Provided is a novel analysis method which, when a chemical sensor is used to perform a measurement, makes it possible to identify a sample without controlling or monitoring a change in the time the sample is introduced. According to the present invention, a sample can be identified without knowing a change in the time the sample is introduced, by using a chemical sensor having a plurality of channels each having different characteristics to perform a measurement, and performing an analysis on the basis of responses obtained from each channel.

Systems and methods for an inspection robot having replaceable sensor sled portions are disclosed. An example system may include: an inspection robot including a plurality of payloads; a plurality of arms, each of the plurality of arms pivotally mounted to one of the plurality of payloads; and a plurality of sleds, each sled mounted to one of the plurality of arms. At least one of the plurality of sleds includes an upper portion coupled to a replaceable lower portion, where the replaceable lower portion includes a portion of a delay line for a sensor of the inspection robot.

Systems and methods for an inspection robot having replaceable sensor sled portions are disclosed. An example system may include: an inspection robot including a plurality of payloads; a plurality of arms, each of the plurality of arms pivotally mounted to one of the plurality of payloads; and a plurality of sleds, each sled mounted to one of the plurality of arms. At least one of the plurality of sleds includes an upper portion coupled to a replaceable lower portion, where the replaceable lower portion includes a portion of a delay line for a sensor of the inspection robot.

Creation and use of a digital twin instance (DTI) for a physical instance of the part. The DTI may be created by a model inversion process such that model parameters are iterated until a convergence criterion related to a physical resonance inspection result and a digital resonance inspection result is satisfied. The DTI may then be used in relation to part evaluation including through simulated use of the part. The physical instance of the part may be evaluated by way of the DTI or the DTI may be used to generate maintenance schedules specific to the physical instance of the part.

Methods, systems, devices, and products for ultrasonic borehole logging using an ultrasonic borehole imaging tool in a borehole intersecting the earth formation. Methods may include adjusting a focus for an ultrasonic beam generated from a single-transducer ultrasonic assembly of the ultrasonic imaging tool; using a receiver to generate measurement information responsive to an ultrasonic signal caused by the ultrasonic beam; and estimating a parameter of interest from the measurement information. Methods may include adjusting the focus in dependence upon environmental conditions, the environmental conditions comprising at least one of: i) standoff between the ultrasonic imaging tool and a wall of the borehole; and ii) borehole annulus conditions. Methods may include adjusting the focus in substantially real-time. The ultrasonic beam may be focused with a focal zone at the borehole wall configured to produce a beam spot size of a selected diameter.

Methods, systems, devices, and products for ultrasonic borehole logging using an ultrasonic borehole imaging tool in a borehole intersecting the earth formation. Methods may include adjusting a focus for an ultrasonic beam generated from a single-transducer ultrasonic assembly of the ultrasonic imaging tool; using a receiver to generate measurement information responsive to an ultrasonic signal caused by the ultrasonic beam; and estimating a parameter of interest from the measurement information. Methods may include adjusting the focus in dependence upon environmental conditions, the environmental conditions comprising at least one of: i) standoff between the ultrasonic imaging tool and a wall of the borehole; and ii) borehole annulus conditions. Methods may include adjusting the focus in substantially real-time. The ultrasonic beam may be focused with a focal zone at the borehole wall configured to produce a beam spot size of a selected diameter.

The present disclosure provides an apparatus for manufacturing a semiconductor structure. The apparatus includes a stage, an optical transceiver over the stage, configured to obtain a first profile of a first surface of a substrate, an acoustic transceiver over the stage, configured to obtain a second profile of a top surface of a photo-sensitive layer over the substrate, wherein the stage is adapted to be displaced based on the first profile and the second profile.

At least one embodiment is directed to a method reducing the growth of a pathogen by targeting the pathogen by a vibrational wave at an integer fraction of its fundamental frequency, at low amplitudes so as to not harm healthy tissue, for a minimal exposure time determined by wave amplitude and damping.

A system includes an inspection robot having a plurality of acoustic sensors coupleable to an inspection surface through a couplant chamber defining a delay line therebetween; the plurality of acoustic sensors configured to provide raw acoustic data; a controller, comprising: an acoustic data circuit structured to interpret the raw acoustic data; a thickness processing circuit structured to determine a primary mode value and a primary mode score value in response to the raw acoustic data; and wherein the thickness processing circuit is further structured to determine a thickness value in response to the primary mode value and the primary mode score value.

A system includes an inspection robot having a plurality of acoustic sensors coupleable to an inspection surface through a couplant chamber defining a delay line therebetween; the plurality of acoustic sensors configured to provide raw acoustic data; a controller, comprising: an acoustic data circuit structured to interpret the raw acoustic data; a thickness processing circuit structured to determine a primary mode value and a primary mode score value in response to the raw acoustic data; and wherein the thickness processing circuit is further structured to determine a thickness value in response to the primary mode value and the primary mode score value.