A grid plate encoder based positioning system (1) for positioning of an element is provided, the positioning system (1) comprises a grid plate (2) with a grid plate surface (21); an encoder unit (3) with one or more optical sensors (31) for sensing a grid plate surface pattern (23) of the grid plate surface (21); an input (7) to receive coordinates (Xd, Yd) specifying a desired position of the element; a mapping unit (8) to compute compensated coordinate data (Xa, Ya) corresponding to estimated position data expected from the encoder unit (3) when the element is positioned at a desired position (Xd, Yd) specified by the setpoint coordinates; a feedback control unit (9) providing the compensated coordinate data (Xa, Ya) as a setpoint (Xs, Ys) to a positioning unit (12), with feedback control based on the estimated position data obtained from the encoder unit.

Additionally, a grid plate encoder based positioning method and a method for computing compensation data are provided.

A grid plate encoder based positioning system (1) for positioning of an element is provided, the positioning system (1) comprises a grid plate (2) with a grid plate surface (21); an encoder unit (3) with one or more optical sensors (31) for sensing a grid plate surface pattern (23) of the grid plate surface (21); an input (7) to receive coordinates (Xd, Yd) specifying a desired position of the element; a mapping unit (8) to compute compensated coordinate data (Xa, Ya) corresponding to estimated position data expected from the encoder unit (3) when the element is positioned at a desired position (Xd, Yd) specified by the setpoint coordinates; a feedback control unit (9) providing the compensated coordinate data (Xa, Ya) as a setpoint (Xs, Ys) to a positioning unit (12), with feedback control based on the estimated position data obtained from the encoder unit.

Additionally, a grid plate encoder based positioning method and a method for computing compensation data are provided.

A measurement system comprising: a radiation source arranged to generated a detection beam; a probe; and a probe positioning system arranged to move the probe from an un-aligned position in which it is not illuminated by the detection beam, to an aligned position in which it is illuminated by the detection beam and the detection beam is reflected by the probe to generate a reflected detection beam. A scanner generates a relative scanning motion between the probe and a sample, the sample being aligned with the probe and interacting with the probe during the relative scanning motion. A sensor detects the reflected detection beam during the relative scanning motion to collect a first data set from the sample. A second device is provided for modifying the sample or obtaining a second data set from the sample. A sample stage is arranged to move the sample in accordance with an offset vector stored in a memory so that it becomes un-aligned from the probe and aligned with the second device.

A measurement system comprising: a radiation source arranged to generated a detection beam; a probe; and a probe positioning system arranged to move the probe from an un-aligned position in which it is not illuminated by the detection beam, to an aligned position in which it is illuminated by the detection beam and the detection beam is reflected by the probe to generate a reflected detection beam. A scanner generates a relative scanning motion between the probe and a sample, the sample being aligned with the probe and interacting with the probe during the relative scanning motion. A sensor detects the reflected detection beam during the relative scanning motion to collect a first data set from the sample. A second device is provided for modifying the sample or obtaining a second data set from the sample. A sample stage is arranged to move the sample in accordance with an offset vector stored in a memory so that it becomes un-aligned from the probe and aligned with the second device.

A method for automatically calibrating a feedback system, comprising: receiving one or more input parameters associated with a feedback system; applying the one or more input parameters to a model of the feedback system; deriving one or more feedback parameters for the feedback system from the model by: optimizing the model for the feedback parameters, and applying a noise characteristic of the feedback system to the model; and automatically tuning the feedback system using the one or more derived feedback parameters.

A method of controlling a scanning electrochemical microscopy probe tip comprising the following steps: oscillating the scanning electrochemical microscopy probe tip relative to the surface of interest; moving the oscillating scanning electrochemical microscopy probe tip towards the surface of interest; detecting damping of an amplitude of the oscillation of the scanning electrochemical microscopy probe tip resulting from the scanning electrochemical microscopy probe tip coming into contact with the surface of interest at the first location; using the detected damping to detect the surface of interest; retracting the scanning electrochemical microscopy probe tip away from the surface of interest without first translating the scanning electrochemical microscopy probe tip along the surface of interest while the scanning electrochemical microscopy probe tip is in intermittent contact with the surface of interest. The method further comprises measuring electrochemical signals produced at the oscillating scanning electrochemical microscopy probe tip while moving the oscillating scanning electrochemical microscopy probe tip towards and/or away from the surface of interest.

An apparatus for mapping the topography of a sample, comprising a control electrode, an oscillator adapted to, provide an AC signal to the control electrode and the sample, a cantilever having a tip, wherein the cantilever is positioned between the control electrode and the sample, a deflection monitoring component, a controller connected to the deflection monitoring component, and a transducer, wherein the transducer raises or lowers the sample with respect to the cantilever until force balance is achieved.

A method of providing a bias for depletion while sensing the DC potential of buried lines comprises the steps of setting an oscillator frequency, and if tip-sample bias is needed, setting a DC source to set the tip-sample bias, and monitoring a ratio of gains of a first amplifier and a second amplifier wherein if the ratio has changed, adjusting the first amplifier to null the 2 signal.

Improvements for rapidly calibrating and automatically operating a scanning probe microscope are disclosed. A central component of the SPM is the force transducer, typically a consumable cantilever element. By automatically calibrating transducer characteristics along with other instrumental parameters, scanning parameters can be rapidly and easily optimized, resulting in high-throughput, repeatable and accurate measurements. In contrast to dynamic optimization schemes, this can be accomplished before the surface is contacted, avoiding tip or sample damage from the beginning of the measurement process.

Improvements for rapidly calibrating and automatically operating a scanning probe microscope are disclosed. A central component of the SPM is the force transducer, typically a consumable cantilever element. By automatically calibrating transducer characteristics along with other instrumental parameters, scanning parameters can be rapidly and easily optimized, resulting in high-throughput, repeatable and accurate measurements. In contrast to dynamic optimization schemes, this can be accomplished before the surface is contacted, avoiding tip or sample damage from the beginning of the measurement process.

A method of calibrating a contact probe having a contact element includes measuring with the contact probe a first geometric property of a calibrated artifact and a second geometric property of the or a further calibrated artifact. The first and second geometric properties are such that a deviation between a measured value and the expected value, resulting from a difference between an effective diameter of the contact element and an assumed diameter used for determining the measured value, has the opposite sign for each of the first and second geometric properties. The method further includes identifying a difference in the effective diameter of the contact element from the assumed diameter including comparing deviations of the measured value to the expected value for each of the first and second geometric properties to determine whether there is a difference in the deviations.