A temperature sensing assembly includes a sheath defining an interior space, a first temperature sensor and a second temperature sensor. The first temperature sensor has first and second conductors extending within the interior space of the sheath and joined at a first junction point. The first conductor is constructed of a first material and the second conductor is constructed of a second material that is different than the second material. The second temperature sensor has third and fourth conductors extending within the interior space of the sheath and joined at a second junction point. The third conductor is constructed of a third material and the fourth conductor is constructed of a fourth material that is different than the fourth material. The first material is different than each of the third and fourth materials. The first junction point is adjacent to the second junction point.

A furnace monitoring system for monitoring a furnace over a span of time during furnace operation, including a thermal imaging apparatus, the apparatus is disposed outside of the furnace and at a distance from the exterior of the furnace to generate field signals of the furnace; a signal processing unit configured and programmed for receiving the field signals and generating a temperature map of the exterior of the furnace; and a means for displaying the temperature map locally or remotely. Wherein in that the furnace monitoring system is a system for monitoring the furnace over a span of time during furnace operation and in that the generated temperature map is divided into several zones, which correspond to different components of the furnace selected from burner, viewing port for burner observation, charging port, discharging port and flue gas channel.

A non-invasive thermometry system adapted for use during hyperthermia therapy, which has at least one infrared camera and a computer device. The infrared camera monitors temperature at the skin surface. The system may also provide depth visualization of the thermal gradient, and noninvasively monitors temperature at a tumor depth. A thermal camera, preferably an infrared camera, may be placed at a predetermined angle to an ultrasound head for a visual map of the heat signature within a patient.

A temperature sensing assembly includes a sheath defining an interior space, a first temperature sensor and a second temperature sensor. The first temperature sensor has first and second conductors extending within the interior space of the sheath and joined at a first junction point. The first conductor is constructed of a first material and the second conductor is constructed of a second material that is different than the second material. The second temperature sensor has third and fourth conductors extending within the interior space of the sheath and joined at a second junction point. The third conductor is constructed of a third material and the fourth conductor is constructed of a fourth material that is different than the fourth material. The first material is different than each of the third and fourth materials. The first junction point is adjacent to the second junction point.

An ostomy bag can include one or more sensors for measuring one or more metrics. An ostomy wafer can also include one or more sensors for measuring one or more metrics. The sensors can be temperature sensors and/or capacitive sensors, for example, and the metrics can include bag fill, leakage, skin irritation, and phase of stoma output, among others.

A temperature sensing system senses a temperature in the monitor space. The temperature sensing system includes a first detector, a second detector, and a processing unit. The first detector detects a temperature on a ceiling and outputs first information about the temperature on the ceiling. The second detector detects infrared radiation emitted from a floor and outputs second information about the infrared radiation from the floor. The processing unit calculates, based on at least the first information and the second information, a spatial temperature distribution which includes a component in a height direction with respect to the monitor space between the ceiling and the floor.

To provide a new temperature distribution evaluation method, a temperature distribution evaluation device, and a soaking range evaluation method, as the temperature distribution evaluation method which evaluates a temperature distribution of a heating area 40A provided in a heating device 40, the present invention is a temperature distribution evaluation method which, in the heating area 40A, heats a semiconductor substrate 10 and a transmitting and receiving body 20 for transporting a raw material to and from the semiconductor substrate 10, and evaluates a temperature distribution of the heating area 40A on the basis of a substrate thickness variation amount A of the semiconductor substrate 10. Accordingly, temperature distribution evaluation can be implemented for a high temperature area at 1600-2200° C. or the like at which it is hard to evaluate the temperature distribution due to the limit of a thermocouple material.

A temperature sensing assembly includes a sheath defining an interior space, a first temperature sensor and a second temperature sensor. The first temperature sensor has first and second conductors extending within the interior space of the sheath and joined at a first junction point. The first conductor is constructed of a first material and the second conductor is constructed of a second material that is different than the second material. The second temperature sensor has third and fourth conductors extending within the interior space of the sheath and joined at a second junction point. The third conductor is constructed of a third material and the fourth conductor is constructed of a fourth material that is different than the fourth material. The first material is different than each of the third and fourth materials. The first junction point is adjacent to the second junction point.

A hybrid integrated thermal sensor device includes a magnetic tunnel junction (MTJ) device electrically coupled in series with at least one CMOS transistor and disposed between a voltage rail terminal and a ground terminal. An output terminal is electrically coupled to a drain of the at least one CMOS transistor. The MTJ operates in an anti-parallel state and the output terminal provides a voltage indicative of a temperature of the MTJ device based on an MTJ antiparallel resistance. A distributed sensor network for real-time thermal mapping of an integrated circuit (IC) is also described.

A bathythermograph buoy and an associated method of operation are provided to measure temperature and/or optionally other parameter(s) within an ocean or another body of water. A bathythermograph buoy includes a housing and one or more sensors carried by the housing and configured to repeatedly measure one or more respective parameters as the bathythermograph buoy descends. The bathythermograph buoy of one example also includes a memory carried by the housing and configured to store representations of the one or more respective parameters measured by the one or more sensors. The bathythermograph buoy further includes a buoyancy modification device configured to increase buoyancy of the bathythermograph buoy to permit the bathythermograph buoy to ascend.