A method of determining a temperature distribution in a mold plate of a mold for a metal-making process, wherein the method includes: obtaining a temperature value from each of a plurality of temperature sensors arranged in the mold plate, each temperature sensor being spaced apart from a respective reference point in the mold plate, determining for each temperature value a reference point temperature value at the corresponding reference point using either a respective linear function or a respective non-linear function, wherein a correction factor and correction term of the linear function or a set of parameters in a general non-linear formulation of the non-linear function is obtained from a plurality of initial temperature relationships, wherein each initial temperature relationship is between a simulated temperature at the corresponding temperature sensor in the mold plate and a simulated temperature at the corresponding reference point in the mold plate, each simulated temperature being obtained based on a respective simulation of a model of the mold plate for a unique mold plate condition where the thermal boundary conditions of the mold plate have been completely, explicitly and uniquely stated, and obtaining an estimated temperature distribution at the reference points in the mold plate by means of the reference point temperature values.

A sensor capsule for a heat flux sensor includes a hot end and a cold end. The sensor capsule includes a thermal conductor extending from the hot end toward the cold end, and a plurality of temperature sensors coupled to the thermal conductor at different distances from the hot end.

A system may include a transformer that may convert a first voltage to a second voltage, such that the second voltage is output via a conductor. The system may also include a wireless current sensor that may detect current data associated with current conducting via the conductor and a processor. The processor may receive the current data, determine one or more temperature measurements associated with the transformer based on the current data, and send a signal to a component in response to the one or more temperature measurements exceeding one or more respective threshold values.

A method of determining a temperature distribution in a mold plate of a mold for a metal-making process, wherein the method includes: obtaining a temperature value from each of a plurality of temperature sensors arranged in the mold plate, each temperature sensor being spaced apart from a respective reference point in the mold plate, determining for each temperature value a reference point temperature value at the corresponding reference point using either a respective linear function or a respective non-linear function, wherein a correction factor and correction term of the linear function or a set of parameters in a general non-linear formulation of the non-linear function is obtained from a plurality of initial temperature relationships, wherein each initial temperature relationship is between a simulated temperature at the corresponding temperature sensor in the mold plate and a simulated temperature at the corresponding reference point in the mold plate, each simulated temperature being obtained based on a respective simulation of a model of the mold plate for a unique mold plate condition where the thermal boundary conditions of the mold plate have been completely, explicitly and uniquely stated, and obtaining an estimated temperature distribution at the reference points in the mold plate by means of the reference point temperature values.

A method including steps of (1) heating, with a heating system, an apparatus comprising an enclosure assembly and a temperature emulation assembly positioned within said enclosure assembly; (2) thermally isolating said temperature emulation assembly from said heating system with said enclosure assembly; (3) permitting conductive heat transfer to said temperature emulation assembly only through an enclosure assembly-leading end of said enclosure assembly; and (4) representing a hottest temperature and a coldest temperature of an article being emulated by said apparatus with said temperature emulation assembly.

An apparatus for measuring a temperature distribution on a surface has a first plurality of conductors, which are each arranged parallel in relation to one another, and a second plurality of conductors, which are each arranged parallel in relation to one another. The apparatus further has a connection conductor, which is electrically conductively connected to a voltage source, and an evaluation unit. Each conductor of the first plurality of conductors crosses each conductor of the second plurality of conductors and each conductor of the first plurality of conductors is electrically isolated from each conductor of the second plurality of conductors. A first conductor end of the conductors, both of the first plurality of conductors and also of the second plurality of conductors, is in each case electrically conductively connected to the connection conductor, and a second conductor end of the conductors, both of the first plurality of conductors and also of the second plurality of conductors, is in each case connected to a voltage measuring apparatus which is arranged and designed to determine a voltage drop across the individual conductors in each case. The evaluation unit is designed to ascertain a temperature distribution on the basis of the determined voltage drops across the individual conductors.

A gas monitor apparatus includes a sorbent material that adsorbs a target gas based on a concentration of the target gas in a monitored environment and a reference material that does not respond to the target gas. The gas monitor also includes a first thermistor disposed within the sorbent material and a second thermistor disposed within the reference material, the first thermistor to provide a first indication of a first temperature of the sorbent material and the second thermistor to provide a second indication of a second temperature of the reference material. A processing device determines a concentration of the target gas based at least in part on a differential measurement between the first temperature and the second temperature.

Examples are disclosed that relate to mapping a plurality of temperatures across an area. One example provides a temperature sensing device including a flexible support and a temperature sensing structure having a plurality of individually readable temperature sensing junctions. The temperature sensing structure includes a line of a first conductive material extending across an area of the support, and a plurality of lines of a second conductive material each intersecting the line of the first junction material at a corresponding sensing junction.

Various examples are provided related to scanning tunneling thermometers and scanning tunneling microscopy (STM) techniques. In one example, a method includes simultaneously measuring conductance and thermopower of a nanostructure by toggling between: applying a time modulated voltage to a nanostructure disposed on an interconnect structure, the time modulated voltage applied at a probe tip positioned over the nanostructure, while measuring a resulting current at a contact of the interconnect structure; and applying a time modulated temperature signal to the nanostructure at the probe tip, while measuring current through a calibrated thermoresistor in series with the probe tip. In another example, a device includes an interconnect structure with connections to a first reservoir and a second reservoir; and a scanning tunneling probe in contact with a probe reservoir. Electrical measurements are simultaneously obtained for temperature and voltage applied to a nanostructure between the reservoirs.

Methods and apparatus for measuring and optionally adjusting the temperature profile of an optical window. In one example, an optical window with integrated temperature sensing functionality includes a first window layer of an optically transparent material, a second window layer of the optically transparent material, an electromagnetic interference shielding grid disposed between the first and second window layers and including a first electrically conductive structure and a second electrically conductive structure, and a thermally sensitive material disposed between the first and second electrically conductive structures, the thermally sensitive material having an electrical property that varies as a function of temperature.