Methods and Apparatus for estimating a temperature of an electromechanical transducer. The method comprising receiving an audio signal (901); providing an output signal to the electromechanical transducer, based on the audio signal (902); and determining whether a first magnitude of the audio signal in a first frequency band is above a magnitude threshold (903). In response to the first magnitude being above or equal to the magnitude threshold, calculating a first impedance of the electromechanical transducer based on measurements of a first voltage and a first current of the electromechanical transducer within the first frequency band (905), and estimating the temperature of the electromechanical transducer based on the first impedance (907). In response to the first magnitude being below the magnitude threshold, inserting a pilot tone into the audio signal (909), wherein the pilot tone is at a pilot tone frequency, calculating a second impedance of the electromechanical transducer based on measurements of a second voltage and a second current of the electromechanical transducer at the pilot tone frequency (911), and estimating the temperature of the electromechanical transducer based on the second impedance (913).

Devices and method for performing temperature measurements in a printhead. In one embodiment, a printhead includes at least one row of jetting channels configured to jet droplets of a print fluid using piezoelectric actuators. A drive circuit includes an input voltage generator that applies a step voltage to a piezoelectric actuator of a jetting channel, and an output voltage detector that detects an output voltage across the piezoelectric actuator over time in response to the step voltage. The drive circuit also includes a temperature detector that determines a voltage response to the step voltage at the piezoelectric actuator based on the output voltage over time, and determines a temperature measurement for the piezoelectric actuator based on the voltage response of the piezoelectric actuator.

A temperature sensing device is provided for sensing a temperature of a second device. A thermal detection signal is provided with a first clock frequency, and an electronic signal based on a second clock frequency, lower than the first clock frequency, is received from the second device. A time duration is measured between timing instants of the thermal detection signal and the electronic signal, and from an analysis of a set of measured time durations, a temperature at the second device is determined, based on knowledge of the frequency-temperature characteristics of the electronic signal.

According to the present invention, a semiconductor device includes a semiconductor chip, resistance of which changes in accordance with temperature, an external resistor connected in series with the semiconductor chip and a detector configured to detect, while a first voltage is applied between both ends of a series circuit formed by the semiconductor chip and the external resistor, a second voltage applied between both ends of the external resistor, wherein the detector calculates a temperature of the semiconductor chip from the second voltage.

The performance of a microelectromechanical systems (MEMS) device may be subject to unwanted thermal gradients or nonuniform temperatures. The thermal gradients may be approximated based on voltage measurements taken through bond wires coupled to bond points located on the MEMS device. Thermal gradient measurement may be improved depending on the arrangement of bond wires and/or the material of the bond wires. Sense circuitry that is coupled to the MEMS device may determine corrective actions, such as updating the operation of the MEMS device, that compensate for the adverse effects from the thermal gradients.

According to the present invention, a semiconductor device includes a semiconductor chip, resistance of which changes in accordance with temperature, an external resistor connected in series with the semiconductor chip and a detector configured to detect, while a first voltage is applied between both ends of a series circuit formed by the semiconductor chip and the external resistor, a second voltage applied between both ends of the external resistor, wherein the detector calculates a temperature of the semiconductor chip from the second voltage.

Examples of the present disclosure relate to a device, method, and medium storing instructions for execution by a processor for estimating motor winding temperature. In an example, a device for estimating motor winding temperature includes a motor shaft and a motor winding. The device may include a current sense resistor to detect the current passing through a common wiring. The device may include a digital to analog converter to convert an input voltage to an analog signal for comparison to the voltage and to generate a differential voltage using the signals received from the current sense resistor and an initial voltage supplied to the motor winding. The device may include a processor to use the differential voltage and a current input value to calculate a resistance of the motor winding from comparison to a temperature conversion curve.

The present invention relates to a method and system for determining the position of the armature of a solenoid using a controller to determine the temperature of the solenoid and to indirectly determine the position of the armature without the need of an additional sensor using current sensing pulses and a solenoid capable of staying engaged due to residual magnetism after the coil has been de-energized.

A temperature of an electronic circuit device such as an integrated circuit is measured with high accuracy. The electronic circuit device (10) includes a main processor (20) and a temperature measurement module (30). The main processor (20) can execute predetermined signal processing. The temperature measurement module (30) generates a signal having a correspondence relationship with the temperature of the main processor (20) under a mode in which the temperature measurement module is driven at a predetermined low power consumption or less and the thermal resistance between the temperature measurement module and the main processor (20) is a predetermined thermal resistance value or less.

A method of detecting an environment vale of an electronic device is provided. The method includes measuring a state of one or more units related to the electronic device, determining a value based at least in part on the measured state of the one or more units related to the electronic device, determining an operation state of the electronic device according to the value, and generating an approximated environment value according to the operation state. Further, other various embodiments are available.