G01L1/00

Process-induced distortion prediction and feedforward and feedback correction of overlay errors

Systems and methods for prediction and measurement of overlay errors are disclosed. Process-induced overlay errors may be predicted or measured utilizing film force based computational mechanics models. More specifically, information with respect to the distribution of film force is provided to a finite element (FE) model to provide more accurate point-by-point predictions in cases where complex stress patterns are present. Enhanced prediction and measurement of wafer geometry induced overlay errors are also disclosed.

Process-induced distortion prediction and feedforward and feedback correction of overlay errors

Systems and methods for prediction and measurement of overlay errors are disclosed. Process-induced overlay errors may be predicted or measured utilizing film force based computational mechanics models. More specifically, information with respect to the distribution of film force is provided to a finite element (FE) model to provide more accurate point-by-point predictions in cases where complex stress patterns are present. Enhanced prediction and measurement of wafer geometry induced overlay errors are also disclosed.

Stress measurement device, stress measurement system, and stress measurement method

A stress measurement device includes a first obtaining unit obtaining thermal data including information indicating a temperature of a measuring region, a second obtaining unit obtaining data related to stress occurring in one part of the measuring region, and a controller finding stress occurring in the measuring region from the thermal data and the data related to the stress. The controller finds, first waveform data respectively on the one part and a part other than the one part based on a change with time of the thermal data, and second waveform data based on a change with time of the data related to the stress. The controller finds, disturbance data through a deduction of the second waveform data from the first waveform data on the one part, and stress data indicating stress occurring in the part through a deduction the disturbance data from the first waveform data on the part.

Stress measurement device, stress measurement system, and stress measurement method

A stress measurement device includes a first obtaining unit obtaining thermal data including information indicating a temperature of a measuring region, a second obtaining unit obtaining data related to stress occurring in one part of the measuring region, and a controller finding stress occurring in the measuring region from the thermal data and the data related to the stress. The controller finds, first waveform data respectively on the one part and a part other than the one part based on a change with time of the thermal data, and second waveform data based on a change with time of the data related to the stress. The controller finds, disturbance data through a deduction of the second waveform data from the first waveform data on the one part, and stress data indicating stress occurring in the part through a deduction the disturbance data from the first waveform data on the part.

Force sensor

A strain body of a force sensor according to the present invention includes a tilting structure disposed between a force receiving body and a support body, a force-receiving-body-side deformable body connecting the force receiving body and the tilting structure, and a support-body-side deformable body connecting the tilting structure and the support body. The tilting structure includes a first tilting body that extends in a second direction orthogonal to a first direction and that is elastically deformable by the action of force in the first direction.

Earphone with force sensor

There is provided a force sensor including a substrate and a polymer material layer. The substrate has a circuit layout that includes a first electrode and a second electrode configured to form a capacitor therebetween. The polymer material layer covers at least on a space between the first electrode and the second electrode, and is used to change capacitance of the capacitor while being pressed. The force sensor is arranged inside a stem of an earphone for detecting the user input.

Electronic strut monitor

A monitor configured to be removably coupled to a strut that forms part of a temporary support structure. The monitor may include an electronic monitoring device that includes a load cell. The monitor may be configured to be position in-line with strut and subject to the same forces exerted upon the strut. Further the monitor may be configured to wirelessly communicate the sensor information to a user.

Force sensor, particularly for a touch pad

A force sensor including: a first part including a detection coil; a second part positioned opposite the first part and including: a ferromagnetic plate translationally movable relative to the first part to move towards the first part when a force is transferred to the sensor and to reduce reluctance of a magnetic circuit formed by the first and second parts in series with a variable gap; and an electronic detection circuit configured to generate a signal dependent on the reluctance of the magnetic circuit. The ferromagnetic plate is formed by an amorphous metal alloy.

Force sensor, particularly for a touch pad

A force sensor including: a first part including a detection coil; a second part positioned opposite the first part and including: a ferromagnetic plate translationally movable relative to the first part to move towards the first part when a force is transferred to the sensor and to reduce reluctance of a magnetic circuit formed by the first and second parts in series with a variable gap; and an electronic detection circuit configured to generate a signal dependent on the reluctance of the magnetic circuit. The ferromagnetic plate is formed by an amorphous metal alloy.

Diverse integrated processing using processors and diverse firmware

Fault detection devices, systems, and methods are provided which implement identical processors. A first processor is configured to receive a first measurement, execute a first firmware based on the first measurement, and output a first result of the executed first firmware. A second processor is configured to receive a second measurement, execute a second firmware based on the second measurement, and output a second result of the executed second firmware. The first firmware and the second firmware provide a same nominal function in a diverse manner for calculating the first result and the second result, respectively, such that the first result and the second result are expected to be within a predetermined margin.