A seal configured to seal a gap between a first component and a second component to at least partially retain a fluid on a first side of the seal in a space between the first component and the second component, the seal including a seal body having a radially outer periphery and a central opening configured to receive the first component or the second component, at least one sensor configured to detect a characteristic of the fluid and an adapter. The at least one sensor is disposed on the adapter, and the adapter has a first portion extending through the seal body at a location spaced from and radially between the radially outer periphery and the central opening and a second portion axially abutting the seal body on the first side of the seal.

A seal configured to seal a gap between a first component and a second component to at least partially retain a fluid on a first side of the seal in a space between the first component and the second component, the seal including a seal body having a radially outer periphery and a central opening configured to receive the first component or the second component, at least one sensor configured to detect a characteristic of the fluid and an adapter. The at least one sensor is disposed on the adapter, and the adapter has a first portion extending through the seal body at a location spaced from and radially between the radially outer periphery and the central opening and a second portion axially abutting the seal body on the first side of the seal.

A semiconductor sensor assembly for use in a corrosive environment comprises a processing device comprising at least one first bondpad of a material which may be corroded by a corrosive component in a corrosive environment; a sensor device comprising at least one second bondpad consisting of and/or being covered by a first corrosion resistant material; at least one bonding wire for making a signal connection between the at least one first bondpad of the processing device and the second bondpad of the sensor device. The processing device is partially overmoulded by a second corrosion resistant material, and is partially exposed to a cavity in the corrosion resistant material, with the sensor device being present in the cavity. A redistribution layer is provided to enable signal connection between the processing device and the sensor device is physically made in the cavity while the second corrosion resistant material covers the first bondpad.

A semiconductor sensor device is assembled using a lead frame having a flag surrounded by lead fingers. A pressure sensor die is mounted on the flag and electrically connected to the leads. Prior to encapsulation, a pre-formed block of gel material is placed over the sensor region on the die. Encapsulation is performed and mold compound covers the pressure sensor die and the bond wires. Mold compound covering the gel block may be removed. Additionally, a trench may be formed around an upper portion of the gel block so that the lateral sides of the gel block are at least partially exposed.

A resin flow analysis method includes dividing a mold space model into small elements, acquiring a penetration coefficient, acquiring a flow conductance, and performing flow analysis of a resin in each of the small elements in the mold space model based on a first relational expression of the small elements of a base material portion relating to the penetration coefficient and a second relational expression of the small elements of a space portion relating to the flow conductance.

A probe for the measurement of the total pressure or temperature of a two phase wet gas flow is also disclosed. Embodiments provide a stem, a tip on the top of the stem, a cup serving as a shield is formed in the tip, a at least one tube or thermal element positioned within the cup serving as a measuring device for the incoming wet gas flow; at least one hole which passes through at least one wall of the cup; and a pressure changing device configured to accelerate the wet gas flowing around the cup. A method and system for the measurement of the total pressure or temperature of a two phase wet gas flow is also disclosed.

A sensor module, including a main body shell and a sensing device provided in the main body shell; the sensing device includes a sensor, an upper cover plate, a lower cover plate and a circuit plate; the sensor is mounted on the circuit plate; the upper cover plate and the lower cover plate are respectively mounted on the upper and lower sides of the circuit plate, and are configured to support the main body shell and fix the circuit plate; an accommodation cavity for storing an insulating fluid is provided between the upper cover plate and the circuit plate, between the upper cover plate and the sensor, and between the lower cover plate and the circuit plate; and a first acoustic window is provided at a portion of the upper cover plate located above the sensor. Further disclosed are a sensor assembly and an acoustic logging tool.

In a microelectromechanical system (MEMS) pressure sensor, thin and fragile bond wires that are used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC) for the input and output signals between these two chips are replaced by stacking the ASIC on the MEMS pressure sensing element and connecting each other using conductive vias formed in the ASIC. Gel used to protect the bond wires, ASIC and MEMS pressure sensing element can be eliminated if bond wires are no longer used. Stacking the ASIC on the MEMS pressure sensing element and connecting them using conductive vias enables a reduction in the size and cost of a housing in which the devices are placed and protected.

Electrical and mechanical noise in a microelectromechanical system (MEMS) pressure sensor are reduced by the symmetrical distribution of bond pads, conductive vias and interconnects and by the elimination of bond wires used in the prior art to connect a MEMS pressure sensing element to an application specific integrated circuit (ASIC). The bond wires are eliminated by using conductive vias to connect an ASIC to a MEMS pressure sensing element. Extraneous electrical noise is suppressed by conductive rings that surround output signal bond pads and a conductive loop that surrounds the conductive rings and bond pads. The conductive rings and loop are connected to a fixed voltage or ground potential.

The present disclosure is directed to a monolithic MEMS (micro-electromechanical system) platform having a temperature sensor, a pressure sensor and a gas sensor, and an associated method of formation. In some embodiments, the MEMS platform includes a semiconductor substrate having one or more transistor devices and a temperature sensor. A dielectric layer is disposed over the semiconductor substrate. A cavity is disposed within an upper surface of the dielectric layer. A MEMS substrate is arranged onto the upper surface of the dielectric layer and has a first section and a second section. A pressure sensor has a first pressure sensor electrode that is vertically separated by the cavity from a second pressure sensor electrode within the first section of a MEMS substrate. A gas sensor has a polymer disposed between a first gas sensor electrode within the second section of a MEMS substrate and a second gas sensor electrode.