A method for assessing a thermal path associated with an integrated circuit includes identifying a heat application mode based on a design type of the integrated circuit. The method also includes measuring a first temperature of at least one thermal sensing device associated with the integrated circuit. The method also includes applying heat to at least a portion of the integrated circuit according to the heat application mode. The method also includes measuring a second temperature of the at least one thermal sensing device. The method also includes determining a difference between the first temperature and the second temperature. The method also includes determining whether a thermal path between the integrated circuit and an associated substrate is sufficient based on a comparison of the difference between the first temperature and the second temperature with a predetermined difference between an initial temperature and a subsequent temperature of the at least one thermal sensing device.

A double capsule assembly includes an outer capsule and an inner capsule configured to be positioned within the outer capsule. The inner capsule is configured to have a sample positioned therein. The double capsule assembly is configured to be placed in a solid media assembly to analyze or synthesize the sample.

A double capsule assembly includes an outer capsule and an inner capsule configured to be positioned within the outer capsule. The inner capsule is configured to have a sample positioned therein. The double capsule assembly is configured to be placed in a solid media assembly to analyze or synthesize the sample.

Apparatuses and methods for using the guarded heat flow meter technique are provided. The apparatuses use the guarded heat flow meter method to measure the thermal conductivity of solid materials in the temperature range of about ambient to 300° C. The material being tested is compressed between two plates with a controlled temperature difference. The thermal conductivity of the material is calculated by measuring the heat flux through a reference sample in series with the material under test. The apparatuses and methods comprise mechanical mechanisms for stack and guard movements and methods of stack compression and measurement for the testing.

A hydrocarbon generation pyrolysis simulation experimental device for centrifugal continuous gas sampling of a hydrocarbon source rock, including a centrifugal turntable, a motor, a quartz sample tube, a heating set, a cooling set, a rotary joint mounted coaxially with a rotating shaft of the centrifugal turntable, a vacuum pump, and vacuum gas collecting pipes, wherein a sealing plug is arranged at an orifice of the quartz sample tube, a thermocouple and a first exhaust pipeline connected with an inlet of the rotary joint are mounted on the sealing plug, the rotary joint is communicated with a vacuum pump through a second exhaust pipeline, a plurality of vacuum gas collecting pipes are respectively communicated with the second exhaust pipeline through an electromagnetic valve, a vacuum pump switching valve is mounted on the second exhaust pipeline at an inlet end of the vacuum pump, and a control circuit board is mounted on the centrifugal turntable.

A hydrocarbon generation pyrolysis simulation experimental device for centrifugal continuous gas sampling of a hydrocarbon source rock, including a centrifugal turntable, a motor, a quartz sample tube, a heating set, a cooling set, a rotary joint mounted coaxially with a rotating shaft of the centrifugal turntable, a vacuum pump, and vacuum gas collecting pipes, wherein a sealing plug is arranged at an orifice of the quartz sample tube, a thermocouple and a first exhaust pipeline connected with an inlet of the rotary joint are mounted on the sealing plug, the rotary joint is communicated with a vacuum pump through a second exhaust pipeline, a plurality of vacuum gas collecting pipes are respectively communicated with the second exhaust pipeline through an electromagnetic valve, a vacuum pump switching valve is mounted on the second exhaust pipeline at an inlet end of the vacuum pump, and a control circuit board is mounted on the centrifugal turntable.

Food processing monitoring systems and method thereof are provided. A method includes obtaining first temperature data from a first temperature sensor at an inlet of a food processing machine; obtaining second temperature data from a second temperature sensor at an outlet of the food processing machine; obtaining current data from a current sensor that is configured to measure current of a motor of the food processing machine; determining presence of food product at the inlet based on a peak current, of the current data at a time the motor starts, being greater than a first current threshold; and logging a temperature of the first temperature data based on the peak current being greater than the first current threshold.

Food processing monitoring systems and method thereof are provided. A method includes obtaining first temperature data from a first temperature sensor at an inlet of a food processing machine; obtaining second temperature data from a second temperature sensor at an outlet of the food processing machine; obtaining current data from a current sensor that is configured to measure current of a motor of the food processing machine; determining presence of food product at the inlet based on a peak current, of the current data at a time the motor starts, being greater than a first current threshold; and logging a temperature of the first temperature data based on the peak current being greater than the first current threshold.

A sensor is disclosed. The sensor according to an embodiment of the present invention may include a substrate; a first electrode pattern disposed on one side of the substrate to form a layer; a second electrode pattern disposed on the one side of the substrate to form a layer and separated from the first electrode pattern; a sensing layer located on the one side of the substrate and covering the first electrode pattern and the second electrode pattern and containing a semiconductor; a protective layer located on the one side of the substrate and covering at least a part of the sensing layer, and containing a material different from that of the sensing layer; a first electrode pad disposed on the one side of the substrate to form a layer and electrically connected to the first electrode pattern; a second electrode pad disposed on the one side of the substrate and electrically connected to the second electrode pattern; and a housing accommodating the substrate and including a filter spaced apart from the substrate, wherein the substrate includes an opening formed adjacent to an outer boundary of the first and second electrode patterns.

A method to monitor and control the temperature of a sample holder of a laboratory instrument during execution of a temperature profile on the sample holder is presented. The laboratory instrument comprises a sample holder with high temperature uniformity and at least three identical temperature sensors. The measured actual temperatures of the sample holder are processed in order to determine if the execution of the temperature profile should be continued or aborted. Furthermore, temperature sensors which measure actual temperatures that do not fulfil certain requirements are excluded from further monitoring and controlling the temperature of a sample holder.