An abnormality detection device includes: a coupling-capacitor having a first-end and a second-end coupled with a high-voltage circuit; a signal output unit; a signal extraction unit; and a signal input unit. The signal output unit is coupled with the first-end of the coupling-capacitor via a detection-resistor, and outputs an alternating-current inspection-signal. The signal extraction unit extracts the inspection-signal, as an extraction-signal, output between the detection-resistor and the coupling-capacitor. The signal input unit detects abnormality of insulation resistance of the high-voltage circuit based on a level of the inputted extraction-signal. The signal extraction unit includes a signal removing filter and a subtraction circuit. The filter removes a signal equal in frequency to the inspection-signal and passes low-frequency noises lower in frequency than the inspection-signal. The subtraction circuit outputs a differential signal, as the extraction-signal, between a signal having passed through the filter and a signal not having passed through the filter.

A method for detecting the presence of an energized e-field in a space, wherein the space includes at least one electrically conductive element disposed in the space and coupled with a controller, the method including receiving in the controller a signal from the at least one electrically conductive element, determining that an energized e-field occupies the space, and generating an indication, by the controller, indicative of the presence of the energized e-field in the space.

A test assembly adapted to test a semiconductor device is provided. The test assembly includes a main circuit board, a space transformer, an intermediary supporting element, an adhesive element, a plurality of electrical connection elements and a plurality of test probes. The space transformer is disposed on the main circuit board and has a first surface and a second surface opposite to the first surface. The first surface faces the main circuit board. The intermediary supporting element is disposed between the main circuit board and the first surface. The adhesive element is disposed between the intermediary supporting element and the first surface. The space transformer is attached to the intermediary supporting element through the adhesive element. The electrical connection elements are disposed between the main circuit board and the first surface. Each of the electrical connection elements passes through the intermediary supporting element and the adhesive element such that the space transformer is electrically connected to the main circuit board through the electrical connection elements. The test probes are disposed on the second surface and electrically connected to the space transformer.

A test structure includes a dedicated addressing circuit that allows large numbers of test devices to be tested simultaneously and the measurement signals read out serially for different test devices. The test structure may be configured for wafer, die or package-level testing. The test structure may be integrated on a common die with the test devices in a single package, provided on separate die in a common package, separately packaged chips or in the form of a collection of standard die configured as the test structure. If on separate die, the test and addressing circuitry is fabricated from a more mature fabrication process than that being characterized for the devices under test. The processes being characterized may be unqualified whereas the test circuitry may be fabricated with different and more mature or qualified processes.

A device to test a contact of a connector includes a frame and a connector adaptor coupled to the frame. The connector adaptor is configured to retain the connector. The device also includes one or more alignment actuators coupled to the frame and a piston assembly movable relative to the connector by the one or more alignment actuators. The piston assembly is configured to apply a compressive force to the contact to test a locking mechanism of the contact.

A device to test a contact of a connector includes a frame and a connector adaptor coupled to the frame. The connector adaptor is configured to retain the connector. The device also includes one or more alignment actuators coupled to the frame and a piston assembly movable relative to the connector by the one or more alignment actuators. The piston assembly is configured to apply a compressive force to the contact to test a locking mechanism of the contact.

A proximity detector circuit that receives a single-ended sensor signal includes (a) an adaptive level control circuit maintaining the single-ended sensor signal within a predetermined voltage range relative a common mode reference signal; and (b) a programmable gain amplifier receiving the single-ended sensor signal and the common mode reference signal as a differential input signal, and providing an output signal derived from amplifying the differential input signal.

A method is used in a utility meter having an arm bit and a seal bit. The method includes changing a state of the arm bit to a first state in response to a first set of conditions. The method also includes removing electrical power from the meter. Upon subsequently applying electrical power to the meter, a first signal in a meter processing circuit indicates whether a meter cover is installed or the meter cover is removed. The processing circuit changes the seal bit to a first state responsive to a condition in which the arm bit is in the first state and the first signal indicates that the meter cover is installed. The processing circuit changes the seal bit to a second state responsive to a condition in which the seal bit is in the first state and the first signal indicates that the meter cover is removed.

A method of estimating electric motor speed. The method determines whether a sequential cycle of the electric motor has occurred. The method calculates a correction factor for each of the Hall states. Where a sequential cycle of the electric motor has occurred, the method also calculates an update quality factor for the correction factors of the sequential cycle. The method updates the correction factors utilizing the update quality factor. Utilizing the updated correction factors, the method updates the electric motor speed signal.

A probe device of a vertical probe card is provided and includes a die assembly and at least one pin assembly. The die assembly includes a first die, a second die, and a middle die disposed between the first die and the second die. The at least one pin assembly has a first pin, a second pin, and at least one electrical connector. The at least one electrical connector is connected to the first pin and the second pin. The at least one pin assembly is electrically contacted with at least one contact pad of a device under test. The at least one contact pad leans against the at least one pin assembly, so that the at least one pin assembly generates a deformation in a longitudinal direction.