A sensor capsule for a heat flux sensor includes a hot end and a cold end. The sensor capsule includes a thermal conductor extending from the hot end toward the cold end, and a plurality of temperature sensors coupled to the thermal conductor at different distances from the hot end.

An apparatus includes a printed wiring board including multiple layers including inner and outer layers. At least one of the inner layers includes an integral temperature sensor matrix. The temperature sensor matrix includes multiple temperature sensors arrayed over at least part of area occupied by the at least one of the layers. A method includes measuring information corresponding to temperatures in the temperature sensor matrix, and outputting indications of the information. The information may be displayed, e.g., as a thermal image of the printed wiring board.

Disclosed is a system for measuring a surface temperature. The system may comprise a printed circuit board, an insulator block, a conductive probe, a plurality of temperature sensors, and a plurality of compressive contact pins. The conductive probe may have a first surface and a second surface opposite the first surface. The conductive probe may be coupled to the insulator block. The plurality of temperature sensors may be coupled to the insulator block and translatable in a first direction within the insulator block. Translation of the plurality of temperature sensors in the first direction may cause each of the plurality of temperature sensors to contact the first surface of the conductive probe. The plurality of compressive contact pins may each be electrically couple a corresponding temperature sensor to the printed circuit board.

A semiconductor device may include a semiconductor die having an active region. The semiconductor device may also include a thermocouple mesh proximate to the active region. The thermocouple mesh may include a first set of wires of a first material extending in a first direction, and a second set of wires of a second material. The second material may be different from the first material. In addition, the second set of wires may extend in a second direction different than the first direction of the first wires.

The invention relates to a device (1) for storing an object or a substance, in particular a medication, having a container (2, 20) with a container space for storing the object or the substance and having a monitoring device (5), which comprises a first sensor (6) for detecting measurement data and a processing device (10) for determining a irradiation input and/or heat input and/or the temperature and/or a temperature profile of the object or the substance or of the container space using the detected measurement data, wherein the first sensor is a sensor (6) for detecting electromagnetic radiation, in particular a semiconductor sensor or a thermopile.

A method for profiling a laser beam includes receiving the laser beam at a thermochromic interface of a detector. A temperature set point for the detector can be selected. The temperature set point can correspond to an equilibrium temperature at the thermochromic interface. The method can also include capturing an image of the thermochromic interface and using the image to determine a partial intensity profile corresponding to at least a portion of the beam intensity profile. A reconstructed beam profile can be assembled using the partial intensity profile. If the reconstructed beam profile is not complete, the method can include iterating over additional temperature set points to determine additional partial intensity profiles. The method can also include determining that the reconstructed beam profile is complete and outputting the reconstructed beam profile.

Disclosed are various embodiments for an automated temperature logging and predictive alerting system for monitoring items that are being cooled or heated. In one embodiment, a predictive logging application may compare a predicted temperature curve of an item to a predefined slope to predict whether or not the item will meet a target threshold. The target threshold may be a target temperature or duration rule that can be aggregated discontinuously over a single day or multiple days. If the projected temperature curve is predicted to not meet the target threshold, the logging application may send alerts notifying a client of available corrective actions. In projecting the predicted slope, the predictive logging application may train machine learning models to analyze historical data associated with the item and the user.

A heat flux sensor module includes: a first film including a first surface; a plurality of sensor chips which are disposed spaced apart from each other on the first surface and detect heat flux; a second film stacked on the first surface of the first film so that the plurality of sensor chips are sandwiched between the first film and the second film; and a heat conducting member which is disposed between adjacent sensor chips and has higher heat conductivity than air. The heat conducting member is in contact with both the first film and the second film.

A technique utilizes spatially resolved temperature measurements to infer the temperature of a subsea infrastructure. According to an embodiment, temperature data, e.g. a temperature map, is determined for the subsea infrastructure and comprises performing remote temperature measurements of water surrounding the subsea infrastructure. Additionally, a metrological scan of the subsea structure may be obtained. Furthermore, a simulation or simulations may be run for an assumed temperature profile along a surface of the subsea infrastructure. The data obtained from the remote temperature measurements, the metrological scan, and the simulation is processed to determine a temperature profile of the subsea infrastructure. This temperature profile can then be used to facilitate a variety of subsea infrastructure management decisions.

A technique for measuring the resistance of a resistive element 4 in the presence of a series diode is provided. By supplying three different currents I.sub.1, I.sub.2, I.sub.3 and measuring corresponding voltages V.sub.1, V.sub.2, V.sub.3 across the resistive element and diode, the voltages can be combined to at least partially eliminate an error in the measured resistance of the resistive element caused by a voltage drop across the diode. A technique for current control in an array of resistive elements is also described in which a column of resistive elements is provided with two or more current sources switched so that while one current source is providing current to the column line corresponding to a selected resistive element, another current source has its amount of current adjusted.