement when the liquid enters a fully developed section.

Apparatus and methods are provided for providing flexible and repairable testing capabilities, including destructive testing, for systems that generate or absorb heat such as energy storage systems. One embodiment can include a temperature bath structure adapted to contain and maintain a fluid bath at a predetermined temperature, an outer containment structure adapted to insert into the temperature bath structure, heat sinks, thermal sensor assemblies, and an internal containment structure where the thermal sensor assemblies, heat sinks removeably attach to different sections of the inner containment structure so as to measure heat flow into or out of the inner containment structure's different sections, and a test cell enclosure which is adapted to contain forces and output from destructive testing of samples. Embodiments of the invention enable rapid insertion/removal of samples as well as replacement of sections of the system including thermal sensor assemblies as well as enabling separate thermal measurements associated with different sections of a sample under test.

Apparatus and methods are provided for providing flexible and repairable testing capabilities, including destructive testing, for systems that generate or absorb heat such as energy storage systems. One embodiment can include a temperature bath structure adapted to contain and maintain a fluid bath at a predetermined temperature, an outer containment structure adapted to insert into the temperature bath structure, heat sinks, thermal sensor assemblies, and an internal containment structure where the thermal sensor assemblies, heat sinks removeably attach to different sections of the inner containment structure so as to measure heat flow into or out of the inner containment structure's different sections, and a test cell enclosure which is adapted to contain forces and output from destructive testing of samples. Embodiments of the invention enable rapid insertion/removal of samples as well as replacement of sections of the system including thermal sensor assemblies as well as enabling separate thermal measurements associated with different sections of a sample under test.

A method for calibrating a furnace enabling a semiconductor material to be subjected to a first thermal donor formation annealing that includes a temperature rise, a first temperature plateau and a temperature drop of the furnace, the method to including providing a calibration piece of the semiconductor material; determining the interstitial oxygen concentration of the piece; subjecting the piece to a second thermal donor formation annealing in the furnace, the second annealing including rise and drop in temperature of the furnace identical to those of the first annealing and a second plateau at the set temperature for a set time; determining the concentration of thermal donors formed in the piece during the second annealing; determining an equivalent annealing time at the set temperature, corresponding at least to the rise and drop in temperature of the furnace, from the interstitial oxygen concentration, the thermal donor concentration of the piece and the set time.

A method of calibrating temperature of a resistive element having a material with a Curie temperature includes generating a standard resistance-temperature (R-T) curve for the resistive element in isothermal conditions to identify values of the R-T curve and an inflection point at the Curie temperature, generating operational R-T curves for the resistive element over an operational time period, comparing the standard R-T curve to the operational R-T curves, and adjusting the operational curves to the standard R-T curve at the Curie temperature to calibrate temperature of the resistive element.

A method of calibrating temperature of a resistive element having a material with a Curie temperature includes generating a standard resistance-temperature (R-T) curve for the resistive element in isothermal conditions to identify values of the R-T curve and an inflection point at the Curie temperature, generating operational R-T curves for the resistive element over an operational time period, comparing the standard R-T curve to the operational R-T curves, and adjusting the operational curves to the standard R-T curve at the Curie temperature to calibrate temperature of the resistive element.

The invention relates to a self-calibrating calorimeter using electrical substitution comprising means for measuring a plurality of physical values of different types and of different levels. The calorimeter according to the invention comprises a single acquisition card comprising, for each value to be measured, an independent acquisition system comprising processing circuits specific to the value measured.

The invention relates to a self-calibrating calorimeter using electrical substitution comprising means for measuring a plurality of physical values of different types and of different levels. The calorimeter according to the invention comprises a single acquisition card comprising, for each value to be measured, an independent acquisition system comprising processing circuits specific to the value measured.

A controller includes: a communication attachment member configured to be detachably attached to a measuring device body; a second light emitter/receiver provided to a communication attachment member and configured to transmit/receive a signal to/from a first light emitter/receiver of the measuring device body; and a second controller configured to transmit/receive a signal to/from the second light emitter/receiver. An electronic circuit unit, electronic calibration unit, first control unit, signal transmission unit and the first light emitter/receiver are provided inside a housing of the measuring device body. A window is hermetically provided to a plate of the measuring device body. The communication attachment member includes a cover configured to be disposed so that the second light emitter/receiver faces the window and an engagement portion provided to the cover to be engageable with the housing.