A method for correction of thermal defects using tomographic scanning for additive manufacturing is provided. The method may include forming a portion of an object using an additive manufacturing system based on an intended three-dimensional (3D) model of the object that is in an additive manufacturing system format. The portion of the object is scanned using a tomographic scanner to obtain a model of the portion of the object in a tomographic scanner format. The model is converted from the tomographic scanner format into the additive manufacturing system format to obtain a converted tomographic model; and the converted tomographic model is compared to the intended 3D model to identify a defect in the portion of the object. A modified 3D model may be generated of the object correcting the intended 3D model to address the defect of the portion of the object.

A method for correction of thermal defects using tomographic scanning for additive manufacturing is provided. The method may include forming a portion of an object using an additive manufacturing system based on an intended three-dimensional (3D) model of the object that is in an additive manufacturing system format. The portion of the object is scanned using a tomographic scanner to obtain a model of the portion of the object in a tomographic scanner format. The model is converted from the tomographic scanner format into the additive manufacturing system format to obtain a converted tomographic model; and the converted tomographic model is compared to the intended 3D model to identify a defect in the portion of the object. A modified 3D model may be generated of the object correcting the intended 3D model to address the defect of the portion of the object.

Multi-spectral static CT apparatuses are disclosed. The apparatus includes a ray source in a form of multiple distributed spots, multiple columns of detectors, a data acquisition device, an article carrying and control device, and a multi-spectral projection data processing device. An object of the present disclosure is to combine static CT scanning technology with multi-spectral analysis technology. It has an advantage of a static CT system, such as high scanning speed, simple mechanic structure, and/or cost reduction due to omission of slip ring. It also can perform identification of material in an article, and can be widely applied in occasions such as safety inspection, and smuggling suppression at customs.

A charged particle detector array includes one or more pairs of super modules, one super module in a pair of super modules is positioned above a volume of interest (VOI), and the other super module in the pair of super modules is positioned below the VOI. This calibration technique first calibrates individual super modules in the one or more pairs of super modules while treating each super module being calibrated as a rigid body. Each super module in the one or more pairs of super modules further includes multiple vertically-stacked modules, and each module in the multiple vertically-stacked modules is composed of multiple layers of drift tubes. The calibration technique then calibrates individual modules in each of the super modules while treating each module being calibrated as a rigid body. Next, the calibration technique calibrates individual drift tubes in each layer of the modules.

The present invention relates to improved methods for measuring the renewable bio-source carbon content and renewable bio-content in renewable bioplastic resins produced in manufacturing plants. In particular, the present invention relates to measuring the renewable bio-source carbon content in renewable bioplastic resins produced during a production run by correlating measured δ.sup.13C values are measured by iTOC-CRDS and CM-CRDS with actual renewable bio-source carbon content measurements (AMS or LSC .sup.14C) via a linear regression.

Transmission electron microscopes (TEMs) are being utilized more often in failure analysis labs as processing nodes decrease and alternative device structures, such as three dimensional, multi-gate transistors, e.g., FinFETs (Fin Field Effect Transistors), are utilized in IC designs. However, these types of structures may confuse typical TEM sample (or “lamella”) preparation as the resulting lamella may contain multiple potentially faulty structures, making it difficult to identify the actual faulty structure. Passive voltage contrast may be used in a dual beam focused ion beam (FIB) microscope system including a scanning electron microscope (SEM) column by systematically identifying non-faulty structures and milling them from the lamella until the faulty structure is identified.

A method for performing sub-surface porosity detection in an additively manufactured part. The method includes providing, by a laser radiation source, a first radiation to a region of a powder bed along a beam of the first radiation, the region of the powder bed being part of a corresponding region of an additively manufactured part. Infrared imaging of the region of the powder bed is performed while the first radiation is being provided to the powder bed. A processor generates data sets indicative of the temperature of the region of the powder bed; and the processor further detects, from the data sets, a defect signature indicative of the formation and/or presence of a sub-surface defect in the region of the additively manufactured part.

A method for performing sub-surface porosity detection in an additively manufactured part. The method includes providing, by a laser radiation source, a first radiation to a region of a powder bed along a beam of the first radiation, the region of the powder bed being part of a corresponding region of an additively manufactured part. Infrared imaging of the region of the powder bed is performed while the first radiation is being provided to the powder bed. A processor generates data sets indicative of the temperature of the region of the powder bed; and the processor further detects, from the data sets, a defect signature indicative of the formation and/or presence of a sub-surface defect in the region of the additively manufactured part.

A system usable to adapt an optical device to calculate a condition value. The system utilizes data from an optical device about a field of vision to calculate a condition value such as temperature for a target within the field of vision. The system makes use of an adapter connected to the optical device for transmitting adapter output data and a converter that accesses the adapter output data to calculate the condition value. The adapter components can weigh less than 3 ounces, and encompass a volume of less than 4 cubic inches, making it suitable for deployment on a drone, or remotely operated vehicle.

A system usable to adapt an optical device to calculate a condition value. The system utilizes data from an optical device about a field of vision to calculate a condition value such as temperature for a target within the field of vision. The system makes use of an adapter connected to the optical device for transmitting adapter output data and a converter that accesses the adapter output data to calculate the condition value. The adapter components can weigh less than 3 ounces, and encompass a volume of less than 4 cubic inches, making it suitable for deployment on a drone, or remotely operated vehicle.