Various embodiments are directed to a pressure sensor and method of using the same. A pressure sensor may comprise a substrate having a substrate thickness extending between a first substrate surface and a second substrate surface, wherein the first substrate surface and the second substrate surface define opposing ends of the substrate thickness; a first pressure sensing assembly attached to the first substrate surface and configured to detect a first pressure force associated with a first fluid volume, wherein a portion of the first substrate surface adjacent the first pressure sensing assembly is fluidly isolated from the first volume of fluid; and a second pressure sensing assembly attached to the second substrate surface and configured to detect a second pressure force associated with a second volume of fluid, wherein a portion of the second substrate surface adjacent the second pressure sensing assembly is fluidly isolated from the second fluid volume.

A capacitive sensor is disclosed. In an embodiment a semiconductor device includes a die including a capacitive pressure sensor integrated on a CMOS circuit, wherein the capacitive pressure sensor includes a first electrode and a second electrode separated from one another by a cavity, the second electrode including a suspended tensile membrane, and wherein the first electrode is composed of one or more aluminum-free layers containing Ti.

A pressure sensor device for a pressure sensor, in particular a capacitive pressure sensor, having a pressure chamber bounded by a movable sensing membrane and a stationary counterelectrode of the pressure sensor device. The sensing membrane and the counterelectrode each run in the longitudinal direction and the transverse direction of the pressure sensor device. The sensing membrane is directly or indirectly spring-mounted, in particular spring-mounted in two-dimensional fashion, in the pressure chamber relative to the counterelectrode by at least one micromechanical spring element, in particular a plurality of micromechanical spring elements.

A diaphragm vacuum gauge includes: a sensor chip that includes a first electrode provided on a base and a second electrode provided on a diaphragm so as to face the first electrode, the diaphragm and the base being disposed with a gap therebetween, and in which a distance between the first electrode and the second electrode changes in accordance with displacement of the diaphragm caused by pressure of a measurement target medium; an operational amplifier that converts a current output from the first electrode to a voltage and amplifies the voltage; and a coaxial cable that connects the first electrode and the operational amplifier with each other. The first electrode is connected to a virtual ground of the operational amplifier by a core wire of the coaxial cable.

MEMS based sensors, particularly capacitive sensors, potentially can address critical considerations for users including accuracy, repeatability, long-term stability, ease of calibration, resistance to chemical and physical contaminants, size, packaging, and cost effectiveness. Accordingly, it would be beneficial to exploit MEMS processes that allow for manufacturability and integration of resonator elements into cavities within the MEMS sensor that are at low pressure allowing high quality factor resonators and absolute pressure sensors to be implemented. Embodiments of the invention provide capacitive sensors and MEMS elements that can be implemented directly above silicon CMOS electronics.

A diaphragm pressure transducer includes a body having an outer surface and a diaphragm, a strain gauge including a resistive element located on the outer surface, a fluidic inlet, and a fluidic cavity enclosed by the body in fluidic communication with the fluidic inlet, the fluidic cavity having an upper surface. The diaphragm is located between the upper surface of the fluidic cavity and the outer surface of the body. The diaphragm includes a variable thickness across a region defined between the upper surface of the fluidic cavity and the outer surface located below the strain gauge.

A variable diaphragm is provided. The variable diaphragm includes: first and second substrates opposite to each other; a light detector on a side of the first substrate distal to the second substrate, and configured to detect an intensity of incident light and generate a first signal; an electrowetting microfluid medium layer between the first and second substrates, and including transparent and opaque fluid mediums immiscible with each other, wherein an aperture of the variable diaphragm is formed by the transparent fluid medium, and one of the transparent and opaque fluid mediums is conductive; and a driving electrode between the first and second substrates, and configured to receive a driving voltage corresponding to the first signal and for driving the electrowetting microfluid medium layer, so as to change an area of an orthographic projection of the opaque fluid medium fluid medium on the second substrate, thereby changing a diameter of the aperture.

A device includes a sensor die, an electrical coupling, a substrate, a liquid detection unit, and a housing unit. The sensor die is coupled to the substrate via the electrical coupling. The liquid detection unit electrically is coupled to the sensor die. The housing unit and the substrate are configured to house the sensor die, the liquid detection unit, and the electrical coupling. The housing unit comprises an opening that exposes the sensor die to an environment external to the housing unit. The liquid detection unit detects presence of liquid within an interior environment of the housing unit. In some embodiments, the device further includes a gel filled within the interior environment of the housing unit covering the sensor die and the substrate. The gel, e.g., silicone, fluoro silicone, etc., is configured to protect the sensor die, the electrical coupling, and the substrate from exposure to the liquid.

A pressure sensor includes a sensor chip. The sensor chip has two diaphragms, recessed portions that serve as first pressure inlet chambers disposed so as to respectively adjoin top surfaces of the diaphragms, and recessed portions that serve as second pressure inlet chambers disposed so as to respectively adjoin bottom surfaces of the diaphragms. A cavity is provided in the sensor chip such that, when a difference between pressures respectively applied to a top surface and bottom surface of the diaphragm is zero, an output voltage of a Wheatstone bridge circuit made up of strain gauges provided in the diaphragm is zero.

A no-gel sensor package is disclosed. In one embodiment, the package includes a microelectromechanical system (MEMS) die having a first substrate, which in turn includes a first surface on which is formed a MEMS device. The package also includes a polymer ring with an inner wall extending between first and second oppositely facing surfaces. The first surface of the polymer ring is bonded to the first surface of the first substrate to define a first cavity in which the MEMS device is contained. A molded compound body having a second cavity that is concentric with the first cavity, enables fluid communication between the MEMS device and an environment external to the package.