Patent classifications
G01N29/00
Laser testing of a bond interface between two dissimilar materials
A method and apparatus for testing a bond interface is provided. The method comprises directing laser energy at a first surface of a first material connected to a second material by an adhesive at a bond interface. The first surface is opposite the bond interface. A first acoustic impedance of the first material is greater than a second acoustic impedance of the second material. The method also determines whether an inconsistency is present in the bond interface after directing the laser energy.
Fluid quality sensor and cover assembly
A sensor assembly is provided for detecting a concentration of a fluid. The sensor assembly includes a sensing unit and a cover assembly. The sensing unit includes a transmitter configured to transmit a signal into a sensing volume and a receiver configured to receive the signal after the signal passes through a portion of the sensing volume. The cover assembly at least partially encloses the sensing volume and is substantially impermeable to a gas portion of the fluid. The cover assembly includes apertures defined therein which are permeable to the gas portion of the fluid. A first plurality of apertures are defined along a top surface of the cover assembly.
Method for the graphical representation and data presentation of weld inspection results
A system and method directed to displaying images and presenting the data from the phased array ultrasonic testing (PAUT) inspection of a plurality of welded joints within a welded object. The system includes an engine comprising memory, a graphical user interface (GUI), an export module, a transformation module, and a merger module each operably coupled to one another. The export module is used to extract images and data from the PAUT inspection of the welded joints. The exported information is used by the transformation module to create a multi-dimensional representation of the PAUT inspected welded joint for each joint. The merger module combines the information from the export module and the transformation module into an evaluation report for each PAUT inspected welded joint and assembles the evaluation report into a master report for analysis. The system may be communicatively coupled over a network using a network interface.
Inspection robot having a laser profiler
A system includes an inspection robot having an input sensor comprising a laser profiler and a plurality of wheels structured to engage a curved portion of an inspection surface, wherein the laser profiler is configured to provide laser profiler data of the inspection surface; a controller, comprising: a profiler data circuit structured to interpret the laser profiler data; determine a feature of interest is present at a location of the inspection surface in response to the laser profiler data; and wherein the feature of interest comprises a shape description of the inspection surface at the location of the feature of interest.
Inspection robot having a laser profiler
A system includes an inspection robot having an input sensor comprising a laser profiler and a plurality of wheels structured to engage a curved portion of an inspection surface, wherein the laser profiler is configured to provide laser profiler data of the inspection surface; a controller, comprising: a profiler data circuit structured to interpret the laser profiler data; determine a feature of interest is present at a location of the inspection surface in response to the laser profiler data; and wherein the feature of interest comprises a shape description of the inspection surface at the location of the feature of interest.
Calibration technique, apparatus and system for pulsed phase-lock loop ultrasound intracranial pressure measurement systems
A calibration system for a pulsed phase-lock loop ultrasound measurement system comprising an apparatus having a compartment for holding a pressure sensitive liquid. The compartment has an opening by which a flow of the pressure sensitive liquid may be controlled. A sensor arranged relative to the compartment to receive ultrasonic signals that reflect off one or more inner surfaces of the compartment. The system includes a processing device for receiving an integrated error signal output by the sensor based on pressure changes of the pressure sensitive liquid responsive to a change in flow of pressure sensitive liquid between the source and the compartment.
METHOD FOR STORING ULTRASONIC SCAN IMAGE AND ULTRASONIC DEVICE
The present invention provides a method for storing an ultrasonic scan image and an ultrasonic device. The ultrasonic device may include: an image acquiring unit configured to scan a target object to obtain an image; a buffer unit configured to store the obtained image; a processing unit configured to compute a similarity of a frame of the image; and a storage unit, wherein when it is determined that the computed similarity of the frame is less than a threshold, the processing unit stores frames with a similarity equal to or greater than the threshold previous to the frame in the storage unit. Therefore, the image may be stored automatically based upon the similarity information of the frame of the ultrasonic scanning image.
Reverberation chamber loading
A method and system for selectively varying the performance of a test chamber are disclosed. According to one aspect, the performance is affected by a variable absorbing structure of the test chamber. The absorbing structure enables selective exposure of absorbing material to achieve a specific performance.
Reverberation chamber loading
A method and system for selectively varying the performance of a test chamber are disclosed. According to one aspect, the performance is affected by a variable absorbing structure of the test chamber. The absorbing structure enables selective exposure of absorbing material to achieve a specific performance.
Semiconductor manufacturing method and apparatus thereof
The present disclosure provides a method for manufacturing a semiconductor structure. The method includes forming a photo-sensitive layer on a first surface of a semiconductor substrate. The photo-sensitive layer has a top surface. The method also includes obtaining a first profile of the first surface of the semiconductor substrate, and obtaining a second profile of the top surface of the photo-sensitive layer. The method also includes calculating a vertical displacement profile of the semiconductor substrate according to the first profile and the second profile. An apparatus for manufacturing a semiconductor structure is also disclosed.